Delamination detection in composite plates using random forests DK Lim, KB Mustapha, CP Pagwiwoko Composite Structures 278, 114676, 2021 | 21 | 2021 |
Modelling of Laser Absorption and Modification Layer Formation within Silicon due to Stealth Dicing DK Lim, VRSP Vempaty, AH Shah, WH Sim, HV Singh IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 2 | 2023 |
Impact of Wafer Pre-thin Thickness on Stealth Dicing Performance DK Lim, VRSP Vempaty, WH Sim, HV Singh 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 701-704, 2023 | 1 | 2023 |
Elimination of splash damage for smaller scribe widths in next-gen memory devices via stealth dicing DK Lim, VRSP Vempaty, A Yu, WH Sim, HV Singh Materials Science in Semiconductor Processing 181, 108628, 2024 | | 2024 |