受强制性开放获取政策约束的文章 - Mihai Rotaru了解详情
无法在其他位置公开访问的文章：7 篇
Design and Analysis of 3D Heterogeneous Chiplet Stack for RF Front-End Module Minituarization
MD Rotaru, S Tiwari, P Castillou, CT Chong, CK Jien
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1486-1492, 2023
强制性开放获取政策： A*Star, Singapore
An automatic chip-package co-design flow for multi-core neuromorphic computing SiPs
J Lan, VP Nambiar, R Sabapathy, R Dutta, CT Chong, MD Rotaru, KK Lin, ...
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 77-80, 2020
强制性开放获取政策： A*Star, Singapore
Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration
X Wang, MD Rotaru, Y Haitao, M Jonq, CT Chong, KJ Chui
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 116-119, 2023
强制性开放获取政策： A*Star, Singapore
Assembly Challenges and Approaches for 2.5 D Chiplet Based System
SPS Lim, MD Rotaru, W Seit, HH Yao
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 132-138, 2023
强制性开放获取政策： US Department of Defense
Design of Four-Way Multiplexer with Integrated Lumped Elements for Qubit Characterization
SB Vignesh, MD Rotaru
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 273-277, 2023
强制性开放获取政策： A*Star, Singapore
Characterization of QST substrates at mm-wave frequencies
MD Rotaru, VS Bhaskar, LK Bera, N Singh, MK Han
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 203-207, 2022
强制性开放获取政策： A*Star, Singapore
Design of Compact Microwave Multiplexer for RF Reflectometry Characterization of Silicon-Based Spin Qubits
VS Bhaskar, MD Rotaru
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 962-966, 2022
强制性开放获取政策： A*Star, Singapore
可在其他位置公开访问的文章：6 篇
Analysis and optimization of asymmetrical double-sided electrodynamic suspension devices
J Duan, S Xiao, K Zhang, M Rotaru, JK Sykulski
IEEE Transactions on Magnetics 55 (6), 1-5, 2019
强制性开放获取政策： 国家自然科学基金委员会
Design and development of high density fan-out wafer level package (HD-FOWLP) for deep neural network (DNN) chiplet accelerators using advanced interface bus (AIB)
MD Rotaru, W Tang, D Rahul, Z Zhang
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1258-1263, 2021
强制性开放获取政策： US Department of Defense
Multi‐physics analysis and optimisation of high‐speed train pantograph–catenary systems allowing for velocity skin effect
X Liu, Z Yang, S Xiao, X Duan, G Gao, W Wei, G Wu, M Rotaru, ...
High Voltage 5 (6), 654-661, 2020
强制性开放获取政策： 国家自然科学基金委员会
RF MEMS zipping varactor with high quality factor and very large tuning range
SH Pu, DA Darbyshire, RV Wright, PB Kirby, MD Rotaru, AS Holmes, ...
IEEE Electron Device Letters 37 (10), 1340-1343, 2016
强制性开放获取政策： UK Engineering and Physical Sciences Research Council
NetFlex: A 22nm Multi-Chiplet Perception Accelerator in High-Density Fan-Out Wafer-Level Packaging
T Chou, W Tang, MD Rotaru, C Liu, R Dutta, SLP Siang, DHS Wee, ...
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022
强制性开放获取政策： US Department of Defense
Chiplet-based Architecture Design for Multi-Core Neuromorphic Processor
J Lan, VP Nambiar, R Sabapathy, MD Rotaru, AT Do
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 410-412, 2021
强制性开放获取政策： A*Star, Singapore
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