| A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications A Natarajan, SK Reynolds, MD Tsai, ST Nicolson, JHC Zhan, DG Kam, ... IEEE Journal of Solid-State Circuits 46 (5), 1059-1075, 2011 | 406 | 2011 |
| A fully integrated 16-element phased-array transmitter in SiGe BiCMOS for 60-GHz communications A Valdes-Garcia, ST Nicolson, JW Lai, A Natarajan, PY Chen, ... Solid-State Circuits, IEEE Journal of 45 (12), 2757-2773, 2010 | 294 | 2010 |
| Integrated antenna for RFIC package applications DG Kam, D Liu, SK Reynolds US Patent 8,988,299, 2015 | 155 | 2015 |
| LTCC packages with embedded phased-array antennas for 60 GHz communications DG Kam, D Liu, A Natarajan, S Reynolds, HC Chen, BA Floyd IEEE Microwave and Wireless Components Letters 21 (3), 142-144, 2011 | 141 | 2011 |
| Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure J Shim, DG Kam, JH Kwon, J Kim IEEE Transactions on Electromagnetic Compatibility 52 (3), 566-577, 2010 | 130 | 2010 |
| Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets DG Kam, D Liu, A Natarajan, SK Reynolds, BA Floyd IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 129 | 2011 |
| Is 25 Gb/s on-board signaling viable? DG Kam, MB Ritter, TJ Beukema, JF Bulzacchelli, PK Pepeljugoski, ... IEEE Transactions on advanced packaging 32 (2), 328-344, 2009 | 97 | 2009 |
| Modeling and measurement of simultaneous switching noise coupling through signal via transition J Park, H Kim, Y Jeong, J Kim, JS Pak, DG Kam, J Kim IEEE Transactions on Advanced Packaging 29 (3), 548-559, 2006 | 90 | 2006 |
| Integrated antenna for RFIC package applications DG Kam, D Liu, SK Reynolds US Patent 9,172,132, 2015 | 73 | 2015 |
| Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications A Valdes-Garcia, S Reynolds, A Natarajan, D Kam, D Liu, JW Lai, ... IEEE Communications Magazine 49 (4), 120-131, 2011 | 63 | 2011 |
| A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS SK Reynolds, AS Natarajan, MD Tsai, S Nicolson, JHC Zhan, D Liu, ... 2010 IEEE Radio Frequency Integrated Circuits Symposium, 461-464, 2010 | 61 | 2010 |
| Spread spectrum clock generator with delay cell array to reduce electromagnetic interference J Kim, DG Kam, PJ Jun, J Kim IEEE transactions on electromagnetic compatibility 47 (4), 908-920, 2005 | 58 | 2005 |
| Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission DG Kam, H Lee, J Kim IEEE transactions on advanced packaging 27 (4), 590-596, 2004 | 55 | 2004 |
| Low-cost antenna-in-package solutions for 60-GHz phased-array systems DG Kam, D Liu, A Natarajan, S Reynolds, BA Floyd 19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010 | 51 | 2010 |
| Thermal interface material application for integrated circuit cooling MA Gaynes, DG Kam, D Liu, SK Reynolds US Patent 8,411,444, 2013 | 50 | 2013 |
| Multiport measurement method using a two-port network analyzer with remaining ports unterminated DG Kam, J Kim Microwave and Wireless Components Letters, IEEE 17 (9), 694-696, 2007 | 44 | 2007 |
| 40-Gb/s package design using wire-bonded plastic ball grid array DG Kam, J Kim IEEE Transactions on Advanced Packaging 31 (2), 258-266, 2008 | 42 | 2008 |
| Introducing a Mixed-Mode Matrix for Investigation of Wireless Communication Related to Orbital Angular Momentum W Park, L Wang, HD Brüns, DG Kam, C Schuster IEEE Transactions on Antennas and Propagation 67 (3), 1719-1728, 2019 | 38 | 2019 |
| Biocompatible, optically transparent, patterned, and flexible electrodes and radio-frequency antennas prepared from silk protein and silver nanowire networks K Min, M Umar, H Seo, JH Yim, DG Kam, H Jeon, S Lee, S Kim RSC Advances 7 (1), 574-580, 2017 | 36 | 2017 |
| RF interconnect for multi-Gbit/s board-level clock distribution W Ryu, J Lee, H Kim, S Ahn, N Kim, B Choi, D Kam, J Kim IEEE transactions on advanced packaging 23 (3), 398-407, 2000 | 36 | 2000 |
