| Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits P Garrou, C Bower, P Ramm John Wiley & Sons, 2008 | 767* | 2008 |
| Method of making a three-dimensional integrated circuit P Ramm, R Buchner US Patent 5,563,084, 1996 | 484 | 1996 |
| Method of making a three-dimensional integrated circuit P Ramm, R Buchner US Patent 5,877,034, 1999 | 217 | 1999 |
| Handbook of Wafer Bonding P Ramm, JJQ Lu, MMV Taklo John Wiley & Sons, 2012 | 166 | 2012 |
| Through silicon via technology—processes and reliability for wafer-level 3D system integration P Ramm, MJ Wolf, A Klumpp, R Wieland, B Wunderle, B Michel, H Reichl 2008 58th Electronic Components and Technology Conference, 841-846, 2008 | 140 | 2008 |
| Three dimensional metallization for vertically integrated circuits: Invited lecture P Ramm, D Bollmann, R Braun, R Buchner, U Cao-Minh, M Engelhardt, ... Microelectronic Engineering 37, 39-47, 1997 | 129 | 1997 |
| Vertical system integration by using inter-chip vias and solid-liquid interdiffusion bonding A Klumpp, R Merkel, P Ramm, J Weber, R Wieland Japanese Journal of Applied Physics 43 (7A), L829, 2004 | 101 | 2004 |
| 3D integration technology: Status and application development P Ramm, A Klumpp, J Weber, N Lietaer, M Taklo, W De Raedt, T Fritzsch, ... 2010 Proceedings of ESSCIRC, 9-16, 2010 | 100 | 2010 |
| Thermo-mechanical reliability of 3D-integrated microstructures in stacked silicon B Wunderle, R Mrossko, O Wittler, E Kaulfersch, P Ramm, B Michel, ... MRS Online Proceedings Library (OPL) 970, 0970-Y02-04, 2006 | 97 | 2006 |
| 3D system integration technologies P Ramm, A Klumpp, R Merkel, J Weber, R Wieland, A Ostmann, J Wolf MRS Online Proceedings Library (OPL) 766, E5. 6, 2003 | 94 | 2003 |
| Energy Autonomous Wearable Sensors for Smart Healthcare: A Review AS Dahiya, J Thireau, J Boudaden, S Lal, U Gulzar, Y Zhang, T Gil, ... Journal of The Electrochemical Society 167, 2020 | 93 | 2020 |
| Thermal analysis of vertically integrated circuits MB Kleiner, SA Kuhn, P Ramm, W Weber Proceedings of International Electron Devices Meeting, 487-490, 1995 | 88 | 1995 |
| Interchip via technology for vertical system integration P Ramm, D Bonfert, H Gieser, J Haufe, F Iberl, A Klumpp, A Kux, ... Proceedings of the IEEE 2001 International Interconnect Technology …, 2001 | 79 | 2001 |
| 3D System-on-Chip technologies for More than Moore systems P Ramm, A Klumpp, J Weber, MMV Taklo Microsystem technologies 16, 1051-1055, 2010 | 77 | 2010 |
| Method of vertically integrating electric components by means of back contacting P Ramm, A Klumpp US Patent 6,548,391, 2003 | 64 | 2003 |
| Method of making a vertical integrated circuit P Ramm, R Buchner US Patent 5,766,984, 1998 | 64 | 1998 |
| Face-to-face chip integration with full metal interface H Hübner, O Ehrmann, M Eigner, W Gruber, A Klumpp, R Merkel, ... Advanced Metallization Conference, San Diego 18, 53-58, 2002 | 63 | 2002 |
| Technologies for 3D wafer level heterogeneous integration MJ Wolf, P Ramm, A Klumpp, H Reichl 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 123-126, 2008 | 60 | 2008 |
| Handbook of 3D Integration, Volume 3: 3D Process Technology P Garrou, M Koyanagi, P Ramm John Wiley & Sons, 2014 | 58 | 2014 |
| Method of vertically integrating microelectronic systems P Ramm US Patent 5,851,894, 1998 | 57 | 1998 |
Maaike Margrete Visser TakloResearch Manager, SINTEF在 sintef.no 的电子邮件经过验证
