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| Inhibiting Leidenfrost phenomenon with granulated polymer film C Pang, X Wu, W Li, L Wang, SP Feng Materials Today Physics 46, 101497, 2024 | | 2024 |
| Water-and heat-activated dynamic passivation for perovskite photovoltaics WT Wang, P Holzhey, N Zhou, Q Zhang, S Zhou, EA Duijnstee, ... Nature, 1-2, 2024 | | 2024 |
| Defect-induced Dipole Moment Change of Passivators for Improving the Performance of Perovskite Photovoltaics W. T. Wang, C. H. Chiang, Q. Zhang, Y. Mu, C. G. Wu, S. P. Feng ACS Energy Letters 9 (6), 2982–2989, 2024 | | 2024 |
| Tin Oxide/Amphiphilic Polymer Double-Layered Hole Transporter for High-Efficiency Tin Perovskite Solar Modules Chien-Hung Chiang, Hung-Tse Chen, Wun-Yu Chen, Wei-Ting Wang, Shien-Ping ... Advanced Energy Materials, 2400346, 2024 | | 2024 |
| Substrate Modifications for Stability Improvements of Flexible Perovskite Solar Cells J. Lin, Y. He, A. Khaleed, Z. Ren, Y. Li, Y. Cao, J. Tang, W. T. Wang, S. P ... Energy Technology, 2300958, 2024 | 2 | 2024 |
| Modulation of radical intermediates in rechargeable organic batteries S Gu, J Chen, I Hussain, Z Wang, X Chen, M Ahmad, SP Feng, Z Lu, ... Advanced Materials 36 (17), 2306491, 2024 | 5 | 2024 |
| Dynamic urea bond-based passivators of perovskite SP Feng, WT Wang US Patent App. 18/272,356, 2024 | | 2024 |
| 具有納米孿晶輔助的結構上穩定的銅結構的 IC 封裝 SJ CHERNG, CC CHUNG, SP FENG, MU Kaiyu | | 2024 |
| Energy Harvesting from Acid Mine Drainage Using a Highly Proton/Ion-selective Thin Polyamide Film S. Zhou, Y. Mei, W. Yang, C. Jiang, H. Guo, S. P. Feng, C. Y. Tang Water Research 255, 121530, 2024 | | 2024 |
| Roll-to-roll fabrication of lithium metal anodes with hierarchical lithiophilic structures and controlled deposition for enhanced stability G Peng, G Wang, AR Akbar, D Zheng, W Wang, L Huang, C Chen, G Luo, ... Energy Storage Materials 66, 103205, 2024 | 1 | 2024 |
| Ic Package With Nanotwinning-Assisted Structurally Stable Copper Structure SJ CHERNG, CC CHUNG, SP FENG, MU Kaiyu | | 2024 |
| Cu-cu direct welding for packaging application in semiconductor industry M Huang, SP Feng US Patent App. 18/336,722, 2024 | | 2024 |
| Cu-cu direct welding for packaging application in semiconductor industry M Huang, SP Feng US Patent App. 18/267,492, 2023 | | 2023 |
| Synergistic role of Cu-C and Cu-N dual bonding of nanostructured g-C3N4/Cu2SnS3 photocatalysts for efficient CO2 conversion to CO HAE Omr, R Putikam, SP Feng, MC Lin, H Lee Applied Catalysis B: Environmental 339, 123103, 2023 | 20 | 2023 |
| A Self-Assembled 3D/0D Quasi-Core–Shell Structure as Internal Encapsulation Layer for Stable and Efficient FAPbI3 Perovskite Solar Cells and Modules Y. Wang, C. Yang, Z. Wang, G. Li, Z. Yang, X. Wen, X. Hu, Y. Jiang, S. P ... Small, 2306954, 2023 | 1* | 2023 |
| Nanotwinning-assisted structurally stable copper for fine-pitch redistribution layer in 2.5 D/3D IC packaging C Chen, SJ Cherng, C He, CC Chung, S Wang, YT Huang, SP Feng Journal of Materials Research and Technology 27, 4883-4890, 2023 | 2 | 2023 |
| Polymeric carbon nitride loaded with atomic Cu sites for improved CO2 photocatalytic conversion performance Z Wang, M Zhang, J Hu, Z Li, W Zhang, J Zhang, Z Wang, X Guo, C Yan, ... Journal of Power Sources 577, 233188, 2023 | 2 | 2023 |
| A Gradient Lithiophilic Structure for Stable Lithium Metal Anodes with Ultrahigh Rate and Ultradeep Capacity G Peng, Q Zheng, G Luo, D Zheng, S P Feng, U Khan, A R Akbar, H Luo, F Liu Small, 2303787, 2023 | 7 | 2023 |
| Ultrasensitive Flexible Thermal Sensor Arrays based on High-Thermopower Ionic Thermoelectric Hydrogel Y Han, H Wei, Y Du, Z Li, S P Feng, B Huang, D Xu Advanced Science, 2302685, 2023 | 14 | 2023 |
Bed R PoudelPenn State University在 psu.edu 的电子邮件经过验证
