'Dog-bone'geometry modeling based on PEEC for package PDN T Tao, H Ma, C Huang, YS Cao, JL Drewniak, E Li 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2017 | 1 | 2017 |
2-Port GSG probe calibration using TRL and 16-term error model up to 100GHz J Chen, L Zhang, D Li, J Zhou, C Wu, L Jiang, EP Li 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2022 | 1 | 2022 |
2.5 D methodologies for electronic package and PCB modeling: Review and latest development EX Liu, XC Wei, EP Li 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016 | 5 | 2016 |
2012 Asia-Pacific EMC Symposium in Singapore EP Li IEEE Electromagnetic Compatibility Magazine 1 (3), 72-77, 2012 | | 2012 |
2018 Joint IEEE EMC and APEMC symposium in Singapore EX Liu, EP Li IEEE Electromagnetic Compatibility Magazine 7 (3), 96-100, 2018 | | 2018 |
3D hybrid plasmonic waveguide components with outstanding performance HS Chu, EP Li, P Bai, WJR Hoefer 2010 OSA Optics & Photonics Congress Dig., Paper JTuA4, Tucson, AZ, 2010 | 1 | 2010 |
3D Intelligent Cloaked Vehicle Equipped with Thousand‐Level Reconfigurable Full‐Polarization Metasurfaces Z Wang, C Qian, P Lin, B Zheng, G Kim, J Noh, E Li, J Rho, H Chen Advanced Materials, 2400797, 2024 | | 2024 |
3D modeling of photonic devices using dynamic thermal electron quantum medium finite-different time-domain (DTEQM-FDTD) method EH Khoo, ST Ho, I Ahmed, EP Li, YY Huang 2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics …, 2008 | 1 | 2008 |
3D to 2D transformation solution of transient eddy current electromagnetic fields in an actuator E Li, PM McEwan IEEE transactions on magnetics 29 (2), 1733-1736, 1993 | 5 | 1993 |
3D Visible‐light invisibility cloak B Zheng, R Zhu, L Jing, Y Yang, L Shen, H Wang, Z Wang, X Zhang, X Liu, ... Advanced Science 5 (6), 1800056, 2018 | 34 | 2018 |
585nm 脉冲染料激光治疗鲜红斑痣 2317 例回顾性分析 左亚刚, 王家璧, 姜国调, 刘跃华, 晋红中, 王宏伟, 马东来, 李红春 中国医学科学院学报 28 (2), 206-209, 2006 | 16 | 2006 |
A 2.5-D angularly stable frequency selective surface using via-based structure for 5G EMI shielding D Li, TW Li, EP Li, YJ Zhang IEEE Transactions on Electromagnetic Compatibility 60 (3), 768-775, 2017 | 158 | 2017 |
A 2D Time Domain Method for Electrical Analysis of Electronic Packages EX Liu, X Wei, ZZ Oo, EP Li 2008 10th Electronics Packaging Technology Conference, 254-259, 2008 | 1 | 2008 |
A broadband and tunable absorber with non-volatile floating-gate graphene structure Z Ye, R Hao, X Peng, E Li 2017 16th International Conference on Optical Communications and Networks …, 2017 | | 2017 |
A broadband fluorographene photodetector S Du, W Lu, A Ali, P Zhao, K Shehzad, H Guo, L Ma, X Liu, X Pi, P Wang, ... Advanced Materials 29 (22), 1700463, 2017 | 133 | 2017 |
A broadband out-of-phase power divider for high power applications using through ground via (TGV) YL Lu, GL Dai, X Wei, E Li Progress In Electromagnetics Research 137, 653-667, 2013 | 23 | 2013 |
A CAD TOOL TO STUDY THERMAL DISTRIBUTION FOR BLOCK LEVEL PLACEMENT IN EMBEDDED SYSTEMS RM PATRIKAR, K MURALI, ERP LI Recent Advances In Computational Science And Engineering, 247-250, 2002 | | 2002 |
A circuit method to integrate metamaterial and graphene in absorber design Z Wang, M Zhou, X Lin, H Liu, H Wang, F Yu, S Lin, E Li, H Chen Optics Communications 329, 76-80, 2014 | 61 | 2014 |
A Circuit Model for Electromagnetic Suppressing Spurious Noise of Synchronous DC-DC Buck Convertor X Li, K Wang, E Li 2021 Photonics & Electromagnetics Research Symposium (PIERS), 492-496, 2021 | 1 | 2021 |
A circuit-oriented model for gapped power-ground planes GP Zou, X Cui, GX Luo, EP Li IET Digital Library, 2009 | | 2009 |