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Dao Kun Lim
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引用次数
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Delamination detection in composite plates using random forests
DK Lim, KB Mustapha, CP Pagwiwoko
Composite Structures 278, 114676, 2021
212021
Modelling of Laser Absorption and Modification Layer Formation within Silicon due to Stealth Dicing
DK Lim, VRSP Vempaty, AH Shah, WH Sim, HV Singh
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023
22023
Impact of Wafer Pre-thin Thickness on Stealth Dicing Performance
DK Lim, VRSP Vempaty, WH Sim, HV Singh
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 701-704, 2023
12023
Elimination of splash damage for smaller scribe widths in next-gen memory devices via stealth dicing
DK Lim, VRSP Vempaty, A Yu, WH Sim, HV Singh
Materials Science in Semiconductor Processing 181, 108628, 2024
2024
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