| Science and art of ductile grinding of brittle solids H Huang, X Li, D Mu, BR Lawn International Journal of Machine Tools and Manufacture 161, 103675, 2021 | 190 | 2021 |
| Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review DK Mu, SD McDonald, J Read, H Huang, K Nogita Current Opinion in Solid State and Materials Science 20 (2), 55-76, 2016 | 106 | 2016 |
| Anisotropic mechanical properties of Cu6Sn5 and (Cu, Ni) 6Sn5 D Mu, H Huang, K Nogita Materials Letters 86, 46-49, 2012 | 79 | 2012 |
| Effect of Ni on phase stability and thermal expansion of Cu6− xNixSn5 (X= 0, 0.5, 1, 1.5 and 2) K Nogita, D Mu, SD McDonald, J Read, YQ Wu Intermetallics 26, 78-85, 2012 | 78 | 2012 |
| Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5 D Mu, J Read, Y Yang, K Nogita Journal of Materials Research 26, 2660-2664, 2011 | 68 | 2011 |
| Growth orientations and mechanical properties of Cu6Sn5 and (Cu, Ni) 6Sn5 on poly-crystalline Cu D Mu, H Yasuda, H Huang, K Nogita Journal of alloys and compounds 536, 38-46, 2012 | 63 | 2012 |
| Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy J Chen, D Mu, X Liao, G Huang, H Huang, X Xu, H Huang International Journal of Refractory Metals and Hard Materials 74, 52-60, 2018 | 56 | 2018 |
| The removal mechanism and force modelling of gallium oxide single crystal in single grit grinding and nanoscratching Y Wang, X Li, Y Wu, D Mu, H Huang International Journal of Mechanical Sciences 204, 106562, 2021 | 44 | 2021 |
| Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu, Ni) 6Sn5 on diverse crystal planes D Mu, H Huang, SD McDonald, J Read, K Nogita Materials Science and Engineering: A 566, 126-133, 2013 | 44 | 2013 |
| Deformation and removal of semiconductor and laser single crystals at extremely small scales Y Wu, D Mu, H Huang International Journal of Extreme Manufacturing 2 (1), 012006, 2020 | 43 | 2020 |
| Fundamental aspects of ultrasonic assisted induction brazing of diamond onto 1045 steel G Huang, J Huang, M Zhang, D Mu, G Zhou, X Xu Journal of Materials Processing Technology 260, 123-136, 2018 | 42 | 2018 |
| The influence of ageing on the stabilisation of interfacial (Cu, Ni) 6 (Sn, Zn) 5 and (Cu, Au, Ni) 6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, MAAM Salleh, ... Journal of Alloys and Compounds 685, 471-482, 2016 | 42 | 2016 |
| Microstructures and bonding strength of synthetic diamond brazed by near-eutectic Ag–Cu–in–Ti filler alloy Z Liu, X Liao, W Fu, D Mu, X Xu, H Huang Materials Science and Engineering: A 790, 139711, 2020 | 41 | 2020 |
| Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures D Mu, H Huang, SD McDonald, K Nogita Journal of electronic materials 42, 304-311, 2013 | 37 | 2013 |
| Interfacial microstructures and mechanical integrity of synthetic diamond brazed by a low-temperature Cu-Sn-Cr filler alloy M Li, J Chen, Q Lin, Y Wu, D Mu Diamond and Related Materials 97, 107440, 2019 | 29 | 2019 |
| Rapid dehydrogenation of TiH2 and its effect on formation mechanism of TiC during self-propagation high-temperature synthesis from TiH2–C system YF Yang, DK Mu Powder technology 249, 208-211, 2013 | 28 | 2013 |
| Kinetic analysis of wetting and spreading at high temperatures: A review Q Lin, K Xie, R Sui, D Mu, R Cao, J Chang, F Qiu Advances in Colloid and Interface Science 305, 102698, 2022 | 27 | 2022 |
| Ni segregation in the interfacial (Cu, Ni) 6Sn5 intermetallic layer of Sn-0.7 Cu-0.05 Ni/Cu ball grid array (BGA) joints G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, K Nogita Intermetallics 54, 20-27, 2014 | 27 | 2014 |
| Low-temperature wetting of sapphire using Sn–Ti active solder alloys D Mu, K Feng, Q Lin, H Huang Ceramics International 45 (17), 22175-22182, 2019 | 25 | 2019 |
| Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys X Liao, D Mu, W Fu, H Huang, H Huang Materials & Design 182, 108039, 2019 | 23 | 2019 |
