| Modeling nonlinear elastic solid with correlated lattice bond cell for dynamic fracture simulation Z Zhang, Y Chen Computer Methods in Applied Mechanics and Engineering 279, 325-347, 2014 | 56 | 2014 |
| A modified Stillinger–Weber potential-based hyperelastic constitutive model for nonlinear elasticity Z Zhang, Y Chen, H Zheng International Journal of Solids and Structures 51 (7-8), 1542-1554, 2014 | 36 | 2014 |
| A constrained intrinsic cohesive finite element method with little stiffness reduction for fracture simulation Z Zhang, Y Chen Engineering Fracture Mechanics 136, 213-225, 2015 | 12 | 2015 |
| Singular enrichment for multi-material corners with application to assessing the risk of fracture in semiconductor devices CP Chen, Y Chen, G Subbarayan Engineering Fracture Mechanics 248, 107739, 2021 | 10 | 2021 |
| A mechanistic model for plastic metal line ratcheting induced BEOL cracks in molded packages CP Chen, Y Chen, G Subbarayan, HY Lin, S Gurrum IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 7 | 2022 |
| Parametric stitching for smooth coupling of subdomains with non-matching discretizations CP Chen, Y Chen, G Subbarayan Computer Methods in Applied Mechanics and Engineering 373, 113519, 2021 | 5 | 2021 |
| Meshfree CAD-CAE Integration through Immersed B-rep model and Enriched Isogeometric Analysis Y Chen, C Jois, G Subbarayan Computer-Aided Design and Applications 17, 1193-1214, 2020 | 4 | 2020 |
| Effect of Elastic-Plastic Anisotropy of Solder Grains on Variability of Cyclic Mechanical Bending Durability in SAC305 CSP Assembly A Bharamgonda, A Dasgupta, A Deshpande, T Hauck, Y Chen 2023 24th International Conference on Thermal, Mechanical and Multi-Physics …, 2023 | 3 | 2023 |
| Damage evolution in sac solder alloys Y Chen, T Hauck, A Fahim, MA Haq, MA Hoque, JC Suhling 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics …, 2022 | 3 | 2022 |
| Dynamic fracture simulation by using a discretized virtual internal bond with a regular hexagon cell Y Chen, Z Zhang International Journal of Computational Methods 14 (06), 1750066, 2017 | 3 | 2017 |
| A Computational Strategy for Code-and Mesh-Agnostic Nonlinear Global–Local Analysis Y Chen, SS Ganti, G Subbarayan IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 2 | 2022 |
| Simulation of dynamic fracture in rock with discretized virtual internal bond Z Zhang, Y Chen, A Ghassemi ARMA US Rock Mechanics/Geomechanics Symposium, ARMA-2014-7101, 2014 | 2 | 2014 |
| Modelling recrystallizaton in oligocrystalline SnAgCu solder joint under cyclic loading condition Y Chen, T Hauck, A Bharamgonda, A Dasgupta 2024 25th International Conference on Thermal, Mechanical and Multi-Physics …, 2024 | 1 | 2024 |
| A continuum damage mechanics approach for the reliability of lead-free solders subjected to cyclic loading GR Mazumder, MA Haq, JC Suhling, P Lall, Y Chen, T Hauck, A Fahim 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 713-720, 2023 | 1 | 2023 |
| Non-Intrusive Two-Way Coupling for Multiscale Analysis of Electronic Packages SS Ganti, Y Chen, G Subbarayan 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 1 | 2022 |
| Shift of die passivation by ratcheting of underlying aluminum bond pads M van Soestbergen, Y Chen, T Hauck 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics …, 2022 | 1 | 2022 |
| Multi-material Corner Singularity in Electronic Packaging: Avoiding Mesh Dependence in Analyzing Stress Y Chen, T Hauck, G Subbarayan 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 240-245, 2024 | | 2024 |
| Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Under Temperature Cycling With a Modified Garofalo Creep Model Based on Bi Concentration S Chakraborty, Y Chen, G Sharma, A Fahim, T Hauck, R Das, A Mahmood, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 506-513, 2024 | | 2024 |
| Modeling the Microstructure of Polycrystalline Sn–Ag–Cu Solders T Hauck, Y Chen, A Dasgupta New Achievements in Mechanics: A Tribute to Klaus Peter Herrmann, 61-74, 2024 | | 2024 |
| Prediction of Variability in Vibration Durability of Oligocrystalline SnAgCu Solder Joints A Bharamgonda, I Olatunji, X Lin, A Dasgupta, Y Chen, V Thukral, ... 2024 25th International Conference on Thermal, Mechanical and Multi-Physics …, 2024 | | 2024 |
