| A 14 nm embedded stt-mram cmos technology D Edelstein, M Rizzolo, D Sil, A Dutta, J DeBrosse, M Wordeman, A Arceo, ... 2020 IEEE International Electron Devices Meeting (IEDM), 11.5. 1-11.5. 4, 2020 | 57 | 2020 |
| Overlay target and measurement method using reference and sub-grids CP Ausschnitt, JD Morillo US Patent 6,937,337, 2005 | 51 | 2005 |
| Multi-layer alignment and overlay target and measurement method CP Ausschnitt, LA Binns, JD Morillo, NP Smith US Patent 7,474,401, 2009 | 43 | 2009 |
| Overlay target and measurement method using reference and sub-grids CP Ausschnitt, JD Morillo US Patent 7,626,702, 2009 | 41 | 2009 |
| New paradigm in lens metrology for lithographic scanner: evaluation and exploration K Lai, GM Gallatin, MA van de Kerkhof, W de Boeij, H Kok, M Schriever, ... Optical Microlithography XVII 5377, 160-171, 2004 | 40 | 2004 |
| Young’s modulus of amorphous Terfenol‐D thin films Q Su, J Morillo, Y Wen, M Wuttig Journal of applied physics 80 (6), 3604-3606, 1996 | 27 | 1996 |
| Blossom overlay metrology implementation CP Ausschnitt, W Chu, D Kolor, J Morillo, JL Morningstar, W Muth, ... Metrology, Inspection, and Process Control for Microlithography XXI 6518 …, 2007 | 22 | 2007 |
| Edge and bevel automated defect inspection for 300mm production wafers in manufacturing JD Morillo, T Houghton, JM Bauer, R Smith, R Shay IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing …, 2005 | 20 | 2005 |
| Micromachined silicon torsional resonator for magnetic anisotropy measurement J Morillo, Q Su, B Panchapakesan, M Wuttig, D Novotny Review of scientific instruments 69 (11), 3908-3912, 1998 | 20 | 1998 |
| Target and method for mask-to-wafer CD, pattern placement and overlay measurement and control CP Ausschnitt, JD Morillo, JH Rankin, RJ Yerdon US Patent 9,097,989, 2015 | 16 | 2015 |
| Overlay target and measurement method using reference and sub-grids CP Ausschnitt, JD Morillo US Patent 7,359,054, 2008 | 13 | 2008 |
| Design technology co-optimization assessment for directed self-assembly-based lithography: design for directed self-assembly or directed self-assembly for design? K Lai, CC Liu, H Tsai, Y Xu, C Chi, A Raghunathan, P Dhagat, L Hu, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 16 (1), 013502-013502, 2017 | 12 | 2017 |
| Multilayer alignment and overlay target and measurement method CP Ausschnitt, LA Binns, JD Morillo, NP Smith US Patent 8,339,605, 2012 | 12 | 2012 |
| Simultaneous critical dimension and overlay measurements on a SEM through target design for inline manufacturing lithography control EP Solecky, JD Morillo Metrology, Inspection, and Process Control for Microlithography XVIII 5375 …, 2004 | 8 | 2004 |
| Fabrication of lithographic image fields using a proximity stitch metrology CP Ausschnitt, JD Morillo, RJ Yerdon US Patent 9,087,740, 2015 | 7 | 2015 |
| Multi layer alignment and overlay target and measurement method CP Ausschnitt, LA Binns, JD Morillo, NP Smith US Patent 8,107,079, 2012 | 7 | 2012 |
| Combined level-to-level and within-level overlay control CP Ausschnitt, JD Morillo, RJ Yerdon Metrology, Inspection, and Process Control for Microlithography XVI 4689 …, 2002 | 7 | 2002 |
| Magnetic phase transition of stage-2 -graphite intercalation compounds M Suzuki, IS Suzuki, MD Johnson, J Morillo, CR Burr Physical Review B 50 (1), 205, 1994 | 6 | 1994 |
| Multi layer alignment and overlay target and measurement method CP Ausschnitt, LA Binns, JD Morillo, NP Smith US Patent 7,876,439, 2011 | 5 | 2011 |
| Effect of high NA “half-field” printing on overlay error AH Gabor, M Burkhardt, R Lallement, J Morillo, C Robinson, D Schmidt Extreme Ultraviolet (EUV) Lithography XII 11609, 12-21, 2021 | 3 | 2021 |
