| Thin hybrid metamaterial slab with negative and zero permeability for high efficiency and low electromagnetic field in wireless power transfer systems Y Cho, S Lee, DH Kim, H Kim, C Song, S Kong, J Park, C Seo, J Kim IEEE Transactions on Electromagnetic Compatibility 60 (4), 1001-1009, 2017 | 116 | 2017 |
| Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs H Park, J Park, S Kim, K Cho, D Lho, S Jeong, S Park, G Park, B Sim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 61 | 2020 |
| Signal integrity design and analysis of silicon interposer for GPU-memory channels in high-bandwidth memory interface K Cho, Y Kim, H Lee, H Kim, S Choi, J Song, S Kim, J Park, S Lee, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018 | 51 | 2018 |
| Low leakage electromagnetic field level and high efficiency using a novel hybrid loop-array design for wireless high power transfer system S Lee, DH Kim, Y Cho, H Kim, C Song, S Jeong, J Song, G Park, S Hong, ... IEEE Transactions on Industrial Electronics 66 (6), 4356-4367, 2018 | 42 | 2018 |
| Signal integrity design and analysis of differential high-speed serial links in silicon interposer with through-silicon via K Cho, Y Kim, H Lee, J Song, J Park, S Lee, S Kim, G Park, K Son, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018 | 30 | 2018 |
| Reinforcement learning-based optimal on-board decoupling capacitor design method H Park, J Park, S Kim, D Lho, S Park, G Park, K Cho, J Kim 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 26 | 2018 |
| Fast and accurate power distribution network modeling of a silicon interposer for 2.5-D/3-D ICs with multiarray TSVs K Cho, Y Kim, S Kim, H Park, J Park, S Lee, D Shim, K Lee, S Oh, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019 | 24 | 2019 |
| Polynomial model-based eye diagram estimation methods for LFSR-based bit streams in PRBS test and scrambling J Park, S Park, Y Kim, G Park, H Park, D Lho, K Cho, S Lee, DH Kim, ... IEEE Transactions on Electromagnetic Compatibility 61 (6), 1867-1875, 2019 | 14 | 2019 |
| A novel stochastic model-based eye-diagram estimation method for 8B/10B and TMDS-encoded high-speed channels J Park, S Choi, JJ Kim, Y Kim, M Lee, H Kim, B Bae, H Song, K Cho, S Lee, ... IEEE Transactions on Electromagnetic Compatibility 60 (5), 1510-1519, 2017 | 14 | 2017 |
| Signal integrity analysis of silicon/glass/organic interposers for 2.5 D/3D interconnects S Choi, H Kim, K Kim, J Park, DH Jung, J Kim 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2139-2144, 2017 | 14 | 2017 |
| Measurement and analysis of through glass via noise coupling and shielding structures in a glass interposer G Park, Y Kim, K Cho, J Park, I Hwang, J Kim, K Son, H Park, ... IEEE Transactions on Electromagnetic Compatibility 63 (5), 1562-1573, 2021 | 13 | 2021 |
| Signal integrity design and analysis of 3-D X-point memory considering crosstalk and IR drop for higher performance computing K Son, K Cho, S Kim, S Park, DH Jung, J Park, G Park, S Kim, T Shin, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 13 | 2020 |
| Channel characteristic-based deep neural network models for accurate eye diagram estimation in high bandwidth memory (HBM) silicon interposer D Lho, H Park, S Park, S Kim, H Kang, B Sim, S Kim, J Park, K Cho, ... IEEE Transactions on Electromagnetic Compatibility 64 (1), 196-208, 2021 | 12 | 2021 |
| Bayesian optimization of high-speed channel for signal integrity analysis D Lho, J Park, H Park, S Park, S Kim, H Kang, S Kim, G Park, K Son, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 12 | 2019 |
| High-frequency modeling and signal integrity analysis of a silicone rubber socket for high-performance package H Kim, JJ Kim, J Park, S Park, S Choi, B Bae, DH Ha, M Bae, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (8 …, 2017 | 12 | 2017 |
| A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias J Park, DH Jung, B Kim, S Choi, Y Kim, S Park, G Park, K Cho, S Lee, ... IEEE Transactions on Electromagnetic Compatibility 61 (4), 1198-1206, 2018 | 11 | 2018 |
| Through-silicon via capacitance–voltage hysteresis modeling for 2.5-D and 3-D IC DH Kim, Y Kim, J Cho, B Bae, J Park, H Lee, J Lim, JJ Kim, S Piersanti, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017 | 11 | 2017 |
| Eye-width and eye-height estimation method based on artificial neural network (ANN) for USB 3.0 D Lho, J Park, H Park, H Kang, S Park, J Kim 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 10 | 2018 |
| Statistical eye-diagram estimation method considering power/ground noise induced by simultaneous switching output (SSO) buffers Y Kim, J Park, J Kim, YI Hayashi IEEE Transactions on Electromagnetic Compatibility 62 (6), 2547-2557, 2020 | 9 | 2020 |
| Generator polynomial model-based eye diagram estimation method for Bose-Chaudhuri-Hocquenghem (BCH) code and Reed-Solomon (RS) code J Park, J Kim IEEE Transactions on Electromagnetic Compatibility 62 (1), 240-248, 2018 | 9 | 2018 |
Joungho KimProfessor of Electrical Engineering KAIST在 kaist.ac.kr 的电子邮件经过验证
