Metal‐assisted chemical etching of silicon: a review: in memory of Prof. Ulrich Gösele Z Huang, N Geyer, P Werner, J De Boor, U Gösele Advanced materials 23 (2), 285-308, 2011 | 2237 | 2011 |
Measuring thermoelectric transport properties of materials KA Borup, J De Boor, H Wang, F Drymiotis, F Gascoin, X Shi, L Chen, ... Energy & Environmental Science 8 (2), 423-435, 2015 | 382 | 2015 |
Device‐quality electrically conducting melanin thin films JP Bothma, J De Boor, U Divakar, PE Schwenn, P Meredith Advanced Materials 20 (18), 3539-3542, 2008 | 236 | 2008 |
Model for the mass transport during metal-assisted chemical etching with contiguous metal films as catalysts N Geyer, B Fuhrmann, Z Huang, J de Boor, HS Leipner, P Werner The journal of physical chemistry C 116 (24), 13446-13451, 2012 | 182 | 2012 |
Data analysis for Seebeck coefficient measurements J de Boor, E Mueller Review of scientific instruments 84 (6), 2013 | 169 | 2013 |
Sub-100 nm silicon nanowires by laser interference lithography and metal-assisted etching J De Boor, N Geyer, JV Wittemann, U Gösele, V Schmidt Nanotechnology 21 (9), 095302, 2010 | 141 | 2010 |
High-temperature measurement of Seebeck coefficient and electrical conductivity J de Boor, C Stiewe, P Ziolkowski, T Dasgupta, G Karpinski, E Lenz, ... Journal of electronic materials 42, 1711-1718, 2013 | 119 | 2013 |
Three-beam interference lithography: upgrading a Lloyd's interferometer for single-exposure hexagonal patterning J de Boor, N Geyer, U Gösele, V Schmidt Optics letters 34 (12), 1783-1785, 2009 | 112 | 2009 |
Microstructural effects on thermoelectric efficiency: A case study on magnesium silicide J De Boor, T Dasgupta, H Kolb, C Compere, K Kelm, E Mueller Acta Materialia 77, 68-75, 2014 | 109 | 2014 |
Recent progress in p-type thermoelectric magnesium silicide based solid solutions J de Boor, T Dasgupta, U Saparamadu, E Müller, ZF Ren Materials today energy 4, 105-121, 2017 | 93 | 2017 |
Sub-20 nm Si/Ge superlattice nanowires by metal-assisted etching N Geyer, Z Huang, B Fuhrmann, S Grimm, M Reiche, TK Nguyen-Duc, ... Nano letters 9 (9), 3106-3110, 2009 | 90 | 2009 |
Analyzing transport properties of p-type Mg 2 Si–Mg 2 Sn solid solutions: optimization of thermoelectric performance and insight into the electronic band structure H Kamila, P Sahu, A Sankhla, M Yasseri, HN Pham, T Dasgupta, ... Journal of Materials Chemistry A 7 (3), 1045-1054, 2019 | 87 | 2019 |
Fabrication and characterization of nickel contacts for magnesium silicide based thermoelectric generators J de Boor, C Gloanec, H Kolb, R Sottong, P Ziolkowski, E Müller Journal of Alloys and Compounds 632, 348-353, 2015 | 85 | 2015 |
Second‐Order Optical Nonlinearity in Silicon Waveguides: Inhomogeneous Stress and Interfaces C Schriever, F Bianco, M Cazzanelli, M Ghulinyan, C Eisenschmidt, ... Advanced Optical Materials 3 (1), 129-136, 2015 | 82 | 2015 |
Thermoelectric properties of porous silicon J De Boor, DS Kim, X Ao, M Becker, NF Hinsche, I Mertig, P Zahn, ... Applied Physics A 107, 789-794, 2012 | 81 | 2012 |
Sub-50 nm patterning by immersion interference lithography using a Littrow prism as a Lloyd’s interferometer J de Boor, DS Kim, V Schmidt Optics letters 35 (20), 3450-3452, 2010 | 76 | 2010 |
Ag-assisted CBE growth of ordered InSb nanowire arrays AT Vogel, J de Boor, M Becker, JV Wittemann, SL Mensah, P Werner, ... Nanotechnology 22 (1), 015605, 2010 | 74 | 2010 |
Thermoelectric performance of Li doped, p-type Mg2 (Ge, Sn) and comparison with Mg2 (Si, Sn) J De Boor, U Saparamadu, J Mao, K Dahal, E Müller, Z Ren Acta Materialia 120, 273-280, 2016 | 67 | 2016 |
Temperature and structure size dependence of the thermal conductivity of porous silicon J De Boor, DS Kim, X Ao, D Hagen, A Cojocaru, H Föll, V Schmidt Europhysics Letters 96 (1), 16001, 2011 | 67 | 2011 |
Mechanical Alloying of Optimized Mg2(Si,Sn) Solid Solutions: Understanding Phase Evolution and Tuning Synthesis Parameters for Thermoelectric Applications A Sankhla, A Patil, H Kamila, M Yasseri, N Farahi, E Mueller, J de Boor ACS Applied Energy Materials 1 (2), 531-542, 2018 | 66 | 2018 |