Three-dimensional, multifunctional neural interfaces for cortical spheroids and engineered assembloids Y Park, CK Franz, H Ryu, H Luan, KY Cotton, JU Kim, TS Chung, S Zhao, ... Science Advances 7 (12), eabf9153, 2021 | 168 | 2021 |
Three-dimensional electronic microfliers inspired by wind-dispersed seeds BH Kim, K Li, JT Kim, Y Park, H Jang, X Wang, Z Xie, SM Won, HJ Yoon, ... Nature 597 (7877), 503-510, 2021 | 153 | 2021 |
An on-skin platform for wireless monitoring of flow rate, cumulative loss and temperature of sweat in real time K Kwon, JU Kim, Y Deng, SR Krishnan, J Choi, H Jang, KH Lee, CJ Su, ... Nature Electronics 4 (4), 302-312, 2021 | 133 | 2021 |
Wireless, skin-interfaced sensors for compression therapy Y Park, K Kwon, SS Kwak, DS Yang, JW Kwak, H Luan, TS Chung, ... Science advances 6 (49), eabe1655, 2020 | 62 | 2020 |
Materials Chemistry of Neural Interface Technologies and Recent Advances in Three-Dimensional Systems Y Park, TS Chung, G Lee, JA Rogers Chemical Reviews 122 (5), 5277-5316, 2021 | 40 | 2021 |
Transparent, compliant 3D mesostructures for precise evaluation of mechanical characteristics of organoids H Ryu, Y Park, H Luan, G Dalgin, K Jeffris, HJ Yoon, TS Chung, JU Kim, ... Advanced Materials 33 (25), 2100026, 2021 | 32 | 2021 |
Ambipolar charge-transfer graphene plasmonic cavities BSY Kim, AJ Sternbach, MS Choi, Z Sun, FL Ruta, Y Shao, AS McLeod, ... Nature Materials 22 (7), 838-843, 2023 | 16 | 2023 |
Three dimensional bioelectronic interfaces to small-scale biological systems Y Park, TS Chung, JA Rogers Current Opinion in Biotechnology 72, 1-7, 2021 | 15 | 2021 |
Wireless, Soft Sensors of Skin Hydration with Designs Optimized for Rapid, Accurate Diagnostics of Dermatological Health J Shin, H Wang, K Kwon, D Ostojich, Z Christiansen, J Berkovich, Y Park, ... Advanced healthcare materials 12 (4), 2202021, 2023 | 11 | 2023 |
Soft, full Wheatstone bridge 3D pressure sensors for cardiovascular monitoring Y Park, H Luan, K Kwon, TS Chung, S Oh, JY Yoo, G Chung, J Kim, S Kim, ... npj Flexible Electronics 8 (1), 6, 2024 | 7 | 2024 |
Superfluid Stiffness of Td-MoTe2 at Microwave Frequencies M Kreidel, J Balgley, X Chu, T Chung, J Hone, R Westervelt, KC Fong Bulletin of the American Physical Society, 2024 | | 2024 |
Leveraging novel materials for quantum sensing KC Fong, GH Lee, D Englund, J Hone, B Huang, E Arnault, W Jung, ... Bulletin of the American Physical Society, 2024 | | 2024 |
3D Microstructures: Transparent, Compliant 3D Mesostructures for Precise Evaluation of Mechanical Characteristics of Organoids (Adv. Mater. 25/2021) H Ryu, Y Park, H Luan, G Dalgin, K Jeffris, HJ Yoon, TS Chung, JU Kim, ... Advanced Materials 33 (25), 2170196, 2021 | | 2021 |
Three-Dimensional Electronic Microfliers With Designs Inspired by Wind-Dispersed Seeds J Rogers, BH Kim, K Li, JT Kim, Y Park, H Jang, X Wang, Z Xie, S Won, ... | | 2021 |