| Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys RM Shalaby Materials Science and Engineering: A 560, 86-95, 2013 | 136 | 2013 |
| Effect of rapid solidification and small additions of Zn and Bi on the structure and properties of Sn-Cu eutectic alloy T El-Ashram, RM Shalaby Journal of Electronic Materials 34, 212-215, 2005 | 81 | 2005 |
| Effect of rapid solidification on mechanical properties of a lead free Sn–3.5 Ag solder RM Shalaby Journal of Alloys and Compounds 505 (1), 113-117, 2010 | 70 | 2010 |
| Microstructural and mechanical characterization of melt spun process Sn-3.5 Ag and Sn-3.5 Ag-xCu lead-free solders for low cost electronic assembly RM Shalaby, M Kamal, EAM Ali, MS Gumaan Materials Science and Engineering: A 690, 446-452, 2017 | 51 | 2017 |
| Design and properties of new lead-free solder joints using Sn-3.5 Ag-Cu solder RM Shalaby, M Kamal, EAM Ali, MS Gumaan Silicon 10, 1861-1871, 2018 | 39 | 2018 |
| Influence of indium addition on structure, mechanical, thermal and electrical properties of tin–antimony based metallic alloys quenched from melt RM Shalaby Journal of alloys and compounds 480 (2), 334-339, 2009 | 39 | 2009 |
| Indium, chromium and nickel-modified eutectic Sn–0.7 wt% Cu lead-free solder rapidly solidified from molten state RM Shalaby Journal of Materials Science: Materials in Electronics 26, 6625-6632, 2015 | 38 | 2015 |
| Copper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy MS Gumaan, RM Shalaby, EAM Ali, M Kamal Journal of Materials Science: Materials in Electronics 29, 8886-8894, 2018 | 33 | 2018 |
| Effect of indium content and rapid solidification on microhardness and micro‐creep of Sn‐Zn eutectic lead free solder alloy RM Shalaby Crystal Research and Technology: Journal of Experimental and Industrial …, 2010 | 33 | 2010 |
| Comprehensive study on structure, mechanical and nuclear shielding properties of lead free Sn–Zn–Bi alloys as a powerful radiation and neutron shielding material A Saleh, RM Shalaby, NA Abdelhakim Radiation Physics and Chemistry 195, 110065, 2022 | 31 | 2022 |
| Irradiation, mechanical and structural behaviour of Al-Zn-based alloys rapidly quenched from melt M Kamal, AM Shaban, M El-Kady, R Shalaby Radiation effects and defects in solids 138 (3-4), 307-318, 1996 | 28 | 1996 |
| Nickel effects on the structural and some physical properties of the eutectic Sn-Ag lead-free solder alloy MS Gumaan, RM Shalaby, MK Mohammed Yousef, EAM Ali, ... Soldering & Surface Mount Technology 31 (1), 40-51, 2019 | 23 | 2019 |
| Determination of structure-property of rapidly quenched aluminium-based bearing alloys before and after gamma irradiation M Kamal, AM Shaban, M El-Kady, RM Shalaby 2nd International Conference of Engineering Physics and Mathematics, Faculty …, 1994 | 21 | 1994 |
| Effect of silicon addition on mechanical and electrical properties of Sn–Zn based alloys rapidly quenched from melt RM Shalaby Materials Science and Engineering: A 550, 112-117, 2012 | 18 | 2012 |
| Correlation between thermal diffusivity and activation energy of ordering of lead free solder alloys Sn65−xAg25Sb10Cu x rapidly solidified … RM Shalaby Journal of Materials Science: Materials in Electronics 16, 187-191, 2005 | 18 | 2005 |
| Wettability and electrical properties of Bi-Sn based lead free solders alloys RM Shalaby International Journal of Physics and Research (IJPR) 3 (3), 1-6, 2013 | 16 | 2013 |
| Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy H Al-sorory, MS Gumaan, RM Shalaby Soldering & Surface Mount Technology 35 (1), 18-27, 2023 | 15 | 2023 |
| Rietveld refinement, cation distribution, morphological and magnetic study of NiAlxFe2-xO4 nanoparticles EA Arrasheed, TM Meaz, RM Shalaby, BI Salem, OM Hemeda, ... Applied Physics A 127, 1-10, 2021 | 14 | 2021 |
| Effect of nano-Al2O3 particles on the microstructure and mechanical performance of melt-spun process Sn–3.5Ag composite solder RM Shalaby, H Elzanaty Journal of Materials Science: Materials in Electronics 31 (8), 5907-5913, 2020 | 14 | 2020 |
| Reliable Sn–Ag–Cu lead-free melt-spun material required for high-performance applications MM Jubair, MS Gumaan, RM Shalaby Zeitschrift für Kristallographie-Crystalline Materials 234 (11-12), 757-767, 2019 | 14 | 2019 |
