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Daniel Franz
Daniel Franz
University of Applied Sciences Aschaffenburg
在 th-ab.de 的电子邮件经过验证
标题
引用次数
引用次数
年份
Ultrashort pulsed laser drilling of printed circuit board materials
D Franz, T Häfner, T Kunz, GL Roth, S Rung, C Esen, R Hellmann
Materials 15 (11), 3932, 2022
152022
Characterization of a hybrid scanning system comprising acousto-optical deflectors and galvanometer scanners
D Franz, T Häfner, T Kunz, GL Roth, S Rung, C Esen, R Hellmann
Applied Physics B 128 (3), 55, 2022
122022
Photoengraved printed data carrier
C Baldus, D Franz, A Preidt, T Rebele
US Patent 7,618,066, 2009
92009
Picosecond laser microvia drilling of ABF material using MHz burst mode
D Franz, T Häfner, K Bischoff, J Helm, T Kunz, S Rung, C Esen, ...
Materials Research Express 10 (9), 096301, 2023
32023
Evaluation of an ultrashort pulsed laser robot system for flexible and large-area micromachining
D Franz, Y Yang, L Michel, C Esen, R Hellmann
Journal of Laser Applications 35 (4), 2023
12023
Superimposed beam deflection using acousto-optical deflectors in combination with a galvanometer scanner
D Franz, GL Roth, S Rung, C Esen, R Hellmann
Lasers in Manufacturing-LiM 2021, 2021
12021
Development and comparison of algorithms for beam stabilization in ultrashort pulsed laser equipped on a six-axis robot
Y Yang, D Franz, C Esen, R Hellmann
Journal of Laser Applications 35 (4), 2023
2023
UV picosecond laser drilling of ABF film material for printed circuit boards using laser burst mode and beam shaping
D Franz, D Mücke, T Kunz, S Rung, C Esen, R Hellmann
International Congress on Applications of Lasers & Electro-Optics (ICALEO) 2023, 2023
2023
Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials. Materials 2022, 15, 3932
D Franz, T Häfner, T Kunz, GL Roth, S Rung, C Esen, R Hellmann
s Note: MDPI stays neutral with regard to jurisdictional claims in published …, 2022
2022
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