Modeling and testing the mechanical strength of solar cells F Kaule, W Wang, S Schoenfelder Solar energy materials and solar cells 120, 441-447, 2014 | 74 | 2014 |
High quality half-cell processing using thermal laser separation S Eiternick, F Kaule, HU Zühlke, T Kießling, M Grimm, S Schoenfelder, ... Energy Procedia 77, 340-345, 2015 | 50 | 2015 |
Mechanical damage of half-cell cutting technologies in solar cells and module laminates F Kaule, M Pander, M Turek, M Grimm, E Hofmueller, S Schoenfelder AIP Conference Proceedings 1999 (1), 2018 | 41 | 2018 |
Laser-assisted spalling of large-area semiconductor and solid state substrates F Kaule, M Swoboda, C Beyer, R Rieske, A Ajaj, WD Drescher, ... MRS Communications 8 (1), 127-131, 2018 | 19 | 2018 |
Improved mechanical strength and reflectance of diamond wire sawn multi-crystalline silicon wafers by inductively coupled plasma (ICP) etching F Kaule, B Köhler, J Hirsch, S Schoenfelder, D Lausch Solar Energy Materials and Solar Cells 185, 511-516, 2018 | 13 | 2018 |
Thermal laser separation (TLS) dicing process study–A new technology for cutting silicon solar cells for high-efficiency half-cell modules J Röth, N Bernhard, C Belgardt, M Grimm, F Kaule 31st European Photovoltaic Solar Energy Conference and Exhibition. Hamburg …, 2015 | 12 | 2015 |
Breakage root cause analysis in as-cut monocrystalline silicon wafers C Klute, F Kaule, S Schoenfelder 29th European Photovoltaic Solar Energy Conference and Exhibition, 2014 | 7 | 2014 |
Half-cell solar modules: The new standard in PV production? J Schneider, H Hanifi, D Dassler, M Pander, F Kaule, M Turek Photovolt. Int 42, 2019 | 5 | 2019 |
Benchmarking mechanical strength data for new solar cell concepts F Kaule, S Meyer, S Schoenfelder 33rd European Photovoltaic Solar Energy Conference and Exhibition, 276-279, 2017 | 5 | 2017 |
Thermal laser separation-damage-free and kerfless cutting of wafers and solar cells M Koitzsch, D Lewke, F Kaule, M Oswald, S Schoenfelder, M Turek, ... International Workshop on Crystalline Silicon Solar Cells, 111-115, 2012 | 5 | 2012 |
Influence of microcracks on strength of diamond wire sawn silicon substrates F Wallburg, K Meyer, M Budnitzki, M Kuna, F Kaule, S Schoenfelder Proceedings of the 8th International Conference on Fracture, Fatigue and …, 2021 | 4 | 2021 |
Variation of silicon wafer strength and edge chipping induced by residual stresses at the brick bonding interface R Koepge, K Buehler, A Langhans, F Kaule, E Velispahic Proceedings of the 36th European Photovoltaic Solar Energy Conference, 2019 | 4 | 2019 |
Numerical flow simulation on the virus spread of SARS-CoV-2 due to airborne transmission in a classroom L Moeller, F Wallburg, F Kaule, S Schoenfelder International Journal of Environmental Research and Public Health 19 (10), 6279, 2022 | 3 | 2022 |
Damage and breakage of silicon wafers during impact loading on the wafer Edge F Kaule, R Koepge, S Schoenfelder Proc. 27th Eur. Photovolt. Sol. Energy Conf. Exhib., 1179-1184, 2012 | 3 | 2012 |
Analysis of structured wire wafering processes to predict optimized process settings by varying particle size and wire diameter R Koepge, K Buehler, F Kaule, J Zeh, S Schoenfelder, O Anspach AIP Conference Proceedings 1999 (1), 2018 | 2 | 2018 |
Advanced Analysis of Multi Wire Wafering Processes R Koepge, S Brinnig, F Kaule, H Schwabe, S Schoenfelder 2017 IEEE 44th Photovoltaic Specialist Conference (PVSC), 2622-2626, 2017 | 1 | 2017 |
MECHANICAL STRENGTH OF MC-SILICON WAFERS CONSIDERING MICROSTRUCTURAL DEFECTS S Schoenfelder, F Wallburg, F Kaule | | 2015 |
Strength of thin silicon wafers with via holes S Schoenfelder, F Kaule, M Oswald, J Bagdahn, M Petzold | | 2012 |
Page 30 News Page 33 Product Reviews F Kaule, M Oswald, R Koepge, CK Stephan THE TECHNOLOGY RESOURCE FOR PV PROFESSIONALS, 29, 0 | | |
BREAKAGE AND STRENGTH OF MWT WAFERS AND SOLAR CELLS S Schoenfelder, M Oswald, F Kaule | | |