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Hanjin Lim
Hanjin Lim
在 samsung.com 的电子邮件经过验证
标题
引用次数
引用次数
年份
Capacitor that includes dielectric layer structure having plural metal oxides doped with different impurities
K Park, J Insang, LIM HanJin, Y Lee, J Lee
US Patent 8,698,221, 2014
3492014
Storage electrode of a semiconductor memory device
YS Yu, SS Kim, KH Hwang, HJ Lim, SJ Choi
US Patent 6,809,363, 2004
722004
Conduction barrier offset engineering for DRAM capacitor scaling
M Pešić, S Knebel, K Cho, C Jung, J Chang, H Lim, N Kolomiiets, ...
Solid-State Electronics 115, 133-139, 2016
452016
5.6 A 1/2.65 in 44Mpixel CMOS image sensor with 0.7 µm pixels fabricated in advanced full-depth deep-trench isolation technology
HC Kim, J Park, I Joe, D Kwon, JH Kim, D Cho, T Lee, C Lee, H Park, ...
2020 IEEE International Solid-State Circuits Conference-(ISSCC), 104-106, 2020
442020
Low leakage ZrO2 based capacitors for sub 20 nm dynamic random access memory technology nodes
M Pešić, S Knebel, M Geyer, S Schmelzer, U Böttger, N Kolomiiets, ...
Journal of Applied Physics 119 (6), 2016
432016
METHOD OF FORMING A SEMICONDUCTOR DEVICE
H Lim, S Nam, J Chung, K Yoon, J Seo, J Lee, S Bae, Lim, Hanjin
US Patent 20,100,112,777, 2010
39*2010
Methods of manufacturing semiconductor devices having a ruthenium layer via atomic layer deposition and associated apparatus and devices
KH Lee, C Yoo, H Lim, JI Lee, SJ Chung
US Patent App. 10/801,208, 2004
372004
Growth and characterization of Pb (Mg1/3Nb2/3) O3 and Pb (Mg1/3Nb2/3) O3–PbTiO3 thin films using solid source MOCVD techniques
SY Lee, MCC Custodio, HJ Lim, RS Feigelson, JP Maria, ...
Journal of crystal growth 226 (2-3), 247-253, 2001
372001
5.5 A 2.1e Temporal Noise and −105dB Parasitic Light Sensitivity Backside-Illuminated 2.3µm-Pixel Voltage-Domain Global Shutter CMOS Image Sensor Using …
J Lee, SS Kim, IG Baek, H Shim, T Kim, T Kim, J Kyoung, D Im, J Choi, ...
2020 IEEE International Solid-State Circuits Conference-(ISSCC), 102-104, 2020
362020
Methods of forming low leakage currents metal-insulator-metal (MIM) capacitors and related MIM capacitors
KH Lee, JY Kim, SJ Chung, KH Cho, H Lim, JI Lee, K Kim, J Lim
US Patent 7,271,055, 2007
322007
Methods of fabricating semiconductor devices using nanowires
H Park, DH Im, SG Lee, JM Lee, H Lim
US Patent 9,543,196, 2017
282017
Semiconductor devices including diffusion barriers with high electronegativity metals
H Lim, YS Kim, H Park, SG Lee, CHO Eun-Ae, CM Cho, S Kim, SW Nam
US Patent 9,455,259, 2016
272016
Ultra-thin ZrO2/SrO/ZrO2 insulating stacks for future dynamic random access memory capacitor applications
S Knebel, M Pešić, K Cho, J Chang, H Lim, N Kolomiiets, VV Afanas' ev, ...
Journal of Applied Physics 117 (22), 2015
252015
Low-temperature-atomic-layer-deposition of SiO2 using various organic precursors
S Ahn, Y Kim, S Kang, K Im, H Lim
Journal of Vacuum Science & Technology A 35 (1), 2017
232017
Semiconductor devices having a silicon-germanium channel layer and methods of forming the same
Y Kim, H An, YEO Jaehyun, IM Badro, LIM HanJin, S Jang, J Insang
US Patent 9,305,928, 2016
222016
Depth resolved band alignments of ultrathin TiN/ZrO2 and TiN/ZrO2-Al2O3-ZrO2 dynamic random access memory capacitors
SY Lee, J Chang, Y Kim, HJ Lim, H Jeon, H Seo
Applied Physics Letters 105 (20), 2014
222014
Low temperature crystallized Ta2O5/Nb2O5 bi-layers integrated into RIR capacitor for 60 nm generation and beyond
K Cho, J Lee, JS Lim, H Lim, J Lee, S Park, CY Yoo, ST Kim, UI Chung, ...
Microelectronic engineering 80, 317-320, 2005
222005
Fabrication of metal/graphene hybrid interconnects by direct graphene growth and their integration properties
CS Lee, KW Shin, HJ Song, H Park, Y Cho, DH Im, H Lee, JH Lee, ...
Advanced Electronic Materials 4 (6), 1700624, 2018
212018
Toward Advanced High‐k and Electrode Thin Films for DRAM Capacitors via Atomic Layer Deposition
SE Kim, JY Sung, JD Jeon, SY Jang, HM Lee, SM Moon, JG Kang, HJ Lim, ...
Advanced Materials Technologies 8 (20), 2200878, 2023
202023
Epitaxial integration and properties of SrRuO3 on silicon
Z Wang, HP Nair, GC Correa, J Jeong, K Lee, ES Kim, CS Lee, HJ Lim, ...
APL Materials 6 (8), 2018
202018
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