| Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR M Tavakolibasti, P Meszmer, G Böttger, M Kettelgerdes, G Elger, ... Microelectronics Reliability 141, 114871, 2023 | 17 | 2023 |
| AI surrogate models for error analysis in optical systems P Meszmer, N Mundada, M Tavakolibasti, B Wunderle 2023 24th International Conference on Thermal, Mechanical and Multi-Physics …, 2023 | 3 | 2023 |
| Structural-thermal-optical-performance (STOP) analysis of a lens stack for realization of a digital twin of an automotive LiDAR M Tavakolibasti, P Meszmer, M Kettelgerdes, G Böttger, G Elger, ... 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics …, 2022 | 3 | 2022 |
| Design and technology for uniform aluminum nitride piezoelectric micromachined ultrasonic transducers with radial array C Stoeckel, M Melzer, K Meinel, M Tavakolibasti, R Forke, S Zimmermann, ... 2021 Smart Systems Integration (SSI), 1-4, 2021 | 3 | 2021 |
| A Simple Self-Exciting Vibration High Cycle Fatigue Tester for Accelerated Stress Testing of Thin Films A Mohammadi, M Tavakolibasti, J Arnold, B Wunderle 2023 29th International Workshop on Thermal Investigations of ICs and …, 2023 | 2 | 2023 |
| Thermo-fluidic characterization of automotive LiDAR module under realistic enforced air-cooling conditions in a closed wind tunnel M Tavakolibasti, R Schacht, B Wunderle, T Nowak 2021 27th International Workshop on Thermal Investigations of ICs and …, 2021 | 2 | 2021 |
| Realization, multi-field coupled simulation and characterization of a thermo-mechanically robust LiDAR front end on a copper coated glass substrate M Kettelgerdes, P Mezmer, MJ Haeussler, G Böttger, M Tavakolibasti, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 753-760, 2023 | 1 | 2023 |
| Investigations of Aluminum Nitride based piezoelectric MEMS M Stiebing, M Tavakolibasti, C Stoeckel, K Hiller, B Wunderle 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS …, 2019 | 1 | 2019 |
| 2021 22ND INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, EUROSIME 2021 M Tavakolibasti, P Meszmer, B Wunderle, G Bottger, M Kettelgerdes, ... TRAINING 9410835, 0, 2021 | | 2021 |
| Residual Stress Characterisation of Thin Sputtered Copper Films on Silicon Exploiting Membrane Resonance within a Specimen Centred Approach B Wunderle, P Meszmer, A Mohnot, M Tavakolibasti, N Jöhrmann, ... 2020 21st International Conference on Thermal, Mechanical and Multi-Physics …, 2020 | | 2020 |
