| Thermal shock and drop test performance of lead-free assemblies with no-underfill, corner-underfill and full-underfill BV Chheda, SM Ramkumar, R Ghaffarian 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 29 | 2010 |
| Lead-free 0201 manufacturing, assembly and reliability test results SM Ramkumar, R Ghaffarian, A Varanasi Microelectronics Reliability 46 (2-4), 244-262, 2006 | 27 | 2006 |
| A novel anisotropic conductive adhesive for lead-free surface mount electronics packaging SM Ramkumar, K Srihari | 20 | 2007 |
| Novel anisotropic conductive adhesive for 3D stacking and lead-free PCB packaging—a review SM Ramkumar, H Venugopalan, K Khanna 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 246-254, 2011 | 13 | 2011 |
| Effect of nano-coated stencil on 01005 printing R Mohanty, SM Ramkumar, C Anglin, T Oda, B Mark IPC APEX EXPO Technical Conference, 1727-1736, 2011 | 11 | 2011 |
| Development of next generation stretchable materials for flexible hybrid electronics (FHE) SM Ramkumar, A Stemmermann, BM Rajan, I Quelhas, M Alhendi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 829-834, 2020 | 10 | 2020 |
| Influence of PCB surface finish and thermal and temperature/humidity aging on the performance of a novel anisotropic conductive adhesive for lead-free surface mount assembly SM Ramkumar, K Srihari 2007 Proceedings 57th Electronic Components and Technology Conference, 65-73, 2007 | 10 | 2007 |
| Collaboration trend in speech, language and hearing sciences: A scientometric study based on select journals S Ramkumar, N Narayanasamy, RP Nageswara Intl. J. Educ. Multidiscip. Stud 3 (3), 2455-2526, 2016 | 9 | 2016 |
| Influence of reflow profile and Pb-free solder paste in minimizing voids for quad flat pack no-lead (QFN) assembly H Gadepalli, R Dhanasekaran, SM Ramkumar, T Jensen, E Briggs 2009 59th Electronic Components and Technology Conference, 2016-2024, 2009 | 8 | 2009 |
| Forward and backward compatibility of solder alloys with component and board finishes A Kannabiran, ET Pannerselvam, SM Ramkumar IEEE transactions on electronics packaging manufacturing 30 (2), 138-146, 2007 | 8 | 2007 |
| Investigation of the performance of SAC and SACBi lead-free solder alloys with OSP and immersion silver PCB finish M Sampathkumar, S Rajesnayagham, SM Ramkumar, SJ Anson Proceedings of SMTA International, 25-29, 2005 | 8 | 2005 |
| Lead-free 0201 assembly and reliability SM Ramkumar, R Newasekar, R Ghaffarian Proceedings. International Symposium on Advanced Packaging Materials …, 2005 | 8 | 2005 |
| Faculty research productivity: Perspective from human and social capital S Ramkumar Amity Journal of Management Research 3 (1), 81-94, 2018 | 7 | 2018 |
| Research Productivity through the Lens of Doctoral Guidance: A Study of Sanskrit Universities in India. S Ramkumar J. Sci. Res. 9 (1), 19-28, 2020 | 6 | 2020 |
| Investigation of the forward and backward compatibility of solder alloys with component finishes for HASL and OSP PCB finish A Kannabiran, ET Pannerselvam, SM Ramkumar SMTA International Conference Proceedings, 566-570, 2006 | 6 | 2006 |
| Thermal Shock and Drop Test Performance of Lead-Free Assemblies With No-Underfill and Corner-Underfill B Chheda, SM Ramkumar, R Ghaffarian Proceedings of SMTAI, 48-54, 2009 | 5 | 2009 |
| Influence of process parameters on component assembly and drop test performance using a novel anisotropic conductive adhesive for lead-free surface mount assembly SM Ramkumar, K Srihari 2008 58th Electronic Components and Technology Conference, 225-233, 2008 | 5 | 2008 |
| Modeling and experimental verification of the contact resistance of a novel anisotropic conductive adhesive SM Ramkumar, K Srihari ASME International Mechanical Engineering Congress and Exposition 42991, 149-157, 2007 | 5 | 2007 |
| Thermal cycle/aging reliability of lead free 0201 assemblies R Ghaffarian, SM Ramkumar, A Varanasi 56th Electronic Components and Technology Conference 2006, 17 pp., 2006 | 5 | 2006 |
| A Feasibility Study For The Implementation Of Non Site Based Hands On Curriculum For Engineering Technology Education I Edinbarough, M Ramkumar 2001 Annual Conference, 6.29. 1-6.29. 14, 2001 | 5 | 2001 |
