| Oxide‐mediated formation of chemically stable tungsten–liquid metal mixtures for enhanced thermal interfaces W Kong, Z Wang, M Wang, KC Manning, A Uppal, MD Green, RY Wang, ... Advanced Materials 31 (44), 1904309, 2019 | 126 | 2019 |
| Inhibition of condensation frosting by arrays of hygroscopic antifreeze drops X Sun, VG Damle, A Uppal, R Linder, S Chandrashekar, AR Mohan, ... Langmuir 31 (51), 13743-13752, 2015 | 56 | 2015 |
| High thermal conductivity in multiphase liquid metal and silicon carbide soft composites W Kong, Z Wang, N Casey, MM Korah, A Uppal, MD Green, ... Advanced Materials Interfaces 8 (14), 2100069, 2021 | 42 | 2021 |
| Pressure-activated thermal transport via oxide shell rupture in liquid metal capsule beds A Uppal, M Ralphs, W Kong, M Hart, K Rykaczewski, RY Wang ACS applied materials & interfaces 12 (2), 2625-2633, 2019 | 30 | 2019 |
| Enhancing thermal transport in silicone composites via bridging liquid metal fillers with reactive metal co-fillers and matrix viscosity tuning A Uppal, W Kong, A Rana, RY Wang, K Rykaczewski ACS Applied Materials & Interfaces 13 (36), 43348-43355, 2021 | 25 | 2021 |
| Rapid and scalable lubrication and replenishment of liquid-infused materials VG Damle, A Uppal, X Sun, TP Burgin, K Rykaczewski Surface Innovations 4 (2), 102-108, 2016 | 19 | 2016 |
| Interposer package-on-package (PoP) with solder array thermal contacts D Mallik, S Ganesan, LIU Pilin, S Liff, SC Chavali, S Gaan, J Yao, A Uppal US Patent 11,387,175, 2022 | 6 | 2022 |
| Fabrication of Multiphase Liquid Metal Composites Containing Gas and Solid Fillers: From Pastes to Foams S Kanetkar, NUH Shah, RM Gandhi, A Uppal, MD Dickey, RY Wang, ... ACS Applied Engineering Materials 1 (6), 1504-1513, 2023 | 5 | 2023 |
| Substrate cooling using heat pipe vapor chamber stiffener and ihs legs A Uppal, M Divya, JY Chang US Patent App. 16/794,747, 2021 | 4 | 2021 |
| Heat dissipation device having shielding/containment extensions A Uppal, JY Chang, R Mahajan US Patent 12,048,123, 2024 | 3 | 2024 |
| Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies A Uppal, JY Chang, W Tang, M Ha US Patent 11,664,294, 2023 | 3 | 2023 |
| Precuring Matrix Viscosity Controls Thermal Conductivity of Elastomeric Composites with Compression‐Activated Liquid and Solid Metallic Filler Networks A Uppal, W Kong, A Rana, JS Lee, MD Green, K Rykaczewski, RY Wang Advanced Materials Interfaces 10 (9), 2201875, 2023 | 3 | 2023 |
| Coupled cooling fins in ultra-small systems A Uppal, O Karhade, R Viswanath, JY Chang, W Tang, N Deshpande, ... US Patent 11,574,851, 2023 | 3 | 2023 |
| Mechanism of Oil-in-Liquid Metal Emulsion Formation NUH Shah, S Kanetkar, A Uppal, MD Dickey, RY Wang, K Rykaczewski Langmuir 38 (43), 13279-13287, 2022 | 3 | 2022 |
| Heat dissipation devices having thermal interface material containment structures A Uppal, JY Chang US Patent App. 16/789,322, 2021 | 3 | 2021 |
| Ic die package thermal spreader and emi shield comprising graphite D Mallik, M Modi, S Ganesan, E Cetegen, O Karhade, R Mahajan, ... US Patent App. 16/287,665, 2020 | 3 | 2020 |
| Thermal management solutions for integrated circuit assemblies using phase change materials A Uppal, JY Chang, J Shaikh, M Divya, W Tang US Patent App. 16/241,108, 2020 | 3 | 2020 |
| Cold Spray: A Disruptive Technology for Enabling Novel Packaging Thermomechanical Solutions F Eid, A Uppal, J Swan 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1109-1114, 2021 | 2 | 2021 |
| Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms A Uppal, J Peterson, JY Chang, X Guo, F Liang, W Tang Journal of Electronic Packaging 141 (1), 010803, 2019 | 2 | 2019 |
| Particle-assisted formation of oil-in-liquid metal emulsions S Kanetkar, NUH Shah, F Krisnadi, A Uppal, RM Gandhi, MD Dickey, ... Journal of Physics: Condensed Matter 36 (42), 425104, 2024 | | 2024 |
