| MXenes with ordered triatomic-layer borate polyanion terminations D Li, W Zheng, SM Gali, K Sobczak, M Horák, J Polčák, N Lopatik, Z Li, ... Nature Materials, 1-8, 2024 | | 2024 |
| Microcracking in On-Chip Interconnect Stacks: FEM Simulation and Concept for Fatigue Test S Weitz, A Clausner, E Zschech Journal of Electronic Materials, 1-9, 2024 | | 2024 |
| Laboratory High-Contrast X-ray Microscopy of Copper Nanostructures Enabled by a Liquid-Metal-Jet X-ray Source K Kutukova, B Lechowski, J Grenzer, P Krueger, A Clausner, E Zschech Nanomaterials 14 (5), 448, 2024 | | 2024 |
| Laboratory X-ray Microscopy of 3D Nanostructures in the Hard X-ray Regime Enabled by a Combination of Multilayer X-ray Optics B Lechowski, K Kutukova, J Grenzer, I Panchenko, P Krueger, A Clausner, ... Nanomaterials 14 (2), 233, 2024 | 1 | 2024 |
| (Invited) Nano X-Ray Tomographic Imaging for Mechanically Robust 3D Integrated Circuits E Zschech, K Kutukova 244th ECS Meeting (October 8-12, 2023), 2023 | | 2023 |
| Adhesion experiments on Cu-Damascene processed interconnect structures for mode III loading W Heyn, H Melzner, K Goller, S Ananiev, J Zechner, A Clausner, ... Microelectronics Reliability 148, 115161, 2023 | | 2023 |
| 3D Multi-Ion Corrosion Model in Hierarchically Structured Cementitious Materials Obtained from Nano-XCT Data K Szyszkiewicz-Warzecha, J Stec, J Deja, A Łagosz, A Górska, ... Materials 16 (14), 5094, 2023 | | 2023 |
| Mechanical BEoL Robustness Evaluation Using Variable Loading Strategies and Acoustic Emission Damage Monitoring A Clausner, J Silomon, D Chimeg, E Zschech 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE …, 2023 | | 2023 |
| Mechanical Robustness of Patterned Structures and Failure Mechanisms E Zschech, MR Elizalde More-than-Moore Devices and Integration for Semiconductors, 157-189, 2023 | | 2023 |
| Ultrathin positively charged electrode skin for durable anion-intercalation battery chemistries D Sabaghi, Z Wang, P Bhauriyal, Q Lu, A Morag, D Mikhailovia, ... Nature communications 14 (1), 760, 2023 | 17 | 2023 |
| Towards monitored tomographic reconstruction: algorithm-dependence and convergence KB Bulatov, AS Ingacheva, MI Gilmanov, K Kutukova, ZV Soldatova, ... Компьютерная оптика 47 (4), 658-667, 2023 | | 2023 |
| Spectromicroscopy of Nanoscale Materials in the Tender X‐Ray Regime Enabled by a High Efficient Multilayer‐Based Grating Monochromator S Werner, P Guttmann, F Siewert, A Sokolov, M Mast, Q Huang, Y Feng, ... Small Methods 7 (1), 2201382, 2023 | 8 | 2023 |
| Micromechanical BEoL robustness evaluation methods enabling loading condition customization and acoustic emission damage monitoring J Silomon, D Chimeg, A Clausner, E Zschech MethodsX 10, 102028, 2023 | 3 | 2023 |
| Micromechanical adhesion experiments and simulation on Cu-damascene processed test devices W Heyn, S Ananiev, H Melzner, K Goller, J Zechner, A Clausner, ... IEEE Transactions on Device and Materials Reliability 23 (1), 80-88, 2022 | 1 | 2022 |
| Investigation of the filling of a porous ceramic matrix by molten salts using nano X-ray tomography J Milewski, K Kutukova, J Gluch, K Futyma, E Zschech Energy Reports 8, 1440-1449, 2022 | 2 | 2022 |
| Three-dimensional morphology comparison of the diatoms in both wet and dry states Q Li, E Zschech European School for Young Scientists, 9, 2022 | | 2022 |
| In-situ TEM study of mechanical failure on two-dimensional covalent organic framework B Zhang, Z Liao, X Liu, W Li, E Zschech European School for Young Scientists, 15, 2022 | | 2022 |
| In-situ X-ray tomographic imaging and controlled steering of microcracks in 3D nanopatterned structures K Kutukova, J Gluch, M Kraatz, A Clausner, E Zschech Materials & Design 221, 110946, 2022 | 8 | 2022 |
| BEoL stack robustness investigations utilizing Cu-pillar immobilization and micromechanical loading methods J Silomon, D Chimeg, J Gluch, A Clausner, E Zschech Microelectronics Reliability 136, 114597, 2022 | 3 | 2022 |
| Interfacial synthesis of crystalline quasi-two-dimensional polyaniline thin films for high-performance flexible on-chip micro-supercapacitors T Zhang, P Zhang, Z Liao, F Wang, J Wang, M Wang, E Zschech, ... Chinese Chemical Letters 33 (8), 3921-3924, 2022 | 13 | 2022 |
