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Hiren Kotadia
Hiren Kotadia
Liverpool John Moores University, University of Warwick; Brunel University London; King's College
在 ljmu.ac.uk 的电子邮件经过验证 - 首页
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引用次数
引用次数
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A review: On the development of low melting temperature Pb-free solders
HR Kotadia, PD Howes, SH Mannan
Microelectronics Reliability 54 (6-7), 1253-1273, 2014
4752014
A review of Laser Powder Bed Fusion Additive Manufacturing of aluminium alloys: Microstructure and properties
HR Kotadia, G Gibbons, A Das, PD Howes
Additive Manufacturing 46, 102155, 2021
3092021
Effect of high-intensity ultrasonic irradiation on the modification of solidification microstructure in a Si-rich hypoeutectic Al–Si alloy
A Das, HR Kotadia
Materials Chemistry and Physics 125 (3), 853-859, 2011
1322011
Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates
HR Kotadia, O Mokhtari, MP Clode, MA Green, SH Mannan
Journal of Alloys and Compounds 511 (1), 176-188, 2012
1272012
Modification of solidification microstructure in hypo-and hyper-eutectic Al–Si alloys under high-intensity ultrasonic irradiation
HR Kotadia, A Das
Journal of Alloys and Compounds 620, 1-4, 2015
702015
On the microstructural refinement in commercial purity Al and Al-10 wt% Cu alloy under ultrasonication during solidification
HR Kotadia, M Qian, DG Eskin, A Das
Materials & Design 132, 266-274, 2017
672017
Effect of Ni alloying on the microstructural evolution and mechanical properties of two duplex light-weight steels during different annealing temperatures: experiment and phase …
A Rahnama, H Kotadia, S Sridhar
Acta Materialia 132, 627-643, 2017
632017
A comparative study of ternary Al–Sn–Cu immiscible alloys prepared by conventional casting and casting under high-intensity ultrasonic irradiation
HR Kotadia, A Das, E Doernberg, R Schmid-Fetzer
Materials Chemistry and Physics 131 (1-2), 241-249, 2011
612011
Reactions of Sn-3.5 Ag-based solders containing Zn and Al additions on Cu and Ni (P) substrates
HR Kotadia, O Mokhtari, M Bottrill, MP Clode, MA Green, SH Mannan
Journal of electronic materials 39, 2720-2731, 2010
602010
Solidification of Al-Sn-Cu based immiscible alloys under intense shearing
HR Kotadia, E Doernberg, JB Patel, Z Fan, R Schmid-Fetzer
Metallurgical and Materials Transactions A 40, 2202-2211, 2009
522009
Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging
SK Bhogaraju, F Conti, HR Kotadia, S Keim, U Tetzlaff, G Elger
Journal of Alloys and Compounds 844, 156043, 2020
392020
Microstructural refinement of Al–10.2% Si alloy by intensive shearing
HR Kotadia, NH Babu, H Zhang, Z Fan
Materials Letters 64 (6), 671-673, 2010
352010
Effects of Fe, Mn, chemical grain refinement and cooling rate on the evolution of Fe intermetallics in a model 6082 Al-alloy
MH Khan, A Das, Z Li, HR Kotadia
Intermetallics 132, 107132, 2021
332021
Performance of dissimilar metal Self-Piercing Riveting (SPR) joint and coating behaviour under corrosive environment
HR Kotadia, A Rahnama, IR Sohn, J Kim, S Sridhar
Journal of Manufacturing Processes 39, 259-270, 2019
312019
Microstructural modification of recycled aluminium alloys by high-intensity ultrasonication: Observations from custom Al–2Si–2Mg–1.2 Fe–(0.5, 1.0) Mn alloys
HR Kotadia, M Qian, A Das
Journal of Alloys and Compounds 823, 153833, 2020
302020
Disabling of nanoparticle effects at increased temperature in nanocomposite solders
O Mokhtari, A Roshanghias, R Ashayer, HR Kotadia, F Khomamizadeh, ...
Journal of electronic materials 41, 1907-1914, 2012
292012
Joining TWIP to TWIP and TWIP to aluminium: A comparative study between joining processes, joint properties and mechanical performance
I Papadimitriou, P Efthymiadis, HR Kotadia, IR Sohn, S Sridhar
Journal of Manufacturing Processes 30, 195-207, 2017
282017
Effect of melt conditioning on heat treatment and mechanical properties of AZ31 alloy strips produced by twin roll casting
S Das, NS Barekar, O El Fakir, L Wang, AKP Rao, JB Patel, HR Kotadia, ...
Materials Science and Engineering: A 620, 223-232, 2015
272015
Additive manufacturing of aluminium alloy 2024 by laser powder bed fusion: microstructural evolution, defects and mechanical properties
M Kumar, GJ Gibbons, A Das, I Manna, D Tanner, HR Kotadia
Rapid Prototyping Journal 27 (7), 1388-1397, 2021
262021
Electromigration in Sn–Ag solder thin films under high current density
X Zhu, H Kotadia, S Xu, H Lu, SH Mannan, C Bailey, YC Chan
Thin Solid Films 565, 193-201, 2014
262014
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