| Antenna-integrated, die-embedded glass package for 6G wireless applications X Jia, X Li, K Moon, JW Kim, KQ Huang, MB Jordan, M Swaminathan 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 377-383, 2022 | 14 | 2022 |
| Antenna with embedded die in glass interposer for 6g wireless applications X Jia, X Li, S Erdogan, KS Moon, JW Kim, KQ Huang, MB Jordan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 9 | 2023 |
| Programmable and parallel trapping of submicron/nanoscale particles using acoustic micro‐pillar array chip G Zhang, W Cui, W Pang, S Liu, S Ning, X Li, M Reed Advanced Materials Interfaces 8 (24), 2101334, 2021 | 8 | 2021 |
| Extrapolation with Range Determination of 2D Spectral Transposed Convolutional Neural Network for Advanced Packaging Problems Y Guo, X Jia, X Li, Y Wang, R Kumar, R Sharma, M Swaminathan IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 4 | 2023 |
| Surrogate modeling with complex-valued neural nets and its application to design of sub-THz patch antenna-in-package O Akinwande, OW Bhatti, KQ Huang, X Li, M Swaminathan 2023 IEEE/MTT-S International Microwave Symposium-IMS 2023, 423-426, 2023 | 4 | 2023 |
| Bottom Side Cooling for Glass Interposer with Chip Embedding using Double-sided Release Process for 6G Wireless Applications JW Kim, X Li, X Jia, KS Moon, M Swaminathan 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1609-1613, 2023 | 4 | 2023 |
| Die-embedded glass packaging for 6G wireless applications X Jia, X Li, KS Moon, M Swaminathan MRS Advances 7 (29), 630-634, 2022 | 4 | 2022 |
| GHz Bulk-Acoustic-Wave Resonator Actuated Handheld Ultra-Centrifugal Chip X Li, W Cui, S Liu, G Zhang, X Xu, MA Reed 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems …, 2021 | 3 | 2021 |
| 2D spectral transposed convolutional neural network for S-parameter predictions Y Guo, X Li, M Swaminathan 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging …, 2022 | 2 | 2022 |
| Invertible neural networks for design of Broadband Active Mixers O Akinwande, O Waqar Bhatti, X Li, M Swaminathan Proceedings of the 2022 ACM/IEEE Workshop on Machine Learning for CAD, 145-151, 2022 | 2 | 2022 |
| Design and Characterization of Metalized Trench Based Waveguide Technology on Glass Interposer for 6G Applications X Li, X Jia, S Erdogan, M Jordan, M Swaminathan 2023 IEEE/MTT-S International Microwave Symposium-IMS 2023, 684-687, 2023 | 1 | 2023 |
| Die-Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications X Li, X Jia, JW Kim, KS Moon, MB Jordan, M Swaminathan 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2247-2254, 2023 | 1 | 2023 |
| Design and Characterization of Bandpass Filter with Multiple Zeros on Glass Interposer for 6G Applications X Li, X Jia, S Erdogan, M Swaminathan 2023 IEEE Radio and Wireless Symposium (RWS), 98-100, 2023 | 1 | 2023 |
| Wireless Powered Programable Swimming Robots Driven by Lamb Wave Resonators Y Feng, Z Wang, S Li, X Li, W Cui, W Pang 2021 IEEE International Ultrasonics Symposium (IUS), 1-4, 2021 | 1 | 2021 |
| GHz Bulk Acoustic-Wave Resonator Array Actuated Minimized Collector for High-Efficient E. coli Enrichment X Xu, X Li, S Ning, W Cui, MA Reed 2021 IEEE International Ultrasonics Symposium (IUS), 1-4, 2021 | 1 | 2021 |
| A Low Loss Die-Embedded Glass Substrate for 140 GHz InP Power Amplifier Integration X Jia, X Li, JW Kim, K Moon, MJW Rodwell, M Swaminathan 2024 IEEE/MTT-S International Microwave Symposium-IMS 2024, 402-405, 2024 | | 2024 |
| Package Power Delivery Architecture for High Performance Computing Systems With a 1 kW IVR Operated in CCM-DCM Boundary Mode Condition RR Khorasani, X Li, JW Kim, P Murali, R Sharma, M Swaminathan 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 285-292, 2024 | | 2024 |
| Chip-embedded Glass Interposer for 5G Applications X Li, X Jia, K Moon, JW Kim, A Pandey, A Chiu, A Kenerson, ... 2023 IEEE Radio and Wireless Symposium (RWS), 129-131, 2023 | | 2023 |
| Crosstalk Analysis to GHz Bulk-Acoustic-Wave Array for Addressable Micro/Nanoscale Particle Trapping X Li, W Cui, S Liu, X Xu, MA Reed Journal of Microelectromechanical Systems 31 (1), 158-166, 2021 | | 2021 |
| Performance Deterioration to GHz Bulk-acoustic-wave Resonator Induced by Throughput X Li, X Xu, W Cui, G Zhang, MA Reed 2021 IEEE International Ultrasonics Symposium (IUS), 1-4, 2021 | | 2021 |
Madhavan SwaminathanDept Head EE; William E. Leonhard Endowed Chair; Director CHIMES (an SRC JUMP 2.0 Center) Penn State在 psu.edu 的电子邮件经过验证
