| When are transmission-line effects important for on-chip interconnections? A Deutsch, GV Kopcsay, PJ Restle, HH Smith, G Katopis, WD Becker, ... IEEE Transactions on microwave theory and techniques 45 (10), 1836-1846, 1997 | 498 | 1997 |
| Modeling, measurement, and simulation of simultaneous switching noise BD McCredie, WD Becker IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1996 | 138 | 1996 |
| Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer systems WD Becker, J Eckhardt, RW Frech, GA Katopis, E Klink, MF McAllister, ... IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 112 | 1998 |
| Self-healing chip-to-chip interface WD Becker, DM Dreps, FD Ferraiolo, A Haridass, RJ Reese US Patent 7,362,697, 2008 | 104 | 2008 |
| Time-domain electromagnetic analysis of interconnects in a computer chip package WD Becker, PH Harms, R Mittra IEEE transactions on microwave theory and techniques 40 (12), 2155-2163, 1992 | 85 | 1992 |
| Demystifying machine learning for signal and power integrity problems in packaging M Swaminathan, HM Torun, H Yu, JA Hejase, WD Becker IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 62 | 2020 |
| Frequency-dependent crosstalk simulation for on-chip interconnections A Deutsch, HH Smith, CW Surovic, GV Kopcsay, DA Webber, PW Coteus, ... IEEE transactions on advanced packaging 22 (3), 292-308, 1999 | 62 | 1999 |
| The importance of inductance and inductive coupling for on-chip wiring A Deutsch, H Smith, GA Katopis, WD Becker, PW Coteus, CW Surovic, ... Electrical Performance of Electronic Packaging, 53-56, 1997 | 58 | 1997 |
| A general purpose Maxwell solver for the extraction of equivalent circuits of electronic package components for circuit simulation R Mittra, WD Becker, PH Harms IEEE Transactions on Circuits and Systems I: Fundamental Theory and …, 1992 | 57 | 1992 |
| System for airflow management in electronic enclosures WD Becker, JP Corrado, EE Cruz, MJ Fisher, GF Goth US Patent 7,113,401, 2006 | 56 | 2006 |
| FDTD modeling of noise in computer packages WD Becker, R Mittra IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1994 | 51 | 1994 |
| Efficient modeling of power planes in computer packages using the finite difference time domain method R Mittra, S Chebolu, WD Becker IEEE transactions on microwave theory and techniques 42 (9), 1791-1795, 1994 | 41 | 1994 |
| MCM technology and design for the S/390 G5 system GA Katopis, WD Becker, TR Mazzawy, HH Smith, CK Vakirtzis, ... IBM Journal of Research and Development 43 (5.6), 621-650, 1999 | 39 | 1999 |
| Method and apparatus for generating synchronization signals for synchronizing multiple chips in a system CC Hwang, WD Becker, TG Mcnamara, CL Tong US Patent 7,826,579, 2010 | 36 | 2010 |
| Power distribution modelling of high performance first level computer packages W Becker, B McCredie, G Wilkins, A Iqbal Proceedings of IEEE Electrical Performance of Electronic Packaging, 202-205, 1993 | 31 | 1993 |
| Programmable driver delay WD Becker, A Haridass, BG Truong US Patent 7,233,170, 2007 | 30 | 2007 |
| Local probing of switching noise in VLSI chips using Time Resolved Emission (TRE) F Stellari, P Song, WD Becker North Atlantic Test Workshop (NATW), 130-137, 2005 | 27 | 2005 |
| Mid-frequency simultaneous switching noise in computer systems W Becker, H Smith, T McNamara, P Muench, J Eckhardt, M McAllister, ... 1997 Proceedings 47th Electronic Components and Technology Conference, 676-681, 1997 | 25 | 1997 |
| Early high level net based analysis of simultaneous switching CK Vakirtzis, GA Katopis, GW Mahoney, CR Selinger, BD McCredie, ... US Patent 5,477,460, 1995 | 25 | 1995 |
| First-and second-level packaging of the z990 processor cage TM Winkel, WD Becker, H Harrer, H Pross, D Kaller, B Garben, ... IBM Journal of Research and Development 48 (3.4), 379-394, 2004 | 24 | 2004 |
Dan DrepsIBM在 us.ibm.com 的电子邮件经过验证
