Parametric numerical study of flow and heat transfer in microchannels with wavy walls L Gong, K Kota, W Tao, Y Joshi | 242 | 2011 |
Numerical study and optimizing on micro square pin-fin heat sink for electronic cooling J Zhao, S Huang, L Gong, Z Huang Applied Thermal Engineering 93, 1347-1359, 2016 | 219 | 2016 |
Numerical study on layout of micro-channel heat sink for thermal management of electronic devices L Gong, J Zhao, S Huang Applied Thermal Engineering 88, 480-490, 2015 | 124 | 2015 |
Parametric numerical study of the flow and heat transfer in microchannel with dimples M Xu, H Lu, L Gong, JC Chai, X Duan International Communications in Heat and Mass Transfer 76, 348-357, 2016 | 120 | 2016 |
Influence of wall roughness models on fluid flow and heat transfer in microchannels L Guo, H Xu, L Gong Applied Thermal Engineering 84, 399-408, 2015 | 96 | 2015 |
Flow and heat transfer characteristics of nanofluid flowing through metal foams H Xu, L Gong, S Huang, M Xu International Journal of Heat and Mass Transfer 83, 399-407, 2015 | 94 | 2015 |
Thermal performance of micro-channel heat sink with metallic porous/solid compound fin design L Gong, Y Li, Z Bai, M Xu Applied Thermal Engineering 137, 288-295, 2018 | 91 | 2018 |
Investigation of a solar-biomass gasification system with the production of methanol and electricity: Thermodynamic, economic and off-design operation Z Bai, Q Liu, L Gong, J Lei Applied energy 243, 91-101, 2019 | 90 | 2019 |
Numerical analysis of hydrogen production via methane steam reforming in porous media solar thermochemical reactor using concentrated solar irradiation as heat source F Wang, J Tan, Y Shuai, L Gong, H Tan Energy Conversion and Management 87, 956-964, 2014 | 90 | 2014 |
A novel thermal management scheme for 3D-IC chips with multi-cores and high power density B Ding, ZH Zhang, L Gong, MH Xu, ZQ Huang Applied Thermal Engineering 168, 114832, 2020 | 84 | 2020 |
Analytical considerations of local thermal non-equilibrium conditions for thermal transport in metal foams HJ Xu, L Gong, CY Zhao, YH Yang, ZG Xu International Journal of Thermal Sciences 95, 73-87, 2015 | 82 | 2015 |
Thermal performance of microchannels with wavy walls for electronics cooling L Gong, K Kota, W Tao, Y Joshi Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011 | 81 | 2011 |
Numerical simulations of proppant deposition and transport characteristics in hydraulic fractures and fracture networks X Wang, J Yao, L Gong, H Sun, Y Yang, L Zhang, Y Li, W Liu Journal of Petroleum Science and Engineering 183, 106401, 2019 | 66 | 2019 |
Non-equilibrium heat transfer in metal-foam solar collector with no-slip boundary condition H Xu, L Gong, S Huang, M Xu International Journal of Heat and Mass Transfer 76, 357-365, 2014 | 62 | 2014 |
Effects of surface roughness in microchannel with passive heat transfer enhancement structures H Lu, M Xu, L Gong, X Duan, JC Chai International Journal of Heat and Mass Transfer 148, 119070, 2020 | 56 | 2020 |
Hydraulic and thermal performances of metal foam and pin fin hybrid heat sink Y Li, L Gong, M Xu, Y Joshi Applied Thermal Engineering 166, 114665, 2020 | 55 | 2020 |
Application of a mid-/low-temperature solar thermochemical technology in the distributed energy system with cooling, heating and power production Z Bai, Q Liu, L Gong, J Lei Applied Energy 253, 113491, 2019 | 48 | 2019 |
Thermal management and structural parameters optimization of MCM-BGA 3D package model L Gong, YP Xu, B Ding, ZH Zhang, ZQ Huang International Journal of Thermal Sciences 147, 106120, 2020 | 47 | 2020 |
Enhancing the performance of aluminum foam heat sinks through integrated pin fins Y Li, L Gong, M Xu, Y Joshi International Journal of Heat and Mass Transfer 151, 119376, 2020 | 46 | 2020 |
Thermal management of power electronics with liquid cooled metal foam heat sink Y Li, L Gong, B Ding, M Xu, Y Joshi International Journal of Thermal Sciences 163, 106796, 2021 | 44 | 2021 |