Semiconductor device having a conductive structure including oxide and non oxide portions SH Choi, K Bae, Y Hong, K Kim, T Kim, KT Nam, JH Jeong US Patent 8,575,753, 2013 | 68 | 2013 |
Study on effect of complexing agents on Co oxidation/dissolution for chemical-mechanical polishing and cleaning process O Kwon, KH Bae, J Byun, T Lim, JJ Kim Microelectronic Engineering 227, 111308, 2020 | 36 | 2020 |
The effect of TAD based cleaning solution on post Cu CMP process SW Lee, KH Bae, OJ Kwon, JJ Kim Microelectronic Engineering 162, 17-22, 2016 | 22 | 2016 |
Non-volatile memory device including etch stop layer pattern J Lim, K Bae, HJ Kim, K Kim, C Seo, Y Pyon US Patent 8,912,592, 2014 | 21 | 2014 |
Highly selective chemical mechanical polishing of Si3N4 over SiO2 using advanced silica abrasive KH Bae, KH Baek, JS Kim, H Kim, BU Yoon, JJ Kim Japanese Journal of Applied Physics 56 (5), 056501, 2017 | 11 | 2017 |
Effect of complexing agents on surface composition for co post-CMP cleaning process J Byun, KH Bae, O Kwon, KK Myong, T Lim, JJ Kim ECS Journal of Solid State Science and Technology 10 (2), 024011, 2021 | 7 | 2021 |
Methods of manufacturing semiconductor devices KH Bae, J Kim, H Kim, B Yoon, K Lee, K Kim, P Eunji US Patent 9,997,412, 2018 | 4 | 2018 |
Method of fabricating integrated circuit semiconductor device having gate metal silicide layer K Bae, KB Kim, CK Seong, I Hwang, KJ Park, K Kim US Patent App. 12/453,866, 2010 | 4 | 2010 |
Origins of wear-induced tungsten corrosion defects in semiconductor manufacturing during tungsten chemical mechanical polishing SH Choi, ME Kreider, AC Nielander, MB Stevens, G Kamat, JE Koo, ... Applied Surface Science 598, 153767, 2022 | 3 | 2022 |
Restricted hydrolysis reaction of Si3N4 via nonionic polymer adsorption in advanced shallow trench isolation chemical mechanical planarization K Bae, K Lee Colloids and Surfaces A: Physicochemical and Engineering Aspects 681, 132716, 2024 | 2 | 2024 |
Chemical mechanical polishing machine and polishing head assembly IK Kim, K Kim, KJ Park, K Bae, J Lim US Patent 9,254,546, 2016 | 1 | 2016 |
Recovery and reuse of magnetic silica-coated iron oxide particles for eco-friendly chemical mechanical planarization J Seo, JU Hur, S Kim, YS Kim, YH Kim, K Bae, K Lee, GS An Colloids and Surfaces A: Physicochemical and Engineering Aspects 694, 134064, 2024 | | 2024 |
Semiconductor devices S Choi, I Yoon, I Park, BAE Kiho, B Yoon, LEE Yooyong US Patent 11,757,015, 2023 | | 2023 |
Chemical mechanical polishing machine and polishing head assembly IK Kim, K Kim, KJ Park, K Bae, J Lim US Patent 10,195,715, 2019 | | 2019 |
Investigation of the Slurry for Poly Si Stopping CMP Process Y Pyon, C Seong, J Lim, K Bae, K Park, K Kim, Y Shin ECS Meeting Abstracts, 2507, 2012 | | 2012 |
Dual Wettability Membrane of CMP Head for Stable Wafer Unloading | | |