| A computing-in-memory macro based on three-dimensional resistive random-access memory Q Huo, Y Yang, Y Wang, D Lei, X Fu, Q Ren, X Xu, Q Luo, G Xing, C Chen, ... Nature Electronics 5 (7), 469-477, 2022 | 68 | 2022 |
| Degradation behavior and mechanisms of E-mode GaN HEMTs with p-GaN gate under reverse electrostatic discharge stress YQ Chen, JT Feng, JL Wang, XB Xu, ZY He, GY Li, DY Lei, Y Chen, ... IEEE Transactions on Electron Devices 67 (2), 566-570, 2020 | 36 | 2020 |
| An online monitoring scheme of output capacitor's equivalent series resistance for buck converters without current sensors X Duan, J Zou, B Li, Z Wu, D Lei IEEE Transactions on Industrial Electronics 68 (10), 10107-10117, 2020 | 21 | 2020 |
| Demonstration of 3D convolution kernel function based on 8-layer 3D vertical resistive random access memory Q Huo, R Song, D Lei, Q Luo, Z Wu, Z Wu, X Zhao, F Zhang, L Li, M Liu IEEE Electron Device Letters 41 (3), 497-500, 2020 | 19 | 2020 |
| A machine-learning-resistant 3D PUF with 8-layer stacking vertical RRAM and 0.014% bit error rate using in-cell stabilization scheme for IoT security applications J Yang, D Lei, D Chen, J Li, H Jiang, Q Ding, Q Luo, X Xue, H Lv, X Zeng, ... 2020 IEEE International Electron Devices Meeting (IEDM), 28.6. 1-28.6. 4, 2020 | 13 | 2020 |
| Effect of Moisture Stress on the Resistance of HfO2/TaOx-Based 8-Layer 3D Vertical Resistive Random Access Memory R Gao, D Lei, Z He, Y Chen, Y Huang, Y En, X Xu, F Zhang IEEE Electron Device Letters 41 (1), 38-41, 2019 | 12 | 2019 |
| Failure mechanisms and package reliability issues in optocouplers H Wu, S He, X Chen, G Xu, D Lei 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 8 | 2016 |
| Failure analysis and case study of plastic encapsulated microelectronics H Wu, L Liu, X Chen, X Kuang, D Lei 2014 10th International Conference on Reliability, Maintainability and …, 2014 | 7 | 2014 |
| Effective PPS signal generation with predictive synchronous loop for GPS Y Zhang, W Lu, D Lei, Y Huang, D Yu IEICE Transactions on Communications 97 (8), 1742-1749, 2014 | 7 | 2014 |
| Layer‐dependent resistance variability assessment on 2048 8‐layer 3D vertical RRAMs R Gao, D Lei, Z He, Y En, Y Huang Electronics Letters 55 (17), 955-957, 2019 | 6 | 2019 |
| Efficient weak signals acquisition strategy for GNSS receivers W Lu, Y Zhang, D Lei, D Yu IEICE Transactions on Communications 99 (1), 288-295, 2016 | 6 | 2016 |
| Resource-efficient acquisition architecture for BOC-modulated signals D Lei, W Lu, D Yu IEICE Electronics Express 11 (11), 20140358-20140358, 2014 | 6 | 2014 |
| A homogeneous, reconfigurable, and efficient implementation of PUF in 3-D selector-free RRAM Y Wang, Q Huo, X Xu, F Tan, R Gao, Q Luo, Y Yang, Q Ren, X Zhao, ... IEEE Transactions on Electron Devices 68 (5), 2577-2581, 2021 | 5 | 2021 |
| Investigation on reliability and failure analysis of plastic encapsulated microelectronics H Wu, S He, L Liu, X Kuang, D Lei, H Li 2014 15th International Conference on Electronic Packaging Technology, 1169-1172, 2014 | 5 | 2014 |
| A 144-fJ/bit reliable and compact TRNG based on the diffusive resistance of 3-D resistive random access memory X Li, Y Wang, Y Yang, S Lv, Q Luo, X Wang, X Xu, D Lei, F Zhang IEEE Transactions on Electron Devices, 2023 | 4 | 2023 |
| A fast and test-proven methodology of assessing RTN/fluctuation on deeply scaled nano pMOSFETs R Gao, M Mehedi, H Chen, X Wang, JF Zhang, XL Lin, ZY He, YQ Chen, ... 2020 IEEE International Reliability Physics Symposium (IRPS), 1-5, 2020 | 4 | 2020 |
| A novel RFID authentication protocol based on reconfigurable RRAM PUF Q Ren, X Fu, H Wu, K Yang, D Lei, G Xing, F Zhang Micromachines 12 (12), 1560, 2021 | 3 | 2021 |
| Balance differential coherent bit synchronization algorithm for GNSS receiver D Lei, W Lu, Y Zhang, D Yu IEICE Transactions on Communications 98 (6), 1133-1140, 2015 | 3 | 2015 |
| Compact modeling of metal–oxide TFTs based on the Bayesian search-based artificial neural network and genetic algorithm HM Xie, DY Lei, ZC Zhang, YQ Chen, ZH He, Y Liu AIP Advances 13 (8), 2023 | 2 | 2023 |
| Study of silver alloy wire decapsulation methods for failure analysis H Wu, Y Liang, W Du, S He, Y Wang, D Lei 2017 IEEE 24th International Symposium on the Physical and Failure Analysis …, 2017 | 2 | 2017 |
