| Children’s everyday exposure to food marketing: an objective analysis using wearable cameras LN Signal, J Stanley, M Smith, MB Barr, TJ Chambers, J Zhou, A Duane, ... International Journal of Behavioral Nutrition and Physical Activity 14, 1-11, 2017 | 138 | 2017 |
| A micromechanics-based vapor pressure model in electronic packages XJ Fan, J Zhou, GQ Zhang, LJ Ernst | 86 | 2005 |
| Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact JE Luan, TY Tee, E Pek, CT Lim, Z Zhong, J Zhou IEEE Transactions on Components and Packaging Technologies 29 (3), 449-456, 2006 | 85 | 2006 |
| Kids’ Cam: an objective methodology to study the world in which children live LN Signal, MB Smith, M Barr, J Stanley, TJ Chambers, J Zhou, A Duane, ... American journal of preventive medicine 53 (3), e89-e95, 2017 | 78 | 2017 |
| A fully integrated CMOS 900 MHz LNA utilizing monolithic transformers JJ Zhou, DJ Allstot 1998 IEEE International Solid-State Circuits Conference. Digest of Technical …, 1998 | 55 | 1998 |
| Package structural integrity analysis considering moisture X Fan, J Zhou, A Chandra 2008 58th Electronic Components and Technology Conference, 1054-1066, 2008 | 47 | 2008 |
| A simple fabrication of electrospun nanofiber sensing materials based on fluorophore-doped polymer Y Yang, X Fan, Y Long, K Su, D Zou, N Li, J Zhou, K Li, F Liu Journal of Materials Chemistry 19 (39), 7290-7295, 2009 | 45 | 2009 |
| Investigation of nonuniform moisture distribution on determination of hygroscopic swelling coefficient and finite element modeling for a flip chip package J Zhou, SP Lahoti, MP Sitlani, SC Kallolimath, R Putta EuroSimE 2005. Proceedings of the 6th International Conference on Thermal …, 2005 | 43 | 2005 |
| Multi-physics modeling in virtual prototyping of electronic packages––combined thermal, thermo-mechanical and vapor pressure modeling XJ Fan, J Zhou, GQ Zhang Microelectronics Reliability 44 (12), 1967-1976, 2004 | 39 | 2004 |
| 基于重庆主城区居民感知的城市意象元素分析评价 冯维波， 黄光宇 地理研究 9, 2006 | 35 | 2006 |
| Effect of non-uniform moisture distribution on the hygroscopic swelling coefficient J Zhou, JS Law IEEE Transactions on Components and Packaging Technologies 31 (2), 269-276, 2008 | 33 | 2008 |
| Finite element analysis of a bone healing model: 1-year follow-up after internal fixation surgery for femoral fracture Z Jiang-Jun, Z Min, Y Ya-Bo, L Wei, L Ren-Fa, Z Zhi-Yu, C Rong-Jian, ... Pakistan journal of medical sciences 30 (2), 343, 2014 | 32 | 2014 |
| Board-level solder joint reliability analysis of thermally enhanced BGAs and LGAs TY Tee, HS Ng, Z Zhong, J Zhou IEEE Transactions on advanced Packaging 29 (2), 284-290, 2006 | 30 | 2006 |
| Transient analysis on hygroscopic swelling characterization using sequentially coupled moisture diffusion and hygroscopic stress modeling approach J Zhou, TY Tee, X Zhang ASME International Mechanical Engineering Congress and Exposition 42177, 107-114, 2005 | 29 | 2005 |
| Phosphorus exports via overland runoff under different land uses and their seasonal pattern C Gao, J Zhu, J Zhu, Y Hosen, D Wang, J Zhou, X Gao, Y Dou Acta Scientiae Circumstantiae 25 (11), 1543-1549, 2005 | 28 | 2005 |
| The use of wearable cameras in assessing children's dietary intake and behaviours in China Q Zhou, D Wang, CN Mhurchu, C Gurrin, J Zhou, Y Cheng, H Wang Appetite 139, 1-7, 2019 | 25 | 2019 |
| Applying visual user interest profiles for recommendation and personalisation J Zhou, R Albatal, C Gurrin MultiMedia Modeling: 22nd International Conference, MMM 2016, Miami, FL, USA …, 2016 | 24 | 2016 |
| Modeling nonlinear moisture diffusion in inhomogeneous media L Chen, J Zhou, H Chu, G Zhang, X Fan Microelectronics Reliability 75, 162-170, 2017 | 22 | 2017 |
| Novel process warpage modeling of matrix stacked-die BGA X Zhang, TY Tee, J Zhou IEEE Transactions on Advanced Packaging 29 (2), 232-239, 2006 | 22 | 2006 |
| Finite element analysis of thermo-hygro-mechanical failure of a flip chip package SP Lahoti, SC Kallolimath, J Zhou 2005 6th International Conference on Electronic Packaging Technology, 330-335, 2005 | 22 | 2005 |
