| Flexible and stretchable electronics for wearable health devices J Van Den Brand, M de Kok, M Koetse, M Cauwe, R Verplancke, ... Solid-State Electronics 113, 116-120, 2015 | 153 | 2015 |
| Dual-band (28, 38) GHz coupled quarter-mode substrate-integrated waveguide antenna array for next-generation wireless systems T Deckmyn, M Cauwe, DV Ginste, H Rogier, S Agneessens IEEE Transactions on Antennas and Propagation 67 (4), 2405-2412, 2019 | 109 | 2019 |
| A novel 60 GHz wideband coupled half-mode/quarter-mode substrate integrated waveguide antenna T Deckmyn, S Agneessens, ACF Reniers, AB Smolders, M Cauwe, ... IEEE Transactions on Antennas and Propagation 65 (12), 6915-6926, 2017 | 79 | 2017 |
| Broadband material parameter characterization for practical high-speed interconnects on printed circuit board M Cauwe, J De Baets IEEE Transactions on Advanced Packaging 31 (3), 649-656, 2008 | 56 | 2008 |
| Cost-effective high-performance air-filled SIW antenna array for the global 5G 26 GHz and 28 GHz bands IL de Paula, S Lemey, D Bosman, Q Van den Brande, O Caytan, ... IEEE Antennas and Wireless Propagation Letters 20 (2), 194-198, 2020 | 54 | 2020 |
| Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending DA Van Den Ende, HJ Van De Wiel, RHL Kusters, A Sridhar, JFM Schram, ... Microelectronics Reliability 54 (12), 2860-2870, 2014 | 53 | 2014 |
| Industrial and technical aspects of chip embedding technology A Ostmann, D Manessis, J Stahr, M Beesley, M Cauwe, J De Baets 2008 2nd Electronics System-Integration Technology Conference, 315-320, 2008 | 37 | 2008 |
| Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide L Wang, T Sterken, M Cauwe, D Cuypers, J Vanfleteren IEEE Transactions on Components, Packaging and Manufacturing technology 2 (7 …, 2012 | 36 | 2012 |
| Ultra-Long-Term Reliable Encapsulation Using an Atomic Layer Deposited HfO2/Al2O3/HfO2 Triple-Interlayer for Biomedical Implants C Li, M Cauwe, Y Yang, D Schaubroeck, L Mader, M Op de Beeck Coatings 9 (9), 579, 2019 | 28 | 2019 |
| Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils M Cauwe, B Vandecasteele, A Gielen, J De Baets, J van den Brand, ... 18th European Microelectronics & Packaging Conference, 1-6, 2011 | 25 | 2011 |
| Novel interconnect methodologies for ultra-thin chips on foils A Sridhar, M Cauwe, H Fledderus, RHL Kusters, J van den Brand 2012 IEEE 62nd Electronic Components and Technology Conference, 238-244, 2012 | 23 | 2012 |
| Polyimide-ald-polyimide layers as hermetic encapsulant for implants D Schaubroeck, R Verplancke, M Cauwe, D Cuypers, K Baumans, ... XXXI international conference on surface modification technologies (SMT31), 1-6, 2017 | 21 | 2017 |
| Flexible and stretchable electronics for wearable healthcare J van den Brand, M de Kok, A Sridhar, M Cauwe, R Verplancke, F Bossuyt, ... 2014 44th European Solid State Device Research Conference (ESSDERC), 206-209, 2014 | 20 | 2014 |
| Development of an active high-density transverse intrafascicular micro-electrode probe R Verplancke, M Cauwe, D Schaubroeck, D Cuypers, B Vandecasteele, ... Journal of Micromechanics and Microengineering 30 (1), 015010, 2019 | 19 | 2019 |
| Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves MO de Beeck, R Verplancke, D Schaubroeck, D Cuypers, M Cauwe, ... 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017 | 19 | 2017 |
| Sensitivity analysis of broadband on-wafer dielectric spectroscopy of yeast cell suspensions up to 110 GHz S Liu, I Ocket, M Cauwe, D Schreurs, B Nauwelaers IEEE Microwave and Wireless Components Letters 25 (3), 199-201, 2015 | 18 | 2015 |
| A conformable active matrix LED display A Tripathi, E Smits, JL Van Der Steen, M Cauwe, R Verplancke, K Myny, ... International meeting on information displays, 2015 | 18 | 2015 |
| High-yield fabrication process for 3D-stacked ultrathin chip packages using photo-definable polyimide and symmetry in packages S Priyabadini, T Sterken, M Cauwe, L Van Hoorebeke, J Vanfleteren IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2013 | 18 | 2013 |
| Flipchip bonding of thin Si dies onto PET foils: possibilities and applications J van den Brand, R Kusters, M Cauwe, D van den Ende, M Erinc 18th European Microelectronics & Packaging Conference, 1-6, 2011 | 18 | 2011 |
| Intraneural active probe for bidirectional peripheral nerve interface M Ballini, J Bae, N Marrocco, R Verplancke, D Schaubroeck, D Cuypers, ... 2017 Symposium on VLSI Circuits, C50-C51, 2017 | 17 | 2017 |
Johan De Baetsimec, University Gent, CMST在 UGent.be 的电子邮件经过验证
