| Microfluidic chip to interface porous microneedles for ISF collection K Takeuchi, N Takama, B Kim, K Sharma, O Paul, P Ruther Biomedical Microdevices 21, 1-10, 2019 | 67 | 2019 |
| Functionalized microneedles for continuous glucose monitoring K Takeuchi, B Kim Nano convergence 5 (1), 28, 2018 | 47 | 2018 |
| Flexible and porous microneedles of PDMS for continuous glucose monitoring K Takeuchi, N Takama, R Kinoshita, T Okitsu, B Kim Biomedical Microdevices 22, 1-12, 2020 | 40 | 2020 |
| Microfluidic chip connected to porous microneedle array for continuous ISF sampling K Takeuchi, N Takama, K Sharma, O Paul, P Ruther, T Suga, B Kim Drug Delivery and Translational Research 12 (2), 435-443, 2022 | 30 | 2022 |
| A novel strategy for GaN-on-diamond device with a high thermal boundary conductance F Mu, B Xu, X Wang, R Gao, S Huang, K Wei, K Takeuchi, X Chen, H Yin, ... Journal of Alloys and Compounds 905, 164076, 2022 | 22 | 2022 |
| Room temperature wafer bonding of glass using aluminum oxide intermediate layer K Takeuchi, F Mu, Y Matsumoto, T Suga Advanced Materials Interfaces 8 (5), 2001741, 2021 | 21 | 2021 |
| Room temperature temporary bonding of glass substrates based on SAB method using Si intermediate layer K Takeuchi, M Fujino, T Suga IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 18 | 2017 |
| Mechanism of bonding and debonding using surface activated bonding method with Si intermediate layer K Takeuchi, M Fujino, Y Matsumoto, T Suga Japanese Journal of Applied Physics 57 (4S), 04FC11, 2018 | 14 | 2018 |
| Quantification of wafer bond strength under controlled atmospheres K Takeuchi, T Suga Japanese Journal of Applied Physics 61 (SF), SF1010, 2022 | 12 | 2022 |
| Sequential plasma activation for low temperature bonding of aluminosilicate glass K Takeuchi, F Mu, A Yamauchi, T Suga ECS Journal of Solid State Science and Technology 10 (5), 054007, 2021 | 12 | 2021 |
| Room temperature bonding and debonding of polyimide film and glass substrate based on surface activate bonding method K Takeuchi, M Fujino, Y Matsumoto, T Suga Japanese Journal of Applied Physics 57 (2S1), 02BB05, 2018 | 8 | 2018 |
| Surface activated bonding of glass wafers using oxide intermediate layer K Takeuchi, F Mu, Y Matsumoto, T Suga 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2024-2029, 2021 | 7 | 2021 |
| Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere Y Meng, Y Xu, R Gao, X Wang, X Chen, S Huang, K Wei, D Wang, H Yin, ... Journal of Materials Science: Materials in Electronics, 1-8, 2022 | 6 | 2022 |
| Porous microneedle integrated in paper based glucose sensor for fluid channel interface H Lee, K Takeuchi, Y Sasaki, N Takama, T Minami, B Kim 2019 IEEE CPMT Symposium Japan (ICSJ), 39-42, 2019 | 6 | 2019 |
| Removal of Adsorbed Water on Si Wafers for Surface Activated Bonding K Takeuchi, E Higurashi, J Wang, A Yamauchi, T Suga 2022 IEEE CPMT Symposium Japan (ICSJ), 61-64, 2022 | 5 | 2022 |
| A porous microneedle array connected to microfluidic system for ISF collection K Takeuchi, N Takama, B Kim, K Sharma, P Ruther, O Paul 2018 IEEE CPMT Symposium Japan (ICSJ), 85-88, 2018 | 5 | 2018 |
| Modified surface activated bonding using Si intermediate layer for bonding and debonding of glass substrates K Takeuchi, M Fujino, T Suga ECS Transactions 75 (9), 185, 2016 | 4 | 2016 |
| Hydrophilic Bonding of SiO2/SiO2 and Cu/Cu using Sequential Plasma Activation K Takeuchi, T Ninomiya, M Kubota, M Kawano, T Takagi, N Masaaki, ... ECS Transactions 112 (3), 95, 2023 | 3 | 2023 |
| Demonstration of high thermal performance GaN-on-graphite composite bonded substrate for application in III-V nitride electronics L Li, T Obata, A Fukui, K Takeuchi, T Suga, A Tanaka, A Wakejima Applied Physics Express 14 (9), 091002, 2021 | 3 | 2021 |
| Low temperature bonding of Cu bump to WBG device using the surface activation method T Suga, K Takeuchi, S Shin, N Martinez, Y Ikeda, A Hirao, M Hori 2021 International Conference on Electronics Packaging (ICEP), 19-20, 2021 | 3 | 2021 |
