关注
Sagarika Mukesh
Sagarika Mukesh
在 ibm.com 的电子邮件经过验证
标题
引用次数
引用次数
年份
A Review of the Gate-All-Around Nanosheet FET Process Opportunities
S Mukesh, J Zhang
Electronics 11 (21), 3589, 2022
342022
Critical elements for next generation high performance computing nanosheet technology
R Bao, C Durfee, J Zhang, L Qin, J Rozen, H Zhou, J Li, S Mukesh, ...
2021 IEEE International Electron Devices Meeting (IEDM), 26.3. 1-26.3. 4, 2021
142021
Modeling intracochlear magnetic stimulation: a Finite-Element Analysis
S Mukesh, DT Blake, BJ McKinnon, PT Bhatti
IEEE Transactions on Neural Systems and Rehabilitation Engineering 25 (8 …, 2016
92016
Qiskit Metal: An Open-Source Framework for Quantum Device Design & Analysis
ZK Minev, TG McConkey, J Drysdale, P Shah, D Wang, M Facchini, ...
10.5281/zenodo.4618154, 2021
82021
Magnetic stimulation of dissociated cortical neurons on a planar mulitelectrode array
S Mukesh, R Zeller-Townson, RJ Butera, PT Bhatti
2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), 758-761, 2019
42019
A multiscale simulation study of the structural integrity of damascene interconnects in advanced technology nodes
S Mukesh, NA Lanzillo
IEEE Transactions on Electron Devices 70 (4), 1977-1982, 2023
32023
Selective patterning of vias with hardmasks
JC Arnold, A Dutta, D Metzler, TM Philip, S Mukesh
US Patent 11,276,607, 2022
32022
Topological qubit device
SJ Holmes, TM Philip, S Mukesh, Y Kim, DK Sadana, R Robison
US Patent 11,380,836, 2022
22022
Finite Element Analysis and Experimental Evaluation of Magnetic Stimulation of Neurons Using Microscale Coils Toward an Improved Cochlear Implant
S Mukesh
Georgia Institute of Technology, PhD Dissertation, 2018
22018
Co-integrated logic, electrostatic discharge, and well contact devices on a substrate
J Frougier, S Mukesh, AI Chou, AM Greene, R Xie, VS Basker, J Wang, ...
US Patent 11,894,361, 2024
12024
Conformal dielectric cap for subtractive vias
S Mukesh, NA Lanzillo, R Robison, R Bao, A Rahman
US Patent App. 17/563,607, 2023
12023
Backside power rails and power distribution network for density scaling
R Xie, K Choi, S Ghosh, S Mukesh, A Chu, AM Young, ...
US Patent App. 17/562,331, 2023
12023
Multilayer dielectric stack for damascene top-via integration
S Mukesh, DS Grant, FL Lie, SK Matham, H Shobha, G Karve
US Patent App. 17/445,698, 2023
12023
Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects
K Motoyama, N Lanzillo, S Mukesh, B Peethala, T Spooner, D Edelstein, ...
2022 IEEE International Interconnect Technology Conference (IITC), 55-57, 2022
12022
Structural stability of tight-pitched damascene interconnects
S Mukesh, NA Lanzillo, K Motayama, T Spooner
2020 IEEE International Interconnect Technology Conference (IITC), 160-162, 2020
12020
System and Method for Intracochlear and Vestibular Magnetic Stimulation
S Mukesh, P Bhatti, D Blake, B McKinnon
US Patent App. 15/854,873, 2018
12018
NANOSHEET DEVICE WITH NITRIDE ISOLATION STRUCTURES
S Mukesh, A Reznicek, T Kang
US Patent App. 18/147,525, 2024
2024
Stress modulating pattern containing bonding dielectric layer
FL Lie, H Shobha, M Rizzolo, A Jain, S Mukesh, CJ Waskiewicz
US Patent App. 18/083,994, 2024
2024
Transistors with dielectric stack isolating backside power rail
T Li, S Mukesh, J Frougier, NJ Loubet, R Xie
US Patent App. 18/080,828, 2024
2024
Nanosheet metal-insulator-metal capacitor
R Xie, J Frougier, A Reznicek, S Mukesh
US Patent App. 18/061,701, 2024
2024
系统目前无法执行此操作,请稍后再试。
文章 1–20