| Experimental characterization of a nickel alloy-based manifold-microgroove evaporator V Jha, S Dessiatoun, A Shooshtari, ES Al-Hajri, MM Ohadi Heat Transfer Engineering 36 (1), 33-42, 2015 | 26 | 2015 |
| High performance micro-grooved evaporative heat transfer surface for low grade waste heat recovery applications V Jha, S Dessiatoun, M Ohadi, A Shooshtari, E Al-Hajri International Electronic Packaging Technical Conference and Exhibition 44625 …, 2011 | 19 | 2011 |
| Reaction kinetics and rheological model coefficient extraction for epoxy mold compounds ARN Sakib, V Jha, A Mavinkurve, S Chopin 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 4 | 2018 |
| Electro-thermal Simulation of Interconnected Systems at Transient Operating Conditions T Hauck, V Jha, JHJ Janssen International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 3 | 2017 |
| Experimental Characterization of Heat Transfer and Pressure Drop Inside a Tubular Evaporator Utilizing Advanced Microgrooved Surfaces V Jha, S Dessiatoun, M Ohadi, E Al Hajri Journal of Thermal Science and Engineering Applications 4 (4), 041009, 2012 | 2 | 2012 |
| High-performance tubular evaporator utilizing high aspect ratio manifold microchannels VC Jha | 2 | 2012 |
| Reliability assessment of a 28 V DC power module V Jha, FP McCluskey 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 2 | 2010 |
| Thermal modeling improvements using substrate ECAD integration V Jha, T Hauck Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 1 | 2014 |
| Heat transfer and pressure drop characterization of a tubular evaporator using manifold on the microgrooved surfaces V Jha, S Dessiatoun, M Ohadi 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 1 | 2012 |
| Transient Thermal Compact Models Time Integration with Python T Hauck, V Jha 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | | 2019 |
| Virtual Prototyping and Simulation of Electro-Thermal Systems T Hauck, V Jha 2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019 | | 2019 |
| Moldflow simulation of an exposed pad leaded package V Jha, T Hauck International Symposium on Microelectronics 2015 (1), 000179-000184, 2015 | | 2015 |
| Development of tubular evaporator utilizing high aspect ratio microchannels VC Jha University of Maryland, College Park, 2012 | | 2012 |
