| LEDs Lifetime Prediction Modeling: Thermomechanical Simulation for SAC305 and SAC105 MZ Akhtar, M Schmid, A Zippelius, G Elger 2024 25th International Conference on Thermal, Mechanical and Multi-Physics …, 2024 | 3 | 2024 |
| Fully Connected Neural Network (FCNN) Based Validation Framework for FEA Post Processing to Improve SAC Solder Reliability Analysis MZ Akhtar, C Kreiner, M Schmid, A Zippelius, U Tetzlaff, G Elger 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1-8, 2024 | 1 | 2024 |
| Solder joint lifetime model using AI framework operating on FEA data MZ Akhtar, M Schmid, A Zippelius, G Elger Engineering Failure Analysis 167, 109032, 2025 | | 2025 |
| Using µ-RAMAN Spectroscopy to Inspect Sintered Interconnects E Liu, MZ Akhtar, F Steinberger, B Wunderle, G Elger 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1-9, 2024 | | 2024 |
| AI-based crack prediction of solder joints using FEA simulation and SAM data MZ Akhtar Technische Hochschule Ingolstadt, 2023 | | 2023 |
