| Cu pumping in TSVs: Effect of pre-CMP thermal budget I De Wolf, K Croes, OV Pedreira, R Labie, A Redolfi, M Van De Peer, ... Microelectronics Reliability 51 (9-11), 1856-1859, 2011 | 139 | 2011 |
| Atomic layer deposition of ruthenium with TiN interface for sub-10 nm advanced interconnects beyond copper LG Wen, P Roussel, OV Pedreira, B Briggs, B Groven, S Dutta, ... ACS applied materials & interfaces 8 (39), 26119-26125, 2016 | 112 | 2016 |
| Ruthenium metallization for advanced interconnects LG Wen, C Adelmann, OV Pedreira, S Dutta, M Popovici, B Briggs, ... 2016 ieee international interconnect technology conference/advanced …, 2016 | 76 | 2016 |
| Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects OV Pedreira, K Croes, A Leśniewska, C Wu, MH Van Der Veen, ... 2017 IEEE international reliability physics symposium (irps), 6B-2.1-6B-2.8, 2017 | 72 | 2017 |
| Interconnect metals beyond copper: Reliability challenges and opportunities K Croes, C Adelmann, CJ Wilson, H Zahedmanesh, OV Pedreira, C Wu, ... 2018 IEEE International Electron Devices Meeting (IEDM), 5.3. 1-5.3. 4, 2018 | 69 | 2018 |
| Impact of post-plating anneal and through-silicon via dimensions on Cu pumping J De Messemaeker, OV Pedreira, B Vandevelde, H Philipsen, I De Wolf, ... 2013 IEEE 63rd electronic components and technology conference, 586-591, 2013 | 63 | 2013 |
| High-aspect-ratio ruthenium lines for buried power rail A Gupta, S Kundu, L Teugels, J Bommels, C Adelmann, N Heylen, ... 2018 IEEE International Interconnect Technology Conference (IITC), 4-6, 2018 | 60 | 2018 |
| Damascene benchmark of Ru, Co and Cu in scaled dimensions MH van der Veen, N Heyler, OV Pedreira, I Ciofi, S Decoster, ... 2018 IEEE International Interconnect Technology Conference (IITC), 172-174, 2018 | 59 | 2018 |
| Correlation between Cu microstructure and TSV Cu pumping J De Messemaeker, OV Pedreira, H Philipsen, E Beyne, I De Wolf, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 613-619, 2014 | 57 | 2014 |
| Highly reliable CMOS-integrated 11MPixel SiGe-based micro-mirror arrays for high-end industrial applications L Haspeslagh, J De Coster, OV Pedreira, I De Wolf, B Du Bois, A Verbist, ... 2008 IEEE International Electron Devices Meeting, 1-4, 2008 | 39 | 2008 |
| Reliability Challenges Related to TSV Integration and 3-D Stacking. K Croes, J De Messemaeker, Y Li, W Guo, OV Pedreira, V Cherman, ... IEEE Des. Test 33 (3), 37-45, 2016 | 38 | 2016 |
| 11-megapixel CMOS-integrated SiGe micromirror arrays for high-end applications A Witvrouw, L Haspeslagh, OV Pedreira, J De Coster, I De Wolf, ... Journal of microelectromechanical systems 19 (1), 202-214, 2009 | 35 | 2009 |
| Buried power rail integration with FinFETs for ultimate CMOS scaling A Gupta, OV Pedreira, G Arutchelvan, H Zahedmanesh, K Devriendt, ... IEEE Transactions on Electron Devices 67 (12), 5349-5354, 2020 | 32 | 2020 |
| Copper electromigration; prediction of scaling limits H Zahedmanesh, OV Pedreira, C Wilson, Z Tőkei, K Croes Proceedings of IEEE International Interconnect Technology Conference (IITC), 3-5, 2019 | 29 | 2019 |
| Electromigration activation energies in alternative metal interconnects S Beyne, OV Pedreira, H Oprins, I De Wolf, Z Tőkei, K Croes IEEE Transactions on Electron Devices 66 (12), 5278-5283, 2019 | 26 | 2019 |
| Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model H Zahedmanesh, O Varela Pedreira, Z Tőkei, K Croes Journal of Applied Physics 126 (5), 2019 | 26 | 2019 |
| Electromigration and thermal storage study of barrierless Co vias OV Pedreira, K Croes, H Zahedmanesh, K Vandersmissen, ... 2018 IEEE International Interconnect Technology Conference (IITC), 48-50, 2018 | 23 | 2018 |
| Semidamascene Interconnects for 2nm node and Beyond G Murdoch, Z Tokei, S Paolillo, OV Pedreira, K Vanstreels, CJ Wilson 2020 IEEE International Interconnect Technology Conference (IITC), 4-6, 2020 | 22 | 2020 |
| Barrier/liner stacks for scaling the Cu interconnect metallization MH van der Veen, N Jourdan, VV Gonzalez, CJ Wilson, N Heylen, ... 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 20 | 2016 |
| CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device S Severi, J Heck, TKA Chou, N Belov, JS Park, D Harrar, A Jain, ... TRANSDUCERS 2009-2009 International Solid-State Sensors, Actuators and …, 2009 | 20 | 2009 |
