受强制性开放获取政策约束的文章 - Serhat Erdogan了解详情
无法在其他位置公开访问的文章:8 篇
Characterization of ABF/glass/ABF substrates for mmWave applications
M ur Rehman, S Ravichandran, AO Watanabe, S Erdogan, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
强制性开放获取政策: US Department of Defense
Packaging approaches for mm wave and sub-THz communication
S Ravichandran, KQ Huang, M ur Rehman, S Erdogan, A Watanabe, ...
2019 IEEE MTT-S International Microwave Conference on Hardware and Systems …, 2019
强制性开放获取政策: US Department of Defense
D-band Quasi-Yagi antenna in glass-based package
S Erdogan, M Swaminathan
2021 IEEE MTT-S International Microwave and RF Conference (IMARC), 1-4, 2021
强制性开放获取政策: US Department of Defense
Integrated and miniaturized quasi Yagi D-band antenna in glass interposer
S Erdogan, KSJ Moon, M Kathaperumal, M Swaminathan
2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 687-690, 2022
强制性开放获取政策: US Department of Defense
D-band integrated and miniaturized quasi-yagi antenna array in glass interposer
S Erdogan, KSJ Moon, M Kathaperumal, M Swaminathan
IEEE Transactions on Terahertz Science and Technology 13 (3), 270-279, 2023
强制性开放获取政策: US Department of Defense
Design and Characterization of Bandpass Filter with Multiple Zeros on Glass Interposer for 6G Applications
X Li, X Jia, S Erdogan, M Swaminathan
2023 IEEE Radio and Wireless Symposium (RWS), 98-100, 2023
强制性开放获取政策: US Department of Defense
Design and Characterization of Metalized Trench Based Waveguide Technology on Glass Interposer for 6G Applications
X Li, X Jia, S Erdogan, M Jordan, M Swaminathan
2023 IEEE/MTT-S International Microwave Symposium-IMS 2023, 684-687, 2023
强制性开放获取政策: US Department of Energy, US Department of Defense
Air Filled SIWs using Laminate Dielectrics on Glass Substrate for D-band Applications
M ur Rehman, LNV Kumar, S Erdogan, M Swaminathan
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024
强制性开放获取政策: US Department of Defense
可在其他位置公开访问的文章:5 篇
W-band and D-band transmission lines on glass based substrates for sub-THz modules
M ur Rehman, S Ravichandran, S Erdogan, M Swaminathan
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 660-665, 2020
强制性开放获取政策: US Department of Defense
Antenna with embedded die in glass interposer for 6g wireless applications
X Jia, X Li, S Erdogan, KS Moon, JW Kim, KQ Huang, MB Jordan, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023
强制性开放获取政策: US Department of Energy, US Department of Defense
Characterization of chip-to-package interconnects for glass panel embedding (GPE) for sub-THz wireless communications
S Erdogan, S Ravichandran, X Jia, M Swaminathan
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2328-2333, 2021
强制性开放获取政策: US Department of Defense
Surrogate Modeling With Complex-Valued Neural Nets for Signal Integrity Applications
O Akinwande, S Erdogan, R Kumar, M Swaminathan
IEEE Transactions on Microwave Theory and Techniques, 2023
强制性开放获取政策: US National Science Foundation
Package Design and Measurements for Radar Emulator using Accelerators and Photonics
M Daniel-Aguebor, MU Rehman, S Erdogan, KSJ Moon, N Ambasana, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1342-1348, 2022
强制性开放获取政策: US National Science Foundation, US Department of Defense
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