Silicon photonics R&D and manufacturing on 300-mm wafer platform F Boeuf, S Cremer, E Temporiti, M Fere, M Shaw, C Baudot, N Vulliet, ... Journal of lightwave technology 34 (2), 286-295, 2015 | 123 | 2015 |
Recent progress in silicon photonics R&D and manufacturing on 300mm wafer platform F Bœuf, S Cremer, E Temporiti, M Fere, M Shaw, N Vulliet, B Orlando, ... Optical Fiber Communication Conference, W3A. 1, 2015 | 85 | 2015 |
Full InGaN red (625 nm) micro-LED (10 μm) demonstration on a relaxed pseudo-substrate A Dussaigne, P Le Maitre, H Haas, JC Pillet, F Barbier, A Grenier, N Michit, ... Applied Physics Express 14 (9), 092011, 2021 | 62 | 2021 |
A silicon photonics technology for 400 Gbit/s applications F Boeuf, A Fincato, L Maggi, JF Carpentier, P Le Maitre, M Shaw, ... 2019 IEEE international electron devices meeting (IEDM), 33.1. 1-33.1. 4, 2019 | 24 | 2019 |
Impact of process variability of active ring resonators in a 300mm silicon photonic platform P Le Maître, JF Carpentier, C Baudot, N Vulliet, A Souhaité, JB Quélène, ... 2015 European Conference on Optical Communication (ECOC), 1-3, 2015 | 22 | 2015 |
Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack M Brocard, P Le Maître, C Bermond, P Bar, R Anciant, A Farcy, T Lacrevaz, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 665-672, 2012 | 22 | 2012 |
20Gb/s PAM-4 transmission from 35 to 90° C by modulating a silicon ring resonator modulator with 2Vpp O Dubray, S Menezo, B Blampey, P Le Maitre, JF Carpentier, BB Bakir, ... Optical Fiber Communication Conference, W2A. 31, 2015 | 19 | 2015 |
Experimental and theoretical investigation of 2D nanoplatelet-based conversion layers for color LED microdisplays E Quesnel, A Suhm, M Consonni, M Reymermier, G Lorin, C Laugier, ... Optics Express 29 (13), 20498-20513, 2021 | 13 | 2021 |
Influence of shape and size on GaN/InGaN μLED light emission: A competition between sidewall defects and light extraction efficiency P González-Izquierdo, N Rochat, D Zoccarato, F Rol, J Simon, P Le Maitre, ... ACS Photonics 10 (11), 4031-4037, 2023 | 11 | 2023 |
Silicon photonics research and manufacturing using a 300-mm wafer platform F Bœuf, JF Carpentier, C Baudot, P Le Maitre, JR Manouvrier Silicon Photonics III: Systems and Applications, 277-315, 2016 | 9 | 2016 |
A sub-pJ/bit, low-ER Mach–Zehnder-based transmitter for chip-to-chip optical interconnects A Michard, JF Carpentier, N Michit, P Le Maître, P Bénabès, PM Ferreira IEEE Journal of Selected Topics in Quantum Electronics 26 (2), 1-10, 2019 | 8 | 2019 |
Opto electrical test measurement system for integrated photonic devices and circuits P Grosse, P Le Maitre, JF Carpentier US Patent 10,180,373, 2019 | 7 | 2019 |
Carrier depletion silicon ring modulator power penalty versus power coupling coefficient JB Quélène, A Michard, N Michit, JF Carpentier, PL Maître, YL Guennec Journal of Lightwave Technology 36 (14), 3023-3029, 2018 | 7 | 2018 |
RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits C Bermond, M Brocard, T Lacrevaz, A Farcy, P Le Maître, P Leduc, ... Microelectronic engineering 130, 74-81, 2014 | 6 | 2014 |
Device and electromagnetic co-simulation of TSV: Substrate noise study and compact modeling of a TSV in a matrix P Le Maitre, M Brocard, A Farcy, JC Marin Thirteenth International Symposium on Quality Electronic Design (ISQED), 404-411, 2012 | 6 | 2012 |
Optimization of power coupling coefficient of a carrier depletion silicon ring modulator for WDM optical transmissions JB Quélène, JF Carpentier, Y Le Guennec, P Le Maître 2016 IEEE Optical Interconnects Conference (OI), 106-107, 2016 | 4 | 2016 |
RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits M Brocard, C Bermond, T Lacrevaz, A Farcy, P Le Maître, P Scheer, ... 2013 IEEE International 3D Systems Integration Conference (3DIC), 1-8, 2013 | 4 | 2013 |
O-band 50Gb/s ring modulator in a 300mm Si photonic platform A Michard, N Michit, JF Carpentier, P Le Maître, JB Quélène, PM Ferreira 2018 European Conference on Optical Communication (ECOC), 1-3, 2018 | 3 | 2018 |
Opto electrical test measurement system for integrated photonic devices and circuits P Grosse, P Le Maitre, JF Carpentier US Patent 10,677,684, 2020 | 2 | 2020 |
Semiconductor device and wafer with reference circuit and related methods JF Carpentier, P Le Maitre, JR Manouvrier, C Baudot, B Borot US Patent 10,274,395, 2019 | 2 | 2019 |