| Three-dimensional bicontinuous nanoporous materials by vapor phase dealloying Z Lu, C Li, J Han, F Zhang, P Liu, H Wang, Z Wang, C Cheng, L Chen, ... Nature communications 9 (1), 276, 2018 | 157 | 2018 |
| Correlation between chemical dopants and topological defects in catalytically active nanoporous graphene Y Ito, Y Shen, D Hojo, Y Itagaki, T Fujita, L Chen, T Aida, Z Tang, ... Advanced Materials 28 (48), 10644-10651, 2016 | 121 | 2016 |
| Cooperation between holey graphene and NiMo alloy for hydrogen evolution in an acidic electrolyte Y Ito, T Ohto, D Hojo, M Wakisaka, Y Nagata, L Chen, K Hu, M Izumi, ... ACS Catalysis 8 (4), 3579-3586, 2018 | 108 | 2018 |
| Heavily Doped and Highly Conductive Hierarchical Nanoporous Graphene for Electrochemical Hydrogen Production L Chen, J Han, Y Ito, T Fujita, G Huang, K Hu, A Hirata, K Watanabe, ... Angewandte Chemie International Edition 57 (40), 13302-13307, 2018 | 76 | 2018 |
| Graphene Layer Encapsulation of Non-Noble Metal Nanoparticles as Acid-Stable Hydrogen Evolution Catalysts K Hu, T Ohto, L Chen, J Han, M Wakisaka, Y Nagata, J Fujita, Y Ito ACS Energy Letters 3 (7), 1539–1544, 2018 | 64 | 2018 |
| NiAl as a potential material for liner-and barrier-free interconnect in ultrasmall technology node L Chen, D Ando, Y Sutou, D Gall, J Koike Applied Physics Letters 113 (18), 2018 | 46 | 2018 |
| CuAl2 thin films as a low-resistivity interconnect material for advanced semiconductor devices L Chen, D Ando, Y Sutou, J Koike Journal of Vacuum Science & Technology B 37 (3), 2019 | 33 | 2019 |
| Interdiffusion reliability and resistivity scaling of intermetallic compounds as advanced interconnect materials L Chen, S Kumar, M Yahagi, D Ando, Y Sutou, D Gall, R Sundararaman, ... Journal of Applied Physics 129 (3), 2021 | 32 | 2021 |
| Liner-and barrier-free NiAl metallization: A perspective from TDDB reliability and interface status L Chen, D Ando, Y Sutou, S Yokogawa, J Koike Applied Surface Science 497, 143810, 2019 | 18 | 2019 |
| Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges L Chen, Q Chen, D Ando, Y Sutou, M Kubo, J Koike Applied Surface Science 537, 148035, 2020 | 16 | 2020 |
| Intermetallic Compounds For Interconnect Metal Beyond 3 nm Node J Koike, T Kuge, L Chen, M Yahagi 2021 IEEE International Interconnect Technology Conference (IITC), 1-3, 2021 | 5 | 2021 |
| Possibility of Cu2Mg for Liner-Barrier Free Interconnects L Chen, D Ando, Y Sutou, M Yahagi, J Koike 2020 IEEE International Interconnect Technology Conference (IITC), 85-87, 2020 | 3 | 2020 |
| Possibility of intermetallic compounds for ultra-small scale interconnections J Koike, L Chen, S Yokogawa IEICE Technical Report; IEICE Tech. Rep. 119 (410), 25-25, 2020 | | 2020 |
| 招待講演 NiAl as Cu alternative for ultrasmall feature sizes (シリコン材料・デバイス) L Chen, J Koike, D Ando, Y Sutou 電子情報通信学会技術研究報告= IEICE technical report: 信学技報 119 (239), 29-33, 2019 | | 2019 |
| NiAl as Cu alternative for ultrasmall feature sizes L Chen, J Koike, D Ando, Y Sutou IEICE Technical Report; IEICE Tech. Rep. 119 (239), 29-33, 2019 | | 2019 |
