| Molten Salt Promoting Effect in Double Salt CO2 Absorbents K Zhang, XS Li, H Chen, P Singh, DL King The Journal of Physical Chemistry C 120 (2), 1089-1096, 2016 | 79 | 2016 |
| A Combined Experimental and Molecular Dynamics Study of Iodide-Based Ionic Liquid and Water Mixtures Stella D. Nickerson, Elizabeth M. Nofen, Haobo Chen, Miranda Ngan, Benjamin ... J. Phys. Chem. B. 119 (28), 8764-8772, 2015 | 46 | 2015 |
| Adsorption and release of surfactant into and from multifunctional zwitterionic poly (NIPAm-co-DMAPMA-co-AAc) microgel particles H Chen, M Kelley, C Guo, JL Yarger, LL Dai Journal of colloid and interface science 449, 332-340, 2015 | 17 | 2015 |
| Adsorption and release of active species into and from multifunctional ionic microgel particles H Chen, LL Dai Langmuir 29 (36), 11227-11235, 2013 | 12 | 2013 |
| Colloidal lattices of environmentally responsive microgel particles at ionic liquid–water interfaces H Chen, EM Nofen, K Rykaczewski, LL Dai Journal of colloid and interface science 504, 440-447, 2017 | 10 | 2017 |
| Microelectronic structures including bridges B Nie, KK Darmawikarta, SV Pietambaram, C Haobo, G Duan, JM Gamba, ... US Patent App. 16/902,959, 2021 | 6 | 2021 |
| Lithographically defined vertical interconnect access (via) for a bridge die first level interconnect (fli) K Darmawikarta, T Ibrahim, S Alur, R Jain, C Haobo US Patent App. 16/455,688, 2020 | 4 | 2020 |
| Position controlled waveguides and methods of manufacturing the same J Ecton, L Arana, W Bryks, C Haobo, B Duong, C Liu, B Marin, ... US Patent App. 17/483,565, 2023 | 3 | 2023 |
| Embedded bridge architecture with thinned surface C Haobo, X Guo, H Feng, K Darmawikarta, B Nie, TA Ibrahim, G Duan, ... US Patent App. 17/213,147, 2022 | 3 | 2022 |
| Patternable die attach materials and processes for patterning B Nie, G Duan, S Pietambaram, J Jones, Y Kanaoka, H Feng, D Xu, ... US Patent 11,923,312, 2024 | 1 | 2024 |
| Methods and apparatus to adhere a dielectric to a nonconductive layer in circuit devices K Darmawikarta, S Pietambaram, B Duong, C Haobo US Patent App. 17/855,298, 2024 | 1 | 2024 |
| Microelectronic assemblies with silicon nitride multilayer KK Darmawikarta, SV Pietambaram, B Nie, C Haobo, JM Gamba US Patent App. 17/555,401, 2023 | 1 | 2023 |
| No-remelt solder enforcement joint B Shan, C Haobo, O Karhade, M Sankarasubramanian, D Xu, G Duan, ... US Patent App. 17/517,152, 2023 | 1 | 2023 |
| Embedded patch for local material property modulation B Nie, C Haobo, G Duan, BC Marin, S Pietambaram US Patent App. 16/522,483, 2021 | 1 | 2021 |
| Air-gap traces and air-gap embedded bridge integrated in glass interposer H Tanaka, V Strong, H Braunisch, C Haobo, JD Ecton, K Darmawikarta, ... US Patent App. 18/130,582, 2024 | | 2024 |
| 2d fillers for reduced cte for pid K Arrington, C Arrington, B Shan, C Haobo, SV Pietambaram, G Duan, ... US Patent App. 18/128,848, 2024 | | 2024 |
| Methods, systems, apparatus, and articles of manufacture to improve reliability of vias in a glass substrate of an integrated circuit package K Arrington, B Shan, C Haobo, B Nie, S Pietambaram, G Duan, LIN Ziyin, ... US Patent App. 18/182,879, 2024 | | 2024 |
| Methods and apparatus to reduce variation in height of bumps after reflow RJ Carrazzone, A Arrington, C Haobo, H Feng, CKY Mau, KM McElhinny, ... US Patent App. 18/620,569, 2024 | | 2024 |
| Apparatus and method for attaching an optical component using no remelt metallurgy B Shan, C Haobo, SVR Pietambaram, B Nie, G Duan, KJ Arrington, ... US Patent App. 18/091,543, 2024 | | 2024 |
| Methods and apparatus to reduce solder bump bridging between two substrates B Shan, J Wu, C Haobo, S Pietambaram, B Nie, G Duan, K Arrington, ... US Patent App. 18/148,148, 2024 | | 2024 |
