| Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches FC Ng, A Abas, MZ Abdullah Microelectronics Reliability 81, 41-63, 2018 | 36 | 2018 |
| Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings FC Ng, A Abas, ZL Gan, MZ Abdullah, FC Ani, MYT Ali Microelectronics Reliability 72, 45-64, 2017 | 36 | 2017 |
| Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array FC Ng, A Abas, MHH Ishak, MZ Abdullah, A Aziz Microelectronics Reliability 66, 143-160, 2016 | 34 | 2016 |
| Underfill flow in flip-chip encapsulation process: a review FC Ng, MA Abas Journal of Electronic Packaging 144 (1), 010803, 2022 | 27 | 2022 |
| Numerical study of composite fiberglass cross arms under statics loading and improvement with sleeve installation D Mohamad, A Syamsir, S Beddu, A Abas, FC Ng, MF Razali, S Seman IOP Conference Series: Materials Science and Engineering 530 (1), 012027, 2019 | 24 | 2019 |
| Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation FC Ng, A Abas, MZ Abdullah Journal of Electronic Packaging 141 (4), 2019 | 23 | 2019 |
| Effect of laminate properties on the failure of cross arm structure under multi-axial load D Mohamad, A Syamsir, S Beddu, NLM Kamal, MM Zainoodin, MF Razali, ... IOP Conference Series: Materials Science and Engineering 530 (1), 012029, 2019 | 23 | 2019 |
| Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA A Abas, FC Ng, ZL Gan, MHH Ishak, MZ Abdullah, GY Chong Sādhanā 43, 1-14, 2018 | 22 | 2018 |
| Numerical simulation on the statics deformation study of composite cross arms of different materials and configurations D Mohamad, A Syamsir, Z Itam, HA Bakar, A Abas, FC Ng, MF Razali, ... IOP Conference Series: Materials Science and Engineering 530 (1), 012028, 2019 | 21 | 2019 |
| CUF scaling effect on contact angle and threshold pressure FC Ng, MA Abas, MZ Abdullah, MHH Ishak, GY Chong Soldering & Surface Mount Technology 29 (4), 173-190, 2017 | 21 | 2017 |
| Filling efficiency of flip-chip underfill encapsulation process FC Ng, MA Abas, MZ Abdullah Soldering & Surface Mount Technology 32 (1), 10-18, 2019 | 18 | 2019 |
| Stacking sequence effects on performance of composite laminate structure subjected to multi-axial quasi-static loading D Mohamad, A Syamsir, SN Sa’Don, NM Zahari, S Seman, MF Razali, ... IOP Conference Series: Materials Science and Engineering 530 (1), 012030, 2019 | 18 | 2019 |
| Fluid/structure interaction study on the variation of radial gate’s gap height in dam FC Ng, A Abas, I Abustan, ZMR Rozainy, MZ Abdullah, SM Kon IOP Conference Series: Materials Science and Engineering 370 (1), 012063, 2018 | 18 | 2018 |
| Spatial analysis of underfill flow in flip-chip encapsulation FC Ng, MH Zawawi, MA Abas Soldering & Surface Mount Technology 33 (2), 112-127, 2020 | 17 | 2020 |
| A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process FC Ng, MYT Ali, A Abas, CY Khor, Z Samsudin, MZ Abdullah The International Journal of Advanced Manufacturing Technology 105, 3521-3530, 2019 | 16 | 2019 |
| Effect of barrier height on the design of stepped spillway using smoothed particle hydrodynamics and particle image velocimetry A Azman, FC Ng, MH Zawawi, A Abas, MR Rozainy MAZ, I Abustan, ... KSCE Journal of Civil Engineering 24, 451-470, 2020 | 14 | 2020 |
| Finite volume method study on contact line jump phenomena and dynamic contact angle of underfill flow in flip-chip of various bump pitches FC Ng, A Abas, MZ Abdullah IOP Conference Series: Materials Science and Engineering 530 (1), 012012, 2019 | 10 | 2019 |
| Effect of the gap height of radial gate on the volumetric flow rate in dam FC Ng, A Abas, I Abustan, ZMR Rozainy, MZ Abdullah, SM Kon IOP Conference Series: Materials Science and Engineering 370 (1), 012062, 2018 | 10 | 2018 |
| Symmetrical Unit-Cell Numerical Approach for Flip-Chip Underfill Flow Simulation FC Ng, MH Zawawi, LH Tung, MA Abas, M Zulkifly CFD Letters 12 (8), 55-63, 2020 | 8 | 2020 |
| Numerical visualization of flow in spillway and downstream of dam using fluid/structure interaction MN Nashurdin, A Abas, A Azman, FC Ng, MRM Radzi, A Hassani AIP Conference Proceedings 2129 (1), 020044, 2019 | 8 | 2019 |
Aizat AbasUniversiti Sains Malaysia在 usm.my 的电子邮件经过验证
