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Qichao Hao
Qichao Hao
在 uqconnect.edu.au 的电子邮件经过验证
标题
引用次数
引用次数
年份
The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys
Q Hao, XF Tan, Q Gu, K Sweatman, SD McDonald, K Nogita
JOM 74 (4), 1739-1750, 2022
152022
The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys
XF Tan, Q Hao, Q Gu, SD McDonald, K Sweatman, M Bermingham, ...
Materials Characterization 201, 112934, 2023
92023
Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder
Q Hao, XF Tan, SD McDonald, K Sweatman, T Nishimura, T Nishimura, ...
2022 International Conference on Electronics Packaging (ICEP), 173-174, 2022
82022
The effect of strain rate on the ductility of bismuth-containing solders
K Sweatman, T Nishimura, S McDonald, X Ye, Q Hao, B Negura, XF Tan, ...
Proceedings of SMTA International 2022, 282-294, 2022
52022
The effect of temperature on the electrical resistivity of Sn-Bi alloys
XF Tan, Q Hao, J Zhou, SD McDonald, K Sweatman, K Nogita
Journal of Electronic Materials 53 (3), 1183-1191, 2024
42024
Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys
Q Hao, XF Tan, SD McDonald, K Sweatman, T Akaiwa, K Nogita
Journal of Electronic Materials 53 (3), 1223-1238, 2024
32024
In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys
XF Tan, Q Hao, J Zhou, Q Gu, SD McDonald, K Sweatman, M Ikeda, ...
Materialia 33, 101974, 2024
22024
The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn–Bi Alloys
Q Hao, X Tan, Q Gu, SD McDonald, K Nogita
Materials 17 (17), 4372, 2024
2024
Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys
XF Tan, Q Hao, J Zhou, SD McDonald, K Sweatman, K Nogita
2024 International Conference on Electronics Packaging (ICEP), 207-208, 2024
2024
In Situ Observation of the Ga-and Cu-Based Substrate Reaction by Synchrotron Microradiography
Q Hao, XF Tan, S Liu, SD McDonald, H Yasuda, K Nogita
ACS Applied Electronic Materials 5 (12), 7004-7014, 2023
2023
The use of variable temperature synchrotron XRD to characterise the behaviour of low temperature solder alloys
QC Hao, XF Tan, QF Gu, K Sweatman, SD McDonald, K Nogita
Australian Nuclear Science and Technology Organisation, 2021
2021
A Path to Ductile Low Temperature Solders for Mass Production of Electronic Assemblies?
K Sweatman, T Nishimura, XF Tan, Q Hao, SD McDonald, ...
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