| A holistic approach to thermal-hydraulic design of 3D manifold microchannel heat sinks for energy-efficient cooling D Kong, Y Kim, M Kang, E Song, Y Hong, HS Kim, KJ Rah, HG Choi, ... Case Studies in Thermal Engineering 28, 101583, 2021 | 46 | 2021 |
| An additively manufactured manifold-microchannel heat sink for high-heat flux cooling D Kong, E Jung, Y Kim, VV Manepalli, KJ Rah, HS Kim, Y Hong, HG Choi, ... International Journal of Mechanical Sciences 248, 108228, 2023 | 34 | 2023 |
| Heat transfer performance of water-based electrospray cooling Y Kim, S Jung, S Kim, ST Choi, M Kim, H Lee International Communications in Heat and Mass Transfer 118, 104861, 2020 | 26 | 2020 |
| Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap K Kim, D Kong, Y Kim, B Jang, J Cho, HJ Kwon, H Lee Applied Thermal Engineering 241, 122325, 2024 | 5 | 2024 |
| Guidelines for designing micropillar structures for enhanced evaporative heat transfer K Guye, D Dong, Y Kim, H Lee, B Dogruoz, D Agonafer Journal of Electronic Packaging 143 (4), 041106, 2021 | 2 | 2021 |
