| MEMS reliability AL Hartzell, MG Da Silva, HR Shea Springer Science & Business Media, 2010 | 216 | 2010 |
| Metal contact reliability of RF MEMS switches Q Ma, Q Tran, TKA Chou, J Heck, H Bar, R Kant, V Rao Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI 6463 …, 2007 | 82 | 2007 |
| Reliability methodology for prediction of micromachined accelerometer stiction A Hartzell, D Woodilla 1999 IEEE International Reliability Physics Symposium Proceedings. 37th …, 1999 | 53 | 1999 |
| MEMS deformable mirrors for astronomical adaptive optics SA Cornelissen, AL Hartzell, JB Stewart, TG Bifano, PA Bierden Adaptive Optics Systems II 7736, 898-907, 2010 | 41 | 2010 |
| Optical mirror coatings for high-temperature diffusion barriers and mirror shaping SA Alie, A Hartzell, M Karpman, JR Martin, K Nunan US Patent 6,508,561, 2003 | 38 | 2003 |
| Understanding and improving longevity in RF MEMS capacitive switches C Goldsmith, D Forehand, D Scarbrough, Z Peng, C Palego, J Hwang, ... Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII 6884 …, 2008 | 35 | 2008 |
| Process engineering and failure analysis of MEMS and MOEMS by digital holography microscopy (DHM) F Montfort, Y Emery, F Marquet, E Cuche, N Aspert, E Solanas, ... Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI 6463 …, 2007 | 34 | 2007 |
| Experimental study of electrical breakdown in MEMS devices with micrometer scale gaps P Carazzetti, P Renaud, HR Shea Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII 6884 …, 2008 | 31 | 2008 |
| Contamination-free manufacturing for semiconductors and other precision products RP Donovan CRC Press, 2001 | 30 | 2001 |
| Investigation of deep-ultraviolet photoresists on TiN substrates KR Dean, RA Carpio, GK Rich Advances in Resist Technology and Processing XII 2438, 514-528, 1995 | 27 | 1995 |
| Lifetime prediction AL Hartzell, MG da Silva, HR Shea, AL Hartzell, MG da Silva, HR Shea MEMS reliability, 9-42, 2011 | 26 | 2011 |
| Low-temperature vacuum hermetic wafer-level package for uncooled microbolometer FPAs S Garcia-Blanco, P Topart, Y Desroches, JS Caron, F Williamson, C Alain, ... Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII 6884 …, 2008 | 26 | 2008 |
| Analysis of manufacturing-scale MEMS reliability testing KM Delak, P Bova, AL Hartzell, DJ Woodilla MEMS Reliability for Critical and Space Applications 3880, 165-174, 1999 | 25 | 1999 |
| An approach to composite QoS parameter based web service selection RP Singh, KK Pattanaik Procedia computer science 19, 470-477, 2013 | 24 | 2013 |
| MEMS reliability, characterization, and test AL Hartzell, DJ Woodilla Reliability, Testing, and Characterization of MEMS/MOEMS 4558, 1-5, 2001 | 22 | 2001 |
| Accelerated hermeticity testing of a glass–silicon package formed by rapid thermal processing aluminum-to-silicon nitride bonding M Chiao, L Lin Sensors and Actuators A: Physical 97, 405-409, 2002 | 21 | 2002 |
| MEMS reliability: coming of age MR Douglass Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII 6884 …, 2008 | 20 | 2008 |
| Interferometric characterization of MOEMS devices in cryogenic environment for astronomical instrumentation F Zamkotsian, E Grassi, S Waldis, R Barette, P Lanzoni, C Fabron, ... Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII 6884 …, 2008 | 19 | 2008 |
| Reliability testing and analysis of safing and arming devices for army fuzes JL Zunino III, DR Skelton, C Robinson Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII 6884 …, 2008 | 18 | 2008 |
| Wafer capping of MEMS with fab-friendly metals J Martin Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI 6463 …, 2007 | 15 | 2007 |
