| 3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias B Swinnen, W Ruythooren, P De Moor, L Bogaerts, L Carbonell, ... 2006 International Electron Devices Meeting, 1-4, 2006 | 261 | 2006 |
| Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads P Ratchev, S Stoukatch, B Swinnen Microelectronics Reliability 46 (8), 1315-1325, 2006 | 107 | 2006 |
| An autonomous sigfox wireless sensor node for environmental monitoring L Joris, F Dupont, P Laurent, P Bellier, S Stoukatch, JM Redouté IEEE Sensors Letters 3 (7), 01-04, 2019 | 80 | 2019 |
| Droplet formation by squeezing in a microfluidic cross-junction S Van Loo, S Stoukatch, M Kraft, T Gilet Microfluidics and Nanofluidics 20, 1-12, 2016 | 70 | 2016 |
| Simultaneous Cu-Cu and compliant dielectric bonding for 3D stacking of ICs A Jourdain, S Stoukatch, P De Moor, W Ruythooren, S Pargfrieder, ... 2007 IEEE International Interconnect Technology Conferencee, 207-209, 2007 | 62 | 2007 |
| A mass sensor based on 3-DOF mode localized coupled resonator under atmospheric pressure Y Wang, C Zhao, C Wang, D Cerica, M Baijot, Q Xiao, S Stoukatch, ... Sensors and Actuators A: Physical 279, 254-262, 2018 | 60 | 2018 |
| Analysis of the induced stresses in silicon during thermcompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture C Okoro, M Gonzalez, B Vandevelde, B Swinnen, G Eneman, S Stoukatch, ... 2007 Proceedings 57th Electronic Components and Technology Conference, 249-255, 2007 | 57 | 2007 |
| Direct gold and copper wires bonding on copper HM Ho, W Lam, S Stoukatch, P Ratchev, CJ Vath III, E Beyne Microelectronics Reliability 43 (6), 913-923, 2003 | 54 | 2003 |
| Flip-chip assembly of semiconductor devices using adhesives J Vanfleteren, S Stoukatch, B Vandecasteele US Patent 6,555,414, 2003 | 42 | 2003 |
| Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique S Stoukatch, P Laurent, S Dricot, F Axisa, L Seronveaux, D Vandormael, ... 2012 4th Electronic System-Integration Technology Conference, 1-5, 2012 | 38 | 2012 |
| Single-package 5GHz WLAN RF module with embedded patch antenna and 20dBm power amplifier J Ryckaert, S Brebels, B Come, W Diels, D Hauspie, S Stoukatch, ... IEEE MTT-S International Microwave Symposium Digest, 2003 2, 1037-1040, 2003 | 30 | 2003 |
| Characterisation, modelling and design of bond-wire interconnects for chip-package co-design A Chandrasekhar, S Stoukatch, S Brebels, J Balachandran, E Beyne, ... 33rd European Microwave Conference Proceedings (IEEE Cat. No. 03EX723C) 1 …, 2003 | 25 | 2003 |
| 3D-SIP integration for autonomous sensor nodes S Stoukatch, C Winters, E Beyne, W De Raedt, C Van Hoof 56th Electronic Components and Technology Conference 2006, 5 pp., 2006 | 22 | 2006 |
| Wicking through a confined micropillar array B Darbois Texier, P Laurent, S Stoukatch, S Dorbolo Microfluidics and Nanofluidics 20, 1-9, 2016 | 20 | 2016 |
| A reliable and compact polymer-based package for capacitive RF-MEMS switches Y Oya, A Okubora, M Van Spengen, P Soussan, S Stoukatch, ... IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004., 31-34, 2004 | 20 | 2004 |
| Fine pitch copper wire bonding on copper bond pad process optimization KW Lam, HM Ho, S Stoukatch, M Van De Peer, P Ratchev, CJ Vath, ... Proceedings of the 4th International Symposium on Electronic Materials and …, 2002 | 16 | 2002 |
| Electrical characterization of Aerosol Jet Printing (AJP) deposited conductive silver tracks on organic materials P Laurent, S Stoukatch, F Dupont, M Kraft Microelectronic Engineering 197, 67-75, 2018 | 15 | 2018 |
| Miniaturization using 3-D stack structure for SIP applications S Stoukatch, M Ho, K Vaesen, T Webers, G Carchon, W De Raedt, ... | 14 | 2003 |
| RF-MEMS technology platform for agile mobile and satellite communications X Rottenberg, P Soussan, S Stoukatch, P Czarnecki, B Nauwelaers, ... 2006 European Microwave Conference, 1723-1726, 2006 | 13 | 2006 |
| Low-cost microfluidic device micromachining and sequential integration with SAW sensor intended for biomedical applications S Stoukatch, LA Francis, F Dupont, M Kraft Sensors and Actuators A: Physical 319, 112526, 2021 | 12 | 2021 |
Eric BeyneSenior Fellow, VP R&D在 imec.be 的电子邮件经过验证
