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E. Todd Ryan
标题
引用次数
引用次数
年份
Low dielectric constant materials for ULSI interconnects
M Morgen, ET Ryan, JH Zhao, C Hu, T Cho, PS Ho
Annual Review of Materials Science 30 (1), 645-680, 2000
5142000
Positronium annihilation in mesoporous thin films
DW Gidley, WE Frieze, TL Dull, AF Yee, ET Ryan, HM Ho
Physical Review B 60 (8), R5157, 1999
3631999
Methods of forming graphene liners and/or cap layers on copper-based conductive structures
ET Ryan, Z Krivokapic, X Zhang, C Witt, M He, L Zhao
US Patent App. 13/684,871, 2014
3312014
Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art
A Grill, SM Gates, TE Ryan, SV Nguyen, D Priyadarshini
Applied Physics Reviews 1 (1), 2014
3052014
Properties of nanoporous silica thin films determined by high-resolution x-ray reflectivity and small-angle neutron scattering
W Wu, WE Wallace, EK Lin, GW Lynn, CJ Glinka, ET Ryan, HM Ho
Journal of applied physics 87 (3), 1193-1200, 2000
2092000
Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films
JH Zhao, T Ryan, PS Ho, AJ McKerrow, WY Shih
Journal of applied physics 85 (9), 6421-6424, 1999
1761999
Mechanical and dielectric properties of pure-silica-zeolite low-k materials
Z Li, MC Johnson, M Sun, ET Ryan, DJ Earl, W Maichen, JI Martin, S Li, ...
ANGEWANDTE CHEMIE-INTERNATIONAL EDITION IN ENGLISH- 45 (38), 6329, 2006
1502006
Absorption and fluorescence studies of acridine in subcritical and supercritical water
ET Ryan, T Xiang, KP Johnston, MA Fox
The Journal of Physical Chemistry A 101 (10), 1827-1835, 1997
1161997
Endothelium-dependent modulation of angiotensin II-induced contraction in blood vessels
CA Gruetter, ET Ryan, SM Lemke, DA Bailly, MK Fox, DD Schoepp
European journal of pharmacology 146 (1), 85-95, 1988
1061988
Probing diffusion barrier integrity on porous silica low-k thin films using positron annihilation lifetime spectroscopy
JN Sun, DW Gidley, TL Dull, WE Frieze, AF Yee, ET Ryan, S Lin, J Wetzel
Journal of Applied Physics 89 (9), 5138-5144, 2001
862001
Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films
JH Zhao, I Malik, T Ryan, ET Ogawa, PS Ho, WY Shih, AJ McKerrow, ...
Applied Physics Letters 74 (7), 944-946, 1999
831999
Depth-profiling plasma-induced densification of porous low-k thin films using positronium annihilation lifetime spectroscopy
JN Sun, DW Gidley, Y Hu, WE Frieze, ET Ryan
Applied Physics Letters 81 (8), 1447-1449, 2002
802002
Materials Issues and Characterization of Low-k Dielectric Materials
ET Ryan, AJ McKerrow, J Leu, PS Ho
Mrs Bulletin 22 (10), 49-54, 1997
741997
Adjusting the skeleton and pore structure of porous SiCOH dielectrics
SM Gates, G Dubois, ET Ryan, A Grill, M Liu, D Gidley
Journal of the Electrochemical Society 156 (10), G156, 2009
652009
Advanced multilayer dielectric cap with improved mechanical and electrical properties
R Bhatia, G Bonilla, A Grill, JL Herman, S Van Nguyen, ET Ryan, ...
US Patent 7,737,052, 2010
632010
Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage
ET Ryan, SM Gates, A Grill, S Molis, P Flaitz, J Arnold, M Sankarapandian, ...
Journal of Applied Physics 104 (9), 2008
632008
Evaluation of Pore Structure in Pure Silica Zeolite MFI Low-k Thin Films Using Positronium Annihilation Lifetime Spectroscopy
S Li, J Sun, Z Li, H Peng, D Gidley, ET Ryan, Yan
The Journal of Physical Chemistry B 108 (31), 11689-11692, 2004
622004
Interconnects with a dielectric sealant layer
ET Ryan
US Patent 6,919,636, 2005
612005
Ruthenium interconnect resistivity and reliability at 48 nm pitch
X Zhang, H Huang, R Patlolla, W Wang, FW Mont, J Li, CK Hu, EG Liniger, ...
2016 IEEE international interconnect technology conference/advanced …, 2016
542016
Impact of VUV photons on SiO2 and organosilicate low-k dielectrics: General behavior, practical applications, and atomic models
MR Baklanov, V Jousseaume, TV Rakhimova, DV Lopaev, ...
Applied Physics Reviews 6 (1), 2019
532019
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