| High-strain-rate void growth in high entropy alloys: Suppressed dislocation emission= suppressed void growth Y Cui, Y Toku, Y Kimura, Y Ju Scripta Materialia 185, 12-18, 2020 | 21 | 2020 |
| Relief of strain hardening in deformed Inconel 718 by high-density pulsed electric current S Gu, Y Cui, Y Kimura, Y Toku, Y Ju Journal of Materials Science 56, 16686-16696, 2021 | 14 | 2021 |
| Rapid anisotropy recovery in deformed FCC metals by high-density pulsed electric current treatment S Gu, Y Cui, S Yoon, Z Wang, Y Kimura, Y Toku, Y Ju Vacuum 197, 110855, 2022 | 13 | 2022 |
| Improvement of low-cycle fatigue life of austenitic stainless steel by multiple high-density pulsed electric currents S Yoon, Y Cui, Y Kimura, S Gu, Y Toku, Y Ju International Journal of Fatigue 156, 106639, 2022 | 13 | 2022 |
| Irregular bending growth of free-standing Al microwire by electromigration Y Kimura Acta Materialia 157, 276-287, 2018 | 13 | 2018 |
| Simplified processes using conductive passivation film for the fabrication of Al micro-wires by electromigration Y Kimura, M Saka Materials Letters 116, 278-281, 2014 | 12 | 2014 |
| Suitable passivation thickness on a metal line to prevent electromigration damage Y Kimura, H Ikadai, T Nakakura, M Saka Materials Letters 184, 219-222, 2016 | 10 | 2016 |
| Realizing strength–ductility synergy in a lean duplex stainless steel through enhanced TRIP effect via pulsed electric current treatment S Gu, C Liu, Y Kimura, S Yoon, Y Cui, X Yan, Y Ju, Y Toku Materials Science and Engineering: A 883, 145534, 2023 | 9 | 2023 |
| Efficiency improvement of fatigue crack healing by multiple high-density pulsed electric currents: Application to austenitic stainless steel S Yoon, S Gu, S Li, Y Kimura, Y Toku, Y Ju Engineering Fracture Mechanics 284, 109235, 2023 | 8 | 2023 |
| The deformation mechanism in cold-welded gold nanowires due to dislocation emission Y Cui, Y Toku, Y Kimura, Y Ju Computational Materials Science 188, 110214, 2021 | 8 | 2021 |
| Nanocarriers for drug-delivery systems using a ureido-derivatized polymer gatekeeper for temperature-controlled spatiotemporal on–off drug release Y Morita, K Kobayashi, Y Toku, Y Kimura, Q Luo, G Song, Y Ju Biomaterials Advances 139, 213026, 2022 | 7 | 2022 |
| True origin of the size effect in cold-welded metallic nanocrystals Y Cui, Y Toku, Y Kimura, Y Ju International Journal of Mechanical Sciences 187, 106102, 2020 | 7 | 2020 |
| Fabrication of aluminum microwires through artificial weak spots in a thick film using stress-induced migration. HT Lee, Y Kimura, M Saka AIMS Materials Science 5 (4), 2018 | 7 | 2018 |
| Buried structure for increasing fabrication performance of micromaterial by electromigration Y Kimura, M Saka Japanese Journal of Applied Physics 55 (6S1), 06GH01, 2016 | 7 | 2016 |
| Residual stress effect governing electromigration-based free-standing metallic micro/nanowire growth behavior Y Kimura, Y Ju Applied Physics Letters 116 (2), 2020 | 6 | 2020 |
| Ultrahigh deformability of Ti-6Al-4V assisted by high-density pulsed electric current treatment S Gu, C Liu, Y Toku, Y Kimura, S Yoon, S Li, Y Cui, Y Ju Journal of Alloys and Compounds 973, 172892, 2024 | 5 | 2024 |
| Enhanced fabrication of hybrid Cu-Cu2O nanostructures on electrodes using electrochemical migration S FUKAYA, T AOKI, Y KIMURA, M SAKA Mechanical Engineering Letters 4, 17-00604-17-00604, 2018 | 5 | 2018 |
| Influence of a high-density pulsed electric current on the fatigue behaviour of prestrained aluminium alloys J Jung, S Yoon, S Gu, Y Kimura, Y Toku, Y Ju Engineering Failure Analysis 150, 107230, 2023 | 4 | 2023 |
| Effect of temperature on preventing electromigration damage based on increasing threshold current density in a thin metal passivated line H IKADAI, Y KIMURA, M SAKA Mechanical Engineering Letters 2, 15-00714-15-00714, 2016 | 4 | 2016 |
| High Temperature Tensile and Compressive Behaviors of Nanostructured Polycrystalline AlCoCrFeNi High Entropy Alloy: A Molecular Dynamics Study S Yoon, Y Kimura, M Uchida, Y Ju, Y Toku Journal of Engineering Materials and Technology 146 (2), 2024 | 3 | 2024 |
Yang JuNagoya University在 mech.nagoya-u.ac.jp 的电子邮件经过验证
