| Large scale integration of functional radio‐frequency flexible MEMS under large mechanical strain E Azrak, L Michaud, J Richy, A Reinhardt, S Tardif, J Eymery, M Bousquet, ... Advanced Functional Materials 33 (4), 2205404, 2023 | 7 | 2023 |
| Elaboration and characterization of a 200 mm stretchable and flexible ultra-thin semi-conductor film LG Michaud, C Castan, M Zussy, P Montméat, VH Mareau, L Gonon, ... Nanotechnology 31 (14), 145302, 2020 | 6 | 2020 |
| Flexible piezoelectric transducers based on a PMMA/ZnO nanowire composite R Tao, G Ardila, M Parmar, L Michaud, M Mouis 2017 Joint International EUROSOI Workshop and International Conference on …, 2017 | 5 | 2017 |
| Transfer of an ultrathin single-crystal silicon film from a silicon-on-insulator to a polymer LG Michaud, E Azrak, C Castan, F Fournel, F Rieutord, S Tardif, ... Materials Today Nano 13, 100107, 2021 | 4 | 2021 |
| Stress Engineering in Germanium-Silicon Heterostructure Using Surface Activated Hot Bonding Q Lomonaco, K Abadie, C Morales, LG Michaud, J Richy, S Moreau, ... ECS Transactions 109 (4), 277, 2022 | 3 | 2022 |
| Aluminium-nitride thin-films on polymer substrates obtained by adhesive bonding E Azrak, LG Michaud, A Reinhardt, S Tardif, M Bousquet, N Vaxelaire, ... ECS Journal of Solid State Science and Technology 10 (6), 064001, 2021 | 3 | 2021 |
| Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion LG Michaud, F Fournel, C Morales, M Schmidbauer, K Abadie, T Plach, ... ECS Transactions 112 (3), 23, 2023 | 2 | 2023 |
| Edge Bonding Voids Management Using Humid Helium Bonding Atmosphere F Fournel, V Larrey, C Morales, LG Michaud ECS Transactions 112 (3), 15, 2023 | 1 | 2023 |
| Surface Activated Cu/SiO2 Hybrid Bonding for Room Temperature 3D Integration K Abadie, P Renaud, F Fournel, LG Michaud, M Danner, M Dornetshumer, ... 2024 8th International Workshop on Low Temperature Bonding for 3D …, 2024 | | 2024 |
| TEOS and Thermal Oxide Low Temperature Direct Wafer Bonding Dynamics LG Michaud, K Abadie, F Fournel, C Morales, V Larrey, C Caulfied, ... 2024 8th International Workshop on Low Temperature Bonding for 3D …, 2024 | | 2024 |
| Modulation of post-fracture roughness with induced shear stress in the smart cut process L Colonel, Q Lomonaco, K Abadie, LG Michaud, C Morales, S Moreau, ... Journal of Applied Physics 136 (4), 2024 | | 2024 |
| Study and Control of the Distortion Induced by the Bonding Process for BSPDN Approaches K Abadie, I Mendes, ML Pourteau, F Fournel, H Hijazi, V Balan, ... 2024 IEEE International Interconnect Technology Conference (IITC), 1-3, 2024 | | 2024 |
| (First Best Paper Award) Vacuum Quality Impact on Covalent Bonding K Abadie, Q Lomonaco, L Michaud, F Fournel, C Morales Electrochemical Society Meeting Abstracts 244, 1600-1600, 2023 | | 2023 |
| Vacuum Quality Impact on Covalent Bonding K Abadie, Q Lomonaco, L Michaud, F Fournel, C Morales ECS Transactions 112 (3), 125, 2023 | | 2023 |
| Thin-film transfer method F Fournel, L Michaud, P Montmeat US Patent 11,551,976, 2023 | | 2023 |
| Stressed Si/Si homo-structures manufacturing using surface activated bonding in temperature K Abadie, Q Lomonaco, L Michaud, L Colonel, C Morales, F Fournel WaferBond’22-The International Conference on Wafer Bonding for Microsystems …, 2022 | | 2022 |
| Method of transferring a thin film from a substrate to a flexible support L Michaud, C Castan, F Fournel, P Montmeat US Patent 11,244,971, 2022 | | 2022 |
| Elaboration and transfer of tensile strained thin films L Michaud Université Grenoble Alpes [2020-....], 2021 | | 2021 |
| Elaboration et transfert de films ultra-contraints L Michaud Université Grenoble Alpes, 2021 | | 2021 |
| Highly Strained Silicon on Polymer Obtained By Temporary Polymer Wafer Bonding LG Michaud, C Castan, P Montméat, E Azrak, N Nikitskiy, F Fournel, ... PRiME 2020 (ECS, ECSJ, & KECS Joint Meeting), 2020 | | 2020 |
