| Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center V Shalom Simon, H Modi, KB Sivaraju, P Bansode, S Saini, P Shahi, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 18 | 2022 |
| Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level H Modi, P Shahi, A Sivakumar, S Saini, P Bansode, V Shalom, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 13 | 2022 |
| Computational Study of Air-Cooled Servers with Improved Ducting and Chassis Re-design H Modi PQDT-UK & Ireland, 2020 | 13 | 2020 |
| A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads A Heydari, P Shahi, V Radmard, B Eslami, U Chowdhury, C Hinge, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 11* | 2022 |
| CFD analysis of Heat capture ratio in a hybrid cooled server V Shalom Simon, LS Reddy, P Shahi, A Valli, S Saini, H Modi, P Bansode, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 10 | 2022 |
| Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server H Modi, P Shahi, LSR Chinthaparthy, G Gupta, P Bansode, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 9 | 2022 |
| CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server P Murthy, G Gupta, J Herring, J Lamotte-Dawaghreh, KB Sivaraju, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 9 | 2022 |
| Impact of Improved Ducting and Chassis Re-design for Air-Cooled Servers in a Data Center H Modi, U Chowdhury, D Agonafer 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 7 | 2022 |
| Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers P Shahi, A Heydari, B Eslami, V Radmard, C Hinge, H Modi, ... Journal of Electronic Packaging 146 (4), 2024 | 1 | 2024 |
| Study on the Characterization of Filters for a Direct-to-Chip Liquid Cooling System P Shahi, A Heydari, H Modi, LSR Chinthaparthy, A Barigala, Q Soud, ... 2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2024 | 1 | 2024 |
| A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling S Saini, G Gupta, P Bansode, P Shahi, VS Simon, H Modi, D Agonafer, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 1 | 2023 |
| Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core P Bansode, MS Ramalingam, R Suthar, R Bhandari, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 1 | 2023 |
| Experimental and CFD Analysis of a Rack Manifold for High Power Density Liquid-Cooled Rack P Shahi, A Heydari, P Bansode, A Siddarth, U Chowdhury, H Miyamura, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 1 | 2023 |
| Experimental Study of Improved Chassis and Duct Redesign for Air-Cooled Server H Modi, P Shahi, VS Simon, LSR Chintaparthy, G Gupta, A Sivakumar, ... 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 1 | 2023 |
| Accelerated Degradation Of Copper Cold Plates In Direct-to-Chip Liquid Cooling in Data Centers. LSAIR CHINTHAPARTHY, S SAINI, P SHAHI, PV BANSODE, HG MODI, ... ASHRAE Journal 66 (2), 2024 | | 2024 |
| A Path to Commissioning of Direct-to-Chip Liquid Cooling for Hyperscale Data Centers using Experimental and CFD Techniques HG Modi | | 2024 |
| A METHODOLOGY FOR THERMAL CHARACTERIZATION OF HIGH-POWER LIQUID-COOLED SERVERS P Shahi, A Heydari, S Saini, P Bansode, U Chowdhury, H Miyamura, ... Heat Transfer Research 55, 2024 | | 2024 |
| Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems P Shahi, A Heydari, C Hinge, LSR Chinthaparthy, H Modi, H Miyamura, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
| Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server VS Simon, BR Mandadi, P Shahi, H Modi, PV Bansode, D Agonafer International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
| A Transient CFD Study on Implementation of Dynamic Liquid Cooling for Series and Parallel Arrangement of Components in a Server at Rack Level H Modi, P Shahi, V Shalom, LSR Chintaparthy, D Agonafer 2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2023 | | 2023 |
Pardeep ShahiSenior Mechanical Engineer NVIDIA在 mavs.uta.edu 的电子邮件经过验证
