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Sergey Belyakov
Sergey Belyakov
Tokamakenergy, UK
在 tokamakenergy.co.uk 的电子邮件经过验证
标题
引用次数
引用次数
年份
Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections
JW Xian, SA Belyakov, M Ollivier, K Nogita, H Yasuda, CM Gourlay
Acta Materialia 126, 540-551, 2017
1002017
Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5 Cu solders
ZL Ma, SA Belyakov, CM Gourlay
Journal of Alloys and Compounds 682, 326-337, 2016
862016
Nucleation of tin on the Cu6Sn5 layer in electronic interconnections
JW Xian, ZL Ma, SA Belyakov, M Ollivier, CM Gourlay
Acta Materialia 123, 404-415, 2017
752017
Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn
JW Xian, G Zeng, SA Belyakov, Q Gu, K Nogita, CM Gourlay
Intermetallics 91, 50-64, 2017
692017
Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections
ZL Ma, SA Belyakov, K Sweatman, T Nishimura, T Nishimura, CM Gourlay
Nature Communications 8 (1), 1916, 2017
672017
Nucleation and growth of tin in Pb-free solder joints
CM Gourlay, SA Belyakov, ZL Ma, JW Xian
Jom 67, 2383-2393, 2015
632015
Heterogeneous nucleation of Cu6Sn5 in Sn–Cu–Al solders
JW Xian, SA Belyakov, TB Britton, CM Gourlay
Journal of Alloys and Compounds 619, 345-355, 2015
592015
Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
MAA Mohd Salleh, SD McDonald, CM Gourlay, SA Belyakov, H Yasuda, ...
Journal of Electronic Materials 45, 154-163, 2016
582016
Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4
SA Belyakov, CM Gourlay
Acta materialia 71, 56-68, 2014
572014
NiSn4 formation during the solidification of Sn–Ni alloys
S Belyakov, C Gourlay
Intermetallics 25, 48-59, 2012
562012
In situ imaging of microstructure formation in electronic interconnections
MAAM Salleh, CM Gourlay, JW Xian, SA Belyakov, H Yasuda, ...
Scientific reports 7 (1), 40010, 2017
552017
Influence of bismuth on the solidification of Sn-0.7 Cu-0.05 Ni-xBi/Cu joints
SA Belyakov, JW Xian, K Sweatman, T Nishimura, T Akaiwa, CM Gourlay
Journal of Alloys and Compounds 701, 321-334, 2017
512017
Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds
ZL Ma, JW Xian, SA Belyakov, CM Gourlay
Acta Materialia 150, 281-294, 2018
482018
AlSi2Sc2 intermetallic formation in Al-7Si-0.3 Mg-xSc alloys and their effects on as-cast properties
P Pandee, CM Gourlay, SA Belyakov, U Patakham, G Zeng, ...
Journal of Alloys and Compounds 731, 1159-1170, 2018
432018
Eutectic morphology of Al-7Si-0.3 Mg alloys with scandium additions
P Pandee, CM Gourlay, SA Belyakov, R Ozaki, H Yasuda, ...
Metallurgical and Materials Transactions A 45, 4549-4560, 2014
392014
Grain refinement of electronic solders: the potential of combining solute with nucleant particles
H Shang, ZL Ma, SA Belyakov, CM Gourlay
Journal of alloys and compounds 715, 471-485, 2017
362017
Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7 Cu-0.05 Ni
JW Xian, MAAM Salleh, SA Belyakov, TC Su, G Zeng, K Nogita, H Yasuda, ...
Intermetallics 102, 34-45, 2018
332018
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
SA Belyakov, J Xian, G Zeng, K Sweatman, T Nishimura, T Akaiwa, ...
Journal of Materials Science: Materials in Electronics 30, 378-390, 2019
292019
Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying
JW Xian, SA Belyakov, CM Gourlay
Journal of Electronic Materials 45, 69-78, 2016
262016
NiSn4 Formation in As-Soldered Ni-Sn and ENIG-Sn Couples
SA Belyakov, CM Gourlay
Journal of electronic materials 41, 3331-3341, 2012
252012
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