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Zunxu Liu (刘尊旭)
Zunxu Liu (刘尊旭)
State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of
在 smail.hust.edu.cn 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
A general solution for the two-dimensional stress analysis of balanced and unbalanced adhesively bonded joints
Z Liu, YA Huang, Z Yin, S Bennati, PS Valvo
International Journal of Adhesion and Adhesives 54, 112-123, 2014
722014
Reliable Peeling of Ultrathin Die With Multineedle Ejector
Z Liu, YA Huang, H Liu, J Chen, Z Yin
Components, Packaging and Manufacturing Technology, IEEE Transactions on 4 …, 2014
372014
Tunable peeling technique and mechanism of thin chip from compliant adhesive tapes
Z Liu, YA Huang, J Chen, Z Yin
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (4 …, 2014
342014
Cohesive failure analysis of an array of IC chips bonded to a stretched substrate
Z Liu, PS Valvo, YA Huang, Z Yin
International Journal of Solids and Structures 50 (22-23), 3528-3538, 2013
302013
Nonlinear characteristics in fracture strength test of ultrathin silicon die
Z Liu, YA Huang, L Xiao, P Tang, Z Yin
Semiconductor Science and Technology 30 (4), 045005, 2015
262015
Theoretical and experimental studies of competing fracture for flexible chip-adhesive-substrate composite structure
Z Liu, X Wan, YA Huang, J Chen, Z Yin
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (1 …, 2017
172017
Vacuum-based picking-up of thin chip from adhesive tape
Z Xu, Z Liu, YA Huang, J Chen, H Liu, Z Yin
Journal of Adhesion Science and Technology 29 (13), 1315-1329, 2015
172015
Experimental estimation of adhesive fracture energy of compliant adhesive tape
Z Liu, P Tang, YA Huang, Z Yin
2014 15th international conference on electronic packaging technology, 842-846, 2014
142014
Competing fracture of thin-chip transferring from/onto prestrained compliant substrate
H Liu, Z Liu, Z Xu, Z Yin, YA Huang, J Chen
Journal of Applied Mechanics 82 (10), 101012, 2015
112015
Analytical Evaluation of Interfacial Crack Propagation in Vacuum-Based Picking-up Process
Z Xu, Z Liu, H Liu, Z Yin, Y Huang, J Chen
IEEE, 2015
112015
Mechanical stability analysis of organic thin film transistors considering interfacial delamination
Z Xu, B Tao, Z Liu
The 8th Annual IEEE International Conference on Nano/Micro Engineered and …, 2013
2013
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