关注
Dekui Mu
Dekui Mu
Huaqiao University
在 uqconnect.edu.au 的电子邮件经过验证
标题
引用次数
引用次数
年份
Science and art of ductile grinding of brittle solids
H Huang, X Li, D Mu, BR Lawn
International Journal of Machine Tools and Manufacture 161, 103675, 2021
1902021
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
DK Mu, SD McDonald, J Read, H Huang, K Nogita
Current Opinion in Solid State and Materials Science 20 (2), 55-76, 2016
1062016
Anisotropic mechanical properties of Cu6Sn5 and (Cu, Ni) 6Sn5
D Mu, H Huang, K Nogita
Materials Letters 86, 46-49, 2012
792012
Effect of Ni on phase stability and thermal expansion of Cu6− xNixSn5 (X= 0, 0.5, 1, 1.5 and 2)
K Nogita, D Mu, SD McDonald, J Read, YQ Wu
Intermetallics 26, 78-85, 2012
782012
Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5
D Mu, J Read, Y Yang, K Nogita
Journal of Materials Research 26, 2660-2664, 2011
682011
Growth orientations and mechanical properties of Cu6Sn5 and (Cu, Ni) 6Sn5 on poly-crystalline Cu
D Mu, H Yasuda, H Huang, K Nogita
Journal of alloys and compounds 536, 38-46, 2012
632012
Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy
J Chen, D Mu, X Liao, G Huang, H Huang, X Xu, H Huang
International Journal of Refractory Metals and Hard Materials 74, 52-60, 2018
562018
The removal mechanism and force modelling of gallium oxide single crystal in single grit grinding and nanoscratching
Y Wang, X Li, Y Wu, D Mu, H Huang
International Journal of Mechanical Sciences 204, 106562, 2021
442021
Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu, Ni) 6Sn5 on diverse crystal planes
D Mu, H Huang, SD McDonald, J Read, K Nogita
Materials Science and Engineering: A 566, 126-133, 2013
442013
Deformation and removal of semiconductor and laser single crystals at extremely small scales
Y Wu, D Mu, H Huang
International Journal of Extreme Manufacturing 2 (1), 012006, 2020
432020
Fundamental aspects of ultrasonic assisted induction brazing of diamond onto 1045 steel
G Huang, J Huang, M Zhang, D Mu, G Zhou, X Xu
Journal of Materials Processing Technology 260, 123-136, 2018
422018
The influence of ageing on the stabilisation of interfacial (Cu, Ni) 6 (Sn, Zn) 5 and (Cu, Au, Ni) 6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, MAAM Salleh, ...
Journal of Alloys and Compounds 685, 471-482, 2016
422016
Microstructures and bonding strength of synthetic diamond brazed by near-eutectic Ag–Cu–in–Ti filler alloy
Z Liu, X Liao, W Fu, D Mu, X Xu, H Huang
Materials Science and Engineering: A 790, 139711, 2020
412020
Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures
D Mu, H Huang, SD McDonald, K Nogita
Journal of electronic materials 42, 304-311, 2013
372013
Interfacial microstructures and mechanical integrity of synthetic diamond brazed by a low-temperature Cu-Sn-Cr filler alloy
M Li, J Chen, Q Lin, Y Wu, D Mu
Diamond and Related Materials 97, 107440, 2019
292019
Rapid dehydrogenation of TiH2 and its effect on formation mechanism of TiC during self-propagation high-temperature synthesis from TiH2–C system
YF Yang, DK Mu
Powder technology 249, 208-211, 2013
282013
Kinetic analysis of wetting and spreading at high temperatures: A review
Q Lin, K Xie, R Sui, D Mu, R Cao, J Chang, F Qiu
Advances in Colloid and Interface Science 305, 102698, 2022
272022
Ni segregation in the interfacial (Cu, Ni) 6Sn5 intermetallic layer of Sn-0.7 Cu-0.05 Ni/Cu ball grid array (BGA) joints
G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, K Nogita
Intermetallics 54, 20-27, 2014
272014
Low-temperature wetting of sapphire using Sn–Ti active solder alloys
D Mu, K Feng, Q Lin, H Huang
Ceramics International 45 (17), 22175-22182, 2019
252019
Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys
X Liao, D Mu, W Fu, H Huang, H Huang
Materials & Design 182, 108039, 2019
232019
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