关注
KiHo BAE
KiHo BAE
Ph.D, Seoul National University
在 samsung.com 的电子邮件经过验证
标题
引用次数
引用次数
年份
Semiconductor device having a conductive structure including oxide and non oxide portions
SH Choi, K Bae, Y Hong, K Kim, T Kim, KT Nam, JH Jeong
US Patent 8,575,753, 2013
682013
Study on effect of complexing agents on Co oxidation/dissolution for chemical-mechanical polishing and cleaning process
O Kwon, KH Bae, J Byun, T Lim, JJ Kim
Microelectronic Engineering 227, 111308, 2020
362020
The effect of TAD based cleaning solution on post Cu CMP process
SW Lee, KH Bae, OJ Kwon, JJ Kim
Microelectronic Engineering 162, 17-22, 2016
222016
Non-volatile memory device including etch stop layer pattern
J Lim, K Bae, HJ Kim, K Kim, C Seo, Y Pyon
US Patent 8,912,592, 2014
212014
Highly selective chemical mechanical polishing of Si3N4 over SiO2 using advanced silica abrasive
KH Bae, KH Baek, JS Kim, H Kim, BU Yoon, JJ Kim
Japanese Journal of Applied Physics 56 (5), 056501, 2017
112017
Effect of complexing agents on surface composition for co post-CMP cleaning process
J Byun, KH Bae, O Kwon, KK Myong, T Lim, JJ Kim
ECS Journal of Solid State Science and Technology 10 (2), 024011, 2021
72021
Methods of manufacturing semiconductor devices
KH Bae, J Kim, H Kim, B Yoon, K Lee, K Kim, P Eunji
US Patent 9,997,412, 2018
42018
Method of fabricating integrated circuit semiconductor device having gate metal silicide layer
K Bae, KB Kim, CK Seong, I Hwang, KJ Park, K Kim
US Patent App. 12/453,866, 2010
42010
Origins of wear-induced tungsten corrosion defects in semiconductor manufacturing during tungsten chemical mechanical polishing
SH Choi, ME Kreider, AC Nielander, MB Stevens, G Kamat, JE Koo, ...
Applied Surface Science 598, 153767, 2022
32022
Restricted hydrolysis reaction of Si3N4 via nonionic polymer adsorption in advanced shallow trench isolation chemical mechanical planarization
K Bae, K Lee
Colloids and Surfaces A: Physicochemical and Engineering Aspects 681, 132716, 2024
22024
Chemical mechanical polishing machine and polishing head assembly
IK Kim, K Kim, KJ Park, K Bae, J Lim
US Patent 9,254,546, 2016
12016
Recovery and reuse of magnetic silica-coated iron oxide particles for eco-friendly chemical mechanical planarization
J Seo, JU Hur, S Kim, YS Kim, YH Kim, K Bae, K Lee, GS An
Colloids and Surfaces A: Physicochemical and Engineering Aspects 694, 134064, 2024
2024
Semiconductor devices
S Choi, I Yoon, I Park, BAE Kiho, B Yoon, LEE Yooyong
US Patent 11,757,015, 2023
2023
Chemical mechanical polishing machine and polishing head assembly
IK Kim, K Kim, KJ Park, K Bae, J Lim
US Patent 10,195,715, 2019
2019
Investigation of the Slurry for Poly Si Stopping CMP Process
Y Pyon, C Seong, J Lim, K Bae, K Park, K Kim, Y Shin
ECS Meeting Abstracts, 2507, 2012
2012
Dual Wettability Membrane of CMP Head for Stable Wafer Unloading
系统目前无法执行此操作,请稍后再试。
文章 1–16