The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys Q Hao, XF Tan, Q Gu, K Sweatman, SD McDonald, K Nogita JOM 74 (4), 1739-1750, 2022 | 15 | 2022 |
The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys XF Tan, Q Hao, Q Gu, SD McDonald, K Sweatman, M Bermingham, ... Materials Characterization 201, 112934, 2023 | 9 | 2023 |
Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder Q Hao, XF Tan, SD McDonald, K Sweatman, T Nishimura, T Nishimura, ... 2022 International Conference on Electronics Packaging (ICEP), 173-174, 2022 | 8 | 2022 |
The effect of strain rate on the ductility of bismuth-containing solders K Sweatman, T Nishimura, S McDonald, X Ye, Q Hao, B Negura, XF Tan, ... Proceedings of SMTA International 2022, 282-294, 2022 | 5 | 2022 |
The effect of temperature on the electrical resistivity of Sn-Bi alloys XF Tan, Q Hao, J Zhou, SD McDonald, K Sweatman, K Nogita Journal of Electronic Materials 53 (3), 1183-1191, 2024 | 4 | 2024 |
Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys Q Hao, XF Tan, SD McDonald, K Sweatman, T Akaiwa, K Nogita Journal of Electronic Materials 53 (3), 1223-1238, 2024 | 3 | 2024 |
In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys XF Tan, Q Hao, J Zhou, Q Gu, SD McDonald, K Sweatman, M Ikeda, ... Materialia 33, 101974, 2024 | 2 | 2024 |
The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn–Bi Alloys Q Hao, X Tan, Q Gu, SD McDonald, K Nogita Materials 17 (17), 4372, 2024 | | 2024 |
Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys XF Tan, Q Hao, J Zhou, SD McDonald, K Sweatman, K Nogita 2024 International Conference on Electronics Packaging (ICEP), 207-208, 2024 | | 2024 |
In Situ Observation of the Ga-and Cu-Based Substrate Reaction by Synchrotron Microradiography Q Hao, XF Tan, S Liu, SD McDonald, H Yasuda, K Nogita ACS Applied Electronic Materials 5 (12), 7004-7014, 2023 | | 2023 |
The use of variable temperature synchrotron XRD to characterise the behaviour of low temperature solder alloys QC Hao, XF Tan, QF Gu, K Sweatman, SD McDonald, K Nogita Australian Nuclear Science and Technology Organisation, 2021 | | 2021 |
A Path to Ductile Low Temperature Solders for Mass Production of Electronic Assemblies? K Sweatman, T Nishimura, XF Tan, Q Hao, SD McDonald, ... | | |