| Progress in indentation study of materials via both experimental and numerical methods M Liu, J Lin, C Lu, KA Tieu, K Zhou, T Koseki Crystals 7 (10), 258, 2017 | 48 | 2017 |
| Interfacial phenomena during ultrasonic welding of ultra-low-carbon steel and pure Ti JY Lin, S Nambu, T Koseki Scripta Materialia 178, 218-222, 2020 | 30 | 2020 |
| Evolution of bonding interface during ultrasonic welding between steel and aluminium alloy JY Lin, S Nambu, T Koseki Science and Technology of Welding and Joining 24 (1), 83-91, 2019 | 23 | 2019 |
| Deformation induced solute segregation and GP zone formation in Mg-Al and Mg-Zn binary alloys TT Sasaki, JY Lin, P Yi, ZH Li, SE Prameela, A Park, E Lipkin, A Lee, ... Scripta Materialia 220, 114924, 2022 | 18 | 2022 |
| Effect of surface roughness on bonding interface formation of steel and Ni by ultrasonic welding JY Lin, S Nambu, K Pongmorakot, T Koseki Science and Technology of Welding and Joining 25 (2), 157-163, 2020 | 18 | 2020 |
| Development of a bonding interface between steel/steel and steel/Ni by ultrasonic welding S Nambu, K Seto, JY Lin, T Koseki Science and Technology of Welding and Joining 23 (8), 687-692, 2018 | 18 | 2018 |
| Gradient microstructure and interfacial strength of CoCrFeMnNi high-entropy alloy in solid-state ultrasonic welding JY Lin, ZH Lai, T Otsuki, HW Yen, S Nambu Materials Science and Engineering: A 825, 141885, 2021 | 17 | 2021 |
| Influence of Al and Ni interlayers on interfacial strength evolution during ultrasonic welding of ultra-low-carbon steel and pure Ti JY Lin, S Nambu, M Liu, T Koseki Materials Science and Engineering: A 798, 140073, 2020 | 17 | 2020 |
| Evolution of bonding interface during ultrasonic welding between Ni and steels with various microstructure JY Lin, S Nambu, T Koseki ISIJ International 60 (2), 330-336, 2020 | 15 | 2020 |
| Phase diagrams of the Ag–In–Se photovoltaic material system S Chen, J Chang, S Tseng, L Chang, J Lin Journal of Alloys and Compounds 656, 58-66, 2016 | 11 | 2016 |
| Factors affecting evolutions of contact area formation and bonding strength in pure Cu/Cu joints produced by ultrasonic spot welding KC Hu, IC Lin, ZY Liu, JY Lin Science and Technology of Welding and Joining 28 (8), 718-727, 2023 | 7 | 2023 |
| Improved interfacial strength of Ti/Ti ultrasonic welds by introducing α/β/α heterogeneous bonding interface JY Lin, KC Hu, TL Hsieh, HE Chu Scripta Materialia 237, 115724, 2023 | 6 | 2023 |
| Interfacial reactions in In/Ag2Se couples S Chen, J Chang, C Hsu, J Lin, C Wang Materials Chemistry and Physics 162, 11-14, 2015 | 5 | 2015 |
| Interfacial strength saturation due to local melting at bonding interface in ultrasonic welding of 7075 aluminum alloy to 316L stainless steel HY Chiu, JR Huang, JY Lin Materials Letters 362, 136249, 2024 | 3 | 2024 |
| Investigation of work hardening behavior in multilayered steels architected by twinning induced plasticity steel and martensitic steel during uniaxial tension M Liu, JY Lin, S Nambu, P Wang, HL Chen, SE Shin, L Zhang, T Koseki Materials Science and Engineering: A 811, 140996, 2021 | 3 | 2021 |
| Study of deformation behaviors of martensitic steel quenched at ultralow temperature M Liu, J Lin, P Wang, SE Shin, S Nambu, L Zhang, T Koseki Materials Science and Engineering: A 785, 139399, 2020 | 3 | 2020 |
| Impact of austenite nanograins induced by sliding friction on interfacial strength during ultrasonic welding HE Chu, YH Sun, TC Chen, HW Yen, JY Lin Science and Technology of Welding and Joining 29 (1), 3-11, 2024 | 2 | 2024 |
| Ag whisker formation in Ag-In-Se alloys S Chen, JY Lin, C Hsu, J Chang, JG Duh, C Wang Metallurgical and Materials Transactions A 44, 5281-5283, 2013 | 2 | 2013 |
| Improving interfacial strength at room and elevated temperatures in ultrasonic welding of pure titanium: Interlayer-induced phase transformation and concentrated plastic … KC Hu, TL Hsieh, JY Lin Materials Science and Engineering: A 902, 146629, 2024 | 1 | 2024 |
| Enhanced strength of ultrasonically-welded austenitic stainless steels joints by introducing dynamic recrystallization of interlayers YT Chung, HE Chu, YH Juan, YL Yang, JY Lin Scientific Reports 14 (1), 17925, 2024 | | 2024 |
Toshihiko Koseki在 material.t.u-tokyo.ac.jp 的电子邮件经过验证
