| Atomic layer etching of 3D structures in silicon: Self-limiting and nonideal reactions CM Huard, Y Zhang, S Sriraman, A Paterson, KJ Kanarik, MJ Kushner Journal of Vacuum Science & Technology A: Vacuum, Surfaces and Films 35 (3 …, 2017 | 88 | 2017 |
| Investigation of feature orientation and consequences of ion tilting during plasma etching with a three-dimensional feature profile simulator Y Zhang, C Huard, S Sriraman, J Belen, A Paterson, M Kushner Journal of Vacuum Science & Technology A 35 (2), 021303, 2016 | 69 | 2016 |
| Role of neutral transport in aspect ratio dependent plasma etching of three-dimensional features CM Huard, Y Zhang, S Sriraman, A Paterson, MJ Kushner Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 35 (5 …, 2017 | 66 | 2017 |
| Control of ion energy distributions using phase shifting in multi-frequency capacitively coupled plasmas Y Zhang, A Zafar, DJ Coumou, SC Shannon, MJ Kushner Journal of Applied Physics 117 (23), 2015 | 61 | 2015 |
| Control of ion energy and angular distributions in dual-frequency capacitively coupled plasmas through power ratios and phase: Consequences on etch profiles Y Zhang, MJ Kushner, S Sriraman, A Marakhtanov, J Holland, A Paterson Journal of Vacuum Science & Technology A 33 (3), 031302, 2015 | 53 | 2015 |
| Atomic layer etching in continuous plasma Z Tan, Y Zhang, Y Wu, Q Xu, Q Fu, Y Yamaguchi, L Cui US Patent 9,991,128, 2018 | 29 | 2018 |
| Space and phase resolved ion energy and angular distributions in single-and dual-frequency capacitively coupled plasmas Y Zhang, MJ Kushner, N Moore, P Pribyl, W Gekelman Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 31 (6 …, 2013 | 25 | 2013 |
| 2-dimensional ion velocity distributions measured by laser-induced fluorescence above a radio-frequency biased silicon wafer NB Moore, W Gekelman, P Pribyl, Y Zhang, MJ Kushner Physics of Plasmas 20 (8), 2013 | 8 | 2013 |
| Control of on-wafer cd uniformity with movable edge ring and gas injection adjustment Y Zhang, S Sriraman, A Paterson US Patent App. US20180053629A1, 2018 | | 2018 |
| Line edge roughness improvement with sidewall sputtering Z Tan, H Xiang, Y Zhang, Q Fu, Q Xu US Patent 9,852,924, 2017 | | 2017 |
| Near-Substrate Supplemental Plasma Density Generation with Low Bias Voltage within Inductively Coupled Plasma Processing Chamber Z Tan, Y Zhang, Q Fu, Q Xu, Y Wu, S Sriraman, A Paterson US Patent App. US20180204708A1, 2017 | | 2017 |
| Multi-Zone Cooling Of Plasma Heated Window Y Zhang, R Marsh, S Sriraman, A Paterson US Patent App. US20190148118A1, 2017 | | 2017 |
